摘要:
A hot melt adhesive composition that includes thermoplastic polyamide, adhesion promoter that includes at least one acid group, and wax having a melting point greater than 82° C.
摘要:
Biocompatible macromer compositions are provided including an isocyanate-functional polyalkylene oxide combined with at least one multi-functional isocyanate as a first component, and a multi-amino functional compound possessing multiple primary amines as a second component. The isocyanate-functional polyalkylene oxide has pendant polyalkylene oxide groups. The resulting biocompatible macromer composition can be employed as an adhesive or sealant for medical/surgical uses.
摘要:
An adhesive film for semiconductor, which comprises at least one resin layer, and, after bonded to a lead frame, has at 25° C. a 90°-peel strength of at least 5 N/m between the resin layer and the lead frame, and, after a lead frame is bonded to the adhesive film for semiconductor and sealed with a sealing material, has at least at one point of temperatures ranging from 0 to 250° C. a 90°-peel strength of at most 1000 N/m between the resin layer and each of the lead frame and the sealing material; a lead frame and a semiconductor device using the adhesive film for semiconductor; and a method of producing a semiconductor device.
摘要:
The present invention relates to a moisture or water activatable tape or string useful for reinforcing and/or for tear tape opening systems for various corrugated and cartonstock containers.
摘要:
A hot melt adhesive composition that includes thermoplastic polyamide, adhesion promoter that includes at least one acid group, and wax having a melting point greater than 82° C.
摘要:
An adhesive film for semiconductor, which comprises at least one resin layer, and, after bonded to a lead frame, has at 25null C. a 90null-peel strength of at least 5 N/m between the resin layer and the lead frame, and, after a lead frame is bonded to the adhesive film for semiconductor and sealed with a sealing material, has at least at one point of temperatures ranging from 0 to 250null C a 90null-peel strength of at most 1000 N/m between the resin layer and each of the lead frame and the sealing material; a lead frame and a semiconductor device using the adhesive film for semiconductor; and a method of producing a semiconductor device.
摘要翻译:一种用于半导体的粘合膜,其包括至少一个树脂层,并且在引线框架结合之后具有25℃,树脂层和引线框架之间的90°剥离强度为至少5N / m 并且在将引线框架结合到半导体用粘合膜并用密封材料密封之后,至少在0-250℃的温度的一个点处,至多1000N / m的90°剥离强度 在树脂层与引线框架和密封材料之间; 引线框架和使用半导体用粘合膜的半导体器件; 以及半导体器件的制造方法。
摘要:
An adhesive film for semiconductor, which comprises at least one resin layer, and, after bonded to a lead frame, has at 25° C. a 90°-peel strength of at least 5 N/m between the resin layer and the lead frame, and, after a lead frame is bonded to the adhesive film for semiconductor and sealed with a sealing material, has at least at one point of temperatures ranging from 0 to 250° C. a 90°-peel strength of at most 1000 N/m between the resin layer and each of the lead frame and the sealing material; a lead frame and a semiconductor device using the adhesive film for semiconductor; and a method of producing a semiconductor device.
摘要翻译:一种用于半导体的粘合膜,其包括至少一个树脂层,并且在引线框架结合之后具有25℃,树脂层和引线框架之间的90°剥离强度为至少5N / m 并且在将引线框架结合到用于半导体的粘合剂膜并用密封材料密封之后,至少在0-250℃的温度的一个点处,90°的强度为至多1000N / 树脂层和引线框架和密封材料中的每一个之间; 引线框架和使用半导体用粘合膜的半导体器件; 以及半导体器件的制造方法。
摘要:
This invention relates to an aqueous dispersion of (a) from 0.5 to 99.5 weight percent of a fluoropolymer having an average particle size of from 0.01 to 30 microns; and (b) from 0.5 to 99.5 weight percent of an ethylene copolymer which comprises at least 50% by weight ethylene, 1-35% by weight of an acid-containing unsaturated mono-carboxylic acid, and optionally 0-49% by weight of a moiety selected from at least one of alkyl acrylate, alkyl methacrylate, vinyl ether, carbon monoxide and sulfur dioxide, and further wherein the acid groups are neutralized from 0-100% by a metal ion or other cations, the weight percents being based on the total amounts of (a) and (b) only. The invention also relates to a coprecipate of this aqueous dispersion and a dry powder made by drying the aqueous dispersion or coprecipitate.
摘要:
Copolyamides, consisting of polycondensation products of the following components: caprolactam 10 to 45 mol-%, laurolactam 30 to 55 mol-%, at least 2 dicarboxylic acids 20 to 50 mol-% of the following compounds, aliphatic null,null-dicarboxylic acids with 6 up to 14 C atoms inclusively, terephthalic acid, isophthalic acid and 2,6-naphthalene dicarboxylic acid, wherein the content of aromatic dicarboxylic acids is lower than 10 mol-%, with reference to the allover amount of the above-mentioned components, which add up to 100 mol-%, a diamine mixture in an amount that is equimolar to that of the dicarboxylic acids, chosen from the group of the following substances, hexamethylene diamine, piperazine and/or 2-methyl- 1,5-diaminopentane, wherein the molar content of hexa-methylene diamine is between 75 and 95 mol-% with reference to the diamine mixture. The copolyamides according to the invention are used for the production of mono- and multifilaments, fibers, films and nets.
摘要:
A crosslinkable hot-melt adhesive composition, comprising a reactive powder mixed with a crosslinking component of a crosslinking agent bound in a polyolefin matrix, wherewith the components of the composition do not react by crosslinking until the mixture is melted, said composition being useful for the coating and/or lamination of sheet-like structures.