Abstract:
A method of state maintenance for a MMC system. The method includes using a plurality of signals, including a working voltage signal, a low voltage detection (LVD) signal, an LVD interrupt signal, a firmware polling signal, an LVD interrupt reset signal. The LVD signal responds to a voltage level of the working voltage at a preset voltage level. The LVD interrupt signal responds to the level of the LVD signal. After the LVD signal returns to the high level state and the firmware polling signal does the polling action to the LVD interrupt signal, then the LVD interrupt reset signal is issued to reset the LVD interrupt signal.
Abstract:
A memory driving circuit has a register for receiving a new-coming data and a delayed clock, and exporting a current-existing data. The delayed clock has a delay to a clock. A pre-detecting circuit receives the current-existing data, the new-coming data, and a pre-enable signal, and exports an output signal. Wherein, the current-existing data is compared with the new-coming data. The output signal indicates a disable state if the two data are the same. Otherwise, the output signal indicates an enable state, wherein the pre-enable signal is also used to enable or disable the pre-detecting circuit. An output driving circuit receives the current-existing data and an enabling signal, and exports a first output signal. A pre-driving circuit receives the output signal of the pre-detecting circuit and an enable control signal, and exports a second output signal. An I/O pad receives the first output signal and the second output signal.
Abstract:
A memory storage device includes a host interface to be connected to a terminal host, a controller connected to the host interface, and a fingerprint sensor and a memory module both connected to the controller. The controller communicates with the terminal host by handshakes and causes the terminal host to automatically run a suitable driver and a suitable application program from the memory module to the terminal host. The terminal host receives an instruction from a user through the driver and the program and informs the controller to control the fingerprint sensor to read to-be-recognized fingerprint data of the user. The terminal host utilizes the application program to process and judge whether or not the to-be-recognized fingerprint data substantially matches with template fingerprint data stored in the memory module, and further enables a specific block of the memory module to be accessed by the terminal host according to a matching result.
Abstract:
The invention provides a MEMS microphone. The MEMS microphone includes a substrate, having a first opening. A dielectric layer is disposed on the substrate, wherein the dielectric layer has a second opening aligned to the first opening. A diaphragm is disposed within the second opening of the dielectric layer, wherein a peripheral region of the diaphragm is embedded into the dielectric layer at sidewall of the second opening. A backplate layer is disposed on the dielectric layer and covering over the second opening. The backplate layer includes a plurality of acoustic holes arranged into a regular array pattern. The regular array pattern comprises a pattern unit, the pattern unit comprises one of the acoustic holes as a center hole, and peripheral holes of the acoustic holes surrounding the center hole with a same pitch to the center hole.
Abstract:
A Micro-Electro-Mechanical Systems (MEMS) device includes a substrate, a dielectric supporting layer, a diaphragm, a backplate. The substrate has a substrate opening corresponding to a diaphragm region. The dielectric supporting layer is disposed on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region. The diaphragm within the dielectric opening is held by the dielectric supporting layer at a periphery. The backplate is disposed on the dielectric supporting layer, having a plurality of venting holes, connecting to the dielectric opening. The backplate includes a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer.
Abstract:
A method to protect an acoustic port of a microelectromechanical system (MEMS) microphone is provided. The method includes: providing the MEMS microphone; and forming a protection film, on the acoustic port of the MEMS microphone. The protection film has a porous region over the acoustic port to receive an acoustic signal but resist at least an intruding material. The protection film can at least endure a processing temperature of solder flow.
Abstract:
A MEMS device includes substrate having a cavity. A dielectric layer is disposed on a second side of substrate at periphery of the cavity. A backplate structure is formed with the dielectric layer on a first side of the substrate and exposed by the cavity. The backplate structure includes at least a first backplate and a second backplate. The first backplate and the second backplate are electric disconnected and have venting holes to connect the cavity and the chamber. A diaphragm is disposed above the backplate structure by a distance, so as to form a chamber between the backplate structure and the diaphragm. A periphery of the diaphragm is embedded in the dielectric layer. The diaphragm serves as a common electrode. The first backplate and the second backplate respectively serve as a first electrode unit and a second electrode unit in conjugation with the diaphragm to form separate two capacitors.
Abstract:
A MEMS structure includes a substrate, a structural dielectric layer, and a diaphragm. A structural dielectric layer is disposed over the substrate. The diaphragm is held by the structural dielectric layer at a peripheral end. The diaphragm includes multiple trench/ridge rings at a peripheral region surrounding a central region of the diaphragm. A corrugated structure is located at the central region of the diaphragm, surrounded by the trench/indent rings.
Abstract:
A MEMS structure includes a substrate, a structural dielectric layer, and a diaphragm. A structural dielectric layer is disposed over the substrate. The diaphragm is held by the structural dielectric layer at a peripheral end. The diaphragm includes multiple trench/ridge rings at a peripheral region surrounding a central region of the diaphragm. A corrugated structure is located at the central region of the diaphragm, surrounded by the trench/indent rings.
Abstract:
A method for fabricating the MEMS device includes providing a substrate. Then, a structural dielectric layer is formed over the substrate at a first side, wherein a diaphragm is embedded in the structural dielectric layer. The substrate is patterned from a second side to form a cavity in corresponding to the diaphragm and a plurality of venting holes in the substrate. An isotropic etching process is performed from the first side and the second side of the substrate via vent holes to remove a dielectric portion of the structural dielectric layer for exposing a central portion of the diaphragm while an end portion is held by a residue portion of the structural dielectric layer.