Overlay marks, methods of overlay mark design and methods of overlay measurements
    71.
    发明授权
    Overlay marks, methods of overlay mark design and methods of overlay measurements 有权
    叠加标记,叠加标记设计方法和覆盖测量方法

    公开(公告)号:US07181057B2

    公开(公告)日:2007-02-20

    申请号:US10186324

    申请日:2002-06-26

    Abstract: An overlay mark for determining the relative position between two or more successive layers of a substrate or between two or more separately generated patterns on a single layer of a substrate is disclosed. The overlay mark includes a plurality of working zones, which are used to calculate alignment between a first and a second layer of the substrate or between a first and a second pattern on a single layer of the substrate. Each of the working zones is positioned within the perimeter of the mark. Each of the working zones represents a different area of the mark. The working zones are configured to substantially fill the perimeter of the mark such that the combined area of the working zones is substantially equal to the total area of the mark.

    Abstract translation: 公开了用于确定衬底的两个或更多个连续层之间或在衬底的单个层上的两个或更多个单独产生的图案之间的相对位置的覆盖标记。 覆盖标记包括多个工作区,其用于计算衬底的第一层和第二层之间或衬底的单层上的第一和第二图案之间的对准。 每个工作区位于标记的周边。 每个工作区域代表标记的不同区域。 工作区域构造成基本上填满标记的周边,使得工作区域的组合区域基本上等于标记的总面积。

    X-ray imaging for patterned film measurement
    72.
    发明授权
    X-ray imaging for patterned film measurement 有权
    用于图案膜测量的X射线成像

    公开(公告)号:US07166838B1

    公开(公告)日:2007-01-23

    申请号:US11135974

    申请日:2005-05-23

    Applicant: Gary R. Janik

    Inventor: Gary R. Janik

    CPC classification number: G01N23/04

    Abstract: An x-ray metrology system includes an e-beam generator to cause a test sample to emit x-rays, x-ray optics for focusing the x-rays, and an x-ray imager to generate an image of the test sample from the focused x-rays. Because the x-ray imager provides a direct representation of the x-ray emission characteristics of the test sample, the resolution of a measurement taken using such a sensor is limited only by the resolution of the sensor (and any focusing optics), rather than by the amount of e-beam spread in the thin film. The x-ray imaging can be performed for object planes at the test sample that are not parallel to the test sample, thereby allowing vertical dimension data to be accurately generated by the x-ray imaging system.

    Abstract translation: x射线测量系统包括电子束发生器,以使测试样品发射x射线,用于聚焦x射线的x射线光学元件和x射线成像仪,以从 聚焦x射线。 由于x射线成像仪提供了测试样品的x射线发射特性的直接表示,所以使用这种传感器进行测量的分辨率仅受传感器(和任何聚焦光学器件)的分辨率的限制,而不是 通过电子束在薄膜中的传播量。 可以对与测试样品不平行的测试样品的物体平面执行x射线成像,从而允许由x射线成像系统精确地产生垂直尺寸数据。

    Wien filter with reduced chromatic aberration
    73.
    发明授权
    Wien filter with reduced chromatic aberration 有权
    维恩滤镜具有降低的色差

    公开(公告)号:US07164139B1

    公开(公告)日:2007-01-16

    申请号:US11048378

    申请日:2005-02-01

    CPC classification number: H01J37/05 H01J2237/057

    Abstract: One embodiment disclosed relates to a Wien filter for a charged-particle beam apparatus. The charged-particle beam is transmitted through the Wien filter in a first direction. A magnetic field generation mechanism is configured to generate a magnetic field in a second direction which is perpendicular to the first direction, and an electrostatic field generation mechanism is configured to generate an electrostatic field in a third direction which is perpendicular to the first and second directions. The field generation mechanisms are further configured so as to have an offset between the positions of the magnetic and electrostatic fields along the first direction. Another embodiment disclosed relates to a Wien filter type device wherein the magnetic force is approximately twice in strength compared to the electrostatic force. Other embodiments are also disclosed.

    Abstract translation: 公开的一个实施例涉及一种用于带电粒子束装置的维恩滤波器。 带电粒子束在第一方向通过维恩滤波器传输。 磁场产生机构被配置为在与第一方向垂直的第二方向上产生磁场,并且静电场产生机构被配置为在与第一和第二方向垂直的第三方向上产生静电场 。 场产生机构被进一步配置为具有沿着第一方向的磁场和静电场的位置之间的偏移。 所公开的另一实施例涉及一种Wien过滤器型装置,其中与静电力相比,磁力的强度大约是两倍。 还公开了其他实施例。

    Programmable Image Computer
    74.
    发明申请
    Programmable Image Computer 有权
    可编程图像计算机

    公开(公告)号:US20070005284A1

    公开(公告)日:2007-01-04

    申请号:US11530153

    申请日:2006-09-08

    Abstract: An inspection system for detecting anomalies on a substrate. The inspection system has a sensor array for generating image data. A first high speed network is coupled to the sensor array and receives and communicates the image data. An array of process nodes is coupled to the first high speed network, and receives and processes the image data to produce anomaly reports. Each process node has an interface card coupled to the first high speed network, that receives the image data from the first high speed network and formats the image data according to a high speed interface bus protocol. A high speed interface bus is coupled to the interface card, receives the image data from the interface card. A computer is coupled to the high speed interface bus, and receives the image data from the high speed interface bus and processes the image data according to an algorithm, to produce the anomaly report. A second high speed network is coupled to the process nodes, and receives the anomaly reports from the process nodes. A job manager is coupled to the second high speed network, and receives the anomaly reports from the process nodes and sends information to the process nodes to coordinate the processing of the image data in the array of process nodes. An inspection system for detecting anomalies on a substrate. A first network is coupled to a sensor array and communicates data. Process nodes are coupled to the first network and process the data to produce reports. Each process node has an interface card that formats the high speed interface bus that is couples to the interface card. A computer receives and processes the data to produce the report. A second network receives the reports. A job manager is coupled to the second network, receives the reports, and sends information to the process nodes to coordinate processing of the data.

    Abstract translation: 用于检测基板上的异常的检查系统。 检查系统具有用于生成图像数据的传感器阵列。 第一高速网络耦合到传感器阵列并接收并传送图像数据。 一系列过程节点耦合到第一高速网络,并接收和处理图像数据以产生异常报告。 每个处理节点具有耦合到第一高速网络的接口卡,其接收来自第一高速网络的图像数据,并且根据高速接口总线协议格式化图像数据。 高速接口总线耦合到接口卡,从接口卡接收图像数据。 计算机耦合到高速接口总线,并从高速接口总线接收图像数据,并根据算法对图像数据进行处理,以产生异常报告。 第二高速网络耦合到进程节点,并从进程节点接收异常报告。 作业管理器耦合到第二高速网络,并且从进程节点接收异常报告,并向进程节点发送信息以协调处理节点阵列中的图像数据的处理。 用于检测基板上的异常的检查系统。 第一网络耦合到传感器阵列并传送数据。 过程节点耦合到第一个网络并处理数据以产生报告。 每个进程节点都有一个接口卡,格式化耦合到接口卡的高速接口总线。 计算机接收并处理数据以生成报告。 第二个网络接收报告。 作业管理器耦合到第二网络,接收报告,并将信息发送到处理节点以协调数据的处理。

    Method and apparatus for protecting surfaces of optical components
    75.
    发明授权
    Method and apparatus for protecting surfaces of optical components 有权
    保护光学部件表面的方法和装置

    公开(公告)号:US07138640B1

    公开(公告)日:2006-11-21

    申请号:US10688839

    申请日:2003-10-16

    Abstract: The invention pertains to mechanisms for protecting surfaces of optical components of an optical inspection system. One aspect of the invention relates to a gas purge system that produces a gas stream that blocks contaminants from reaching the optical surfaces of the optical components and that transports contaminants away from the optical surfaces of the optical components. Another aspect of the invention relates to a transparent cover that physically blocks contaminants from reaching the optical surfaces of the optical components. Yet another aspect of the invention relates to a combination of the gas purge system and the transparent cover.

    Abstract translation: 本发明涉及用于保护光学检查系统的光学部件的表面的机构。 本发明的一个方面涉及产生气流的气体净化系统,其阻止污染物到达光学部件的光学表面并将污染物从光学部件的光学表面传送出去。 本发明的另一方面涉及一种物理上阻挡污染物到达光学部件的光学表面的透明盖。 本发明的另一方面涉及气体吹扫系统和透明盖的组合。

    Method and apparatus for reviewing voltage contrast defects in semiconductor wafers
    76.
    发明授权
    Method and apparatus for reviewing voltage contrast defects in semiconductor wafers 有权
    用于检查半导体晶片中的电压对比度缺陷的方法和装置

    公开(公告)号:US07132301B1

    公开(公告)日:2006-11-07

    申请号:US10600500

    申请日:2003-06-19

    Inventor: Frank Y. H. Fan

    CPC classification number: H01J37/28 H01J2237/24564 H01J2237/2817

    Abstract: Techniques for identifying, locating, detecting, and reviewing voltage contrast defects are described. A system for implementing the present invention includes a charged particle beam defect review system with one or more installed electron flood guns. In order to review a semiconductor specimen, an entire semiconductor wafer or a sub-region of a wafer is flooded with electrons from the flood gun(s) so that the wafer surface is charged to a certain voltage level. Flooding the specimen greatly enhances the effect of voltage contrast review techniques and therefore manifests voltage contrast defects that would not appear otherwise. The inventive techniques can also be applied so that a review system can be used to inspect at least a portion of a semiconductor wafer. Techniques for controlling the amount of negative charge applied to the specimen are also described.

    Abstract translation: 描述了用于识别,定位,检测和检查电压对比度缺陷的技术。 用于实现本发明的系统包括带有一个或多个安装的电子洪水枪的带电粒子束缺陷评估系统。 为了检查半导体样品,晶片的整个半导体晶片或子区域被来自洪水枪的电子淹没,使得晶片表面被充电到一定的电压水平。 浸渍样品会大大增强电压对比度检查技术的效果,因此表现出不会出现的电压对比度缺陷。 还可以应用本发明的技术,使得可以使用检查系统来检查半导体晶片的至少一部分。 还描述了用于控制施加到样品的负电荷量的技术。

    Simultaneous multi-spot inspection and imaging

    公开(公告)号:US07130039B2

    公开(公告)日:2006-10-31

    申请号:US10418352

    申请日:2003-04-17

    CPC classification number: G01N21/95623 G01N21/8806

    Abstract: A compact and versatile multi-spot inspection imaging system employs an objective for focusing an array of radiation beams to a surface and a second reflective or refractive objective having a large numerical aperture for collecting scattered radiation from the array of illuminated spots. The scattered radiation from each illuminated spot is focused to a corresponding optical fiber channel so that information about a scattering may be conveyed to a corresponding detector in a remote detector array for processing. For patterned surface inspection, a cross-shaped filter is rotated along with the surface to reduce the effects of diffraction by Manhattan geometry. A spatial filter in the shape of an annular aperture may also be employed to reduce scattering from patterns such as arrays on the surface. In another embodiment, different portions of the same objective may be used for focusing the illumination beams onto the surface and for collecting the scattered radiation from the illuminated spots simultaneously. In another embodiment, a one-dimensional array of illumination beams are directed at an oblique angle to the surface to illuminate a line of illuminated spots at an angle to the plane of incidence. Radiation scattered from the spots are collected along directions perpendicular to the line of spots or in a double dark field configuration.

    Sample inspection system
    78.
    发明授权

    公开(公告)号:US07119897B2

    公开(公告)日:2006-10-10

    申请号:US11007729

    申请日:2004-12-07

    CPC classification number: G01N21/956 G01N21/47 G01N21/9501

    Abstract: A curved mirrored surface is used to collect radiation scattered by a sample surface and originating from a normal illumination beam and an oblique illumination beam. The collected radiation is focused to a detector. Scattered radiation originating from the normal and oblique illumination beams may be distinguished by employing radiation at two different wavelengths, by intentionally introducing an offset between the spots illuminated by the two beams or by switching the normal and oblique illumination beams on and off alternately. Beam position error caused by change in sample height may be corrected by detecting specular reflection of an oblique illumination beam and changing the direction of illumination in response thereto. Butterfly-shaped spatial filters may be used in conjunction with curved mirror radiation collectors to restrict detection to certain azimuthal angles.

    Multiple beam inspection apparatus and method

    公开(公告)号:US20060209298A1

    公开(公告)日:2006-09-21

    申请号:US11439621

    申请日:2006-05-23

    CPC classification number: G01N21/8806 G01N21/9501 G01N21/956 G01N2021/95676

    Abstract: Disclosed is an optical inspection system for inspecting the surface of a substrate. The optical inspection system includes a light source for emitting an incident light beam along an optical axis and a first set of optical elements arranged for separating the incident light beam into a plurality of light beams, directing the plurality of light beams to intersect with the surface of the substrate, and focusing the plurality of light beams to a plurality of scanning spots on the surface of the substrate. The inspection system further includes a light detector arrangement including individual light detectors that correspond to individual ones of a plurality of reflected or transmitted light beams caused by the intersection of the plurality of light beams with the surface of the substrate. The light detectors are arranged for sensing the light intensity of either the reflected or transmitted light.

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