公开(公告)号：US09150760B2

公开(公告)日：2015-10-06

申请号：US14129716

申请日：2012-09-07

申请人： Kenji Ohata ,  Youichi Inao

发明人： Kenji Ohata ,  Youichi Inao

IPC分类号： C09J7/02 ,  C09J11/06 ,  C09J133/00 ,  C09J175/04 ,  C08G18/73 ,  C08G18/10 ,  C08G18/48

CPC分类号： C09J7/02 ,  C08G18/10 ,  C08G18/48 ,  C08G18/4825 ,  C08G18/73 ,  C08L33/08 ,  C09J7/22 ,  C09J11/06 ,  C09J133/00 ,  C09J175/04 ,  C09J2201/622 ,  C09J2433/00 ,  C09J2461/006 ,  C09J2475/00 ,  C09J2477/006 ,  C09J2479/086 ,  C09J2481/006 ,  Y10T428/24975 ,  C08G18/3206 ,  C08G18/8022

摘要： Provided is a flame retardant adhesive sheet having an adhesive agent layer on at least one surface of a base material, which even when the adhesive agent layer does not contain a flame retardant agent, has both excellent flame retardant properties and adhesive properties. The present invention is concerned with a flame retardant adhesive sheet including an adhesive agent layer on at least one surface of abase material, wherein the base material has flame retardant properties adapted to VTM-0 in a test according to the UL94 standard; a thickness per surface of the adhesive agent layer is 0.6 μm or more, and a total thickness of the adhesive agent layer is not more than 2.2 μm; the adhesive agent constituting the adhesive agent layer does not contain a flame retardant agent but contains (A) an acrylic copolymer and (B) a specified urethane resin.

摘要翻译： 提供一种在基材的至少一个表面上具有粘合剂层的阻燃性粘合片，其即使在粘合剂层不含有阻燃剂的情况下也具有优异的阻燃性和粘合性。 本发明涉及在耐磨材料的至少一个表面上包含粘合剂层的阻燃性粘合片，其中所述基材在根据UL94标准的试验中具有适用于VTM-0的阻燃性能; 粘合剂层的表面的厚度为0.6μm以上，粘接剂层的总厚度为2.2μm以下。 构成粘合剂层的粘合剂不含阻燃剂，但含有（A）丙烯酸共聚物和（B）特定的聚氨酯树脂。

公开(公告)号：US20040161620A1

公开(公告)日：2004-08-19

申请号：US10755954

申请日：2004-01-13

申请人： Toray Industries, Inc.

发明人： Shotaro Tanaka ,  Tatsuro Tsuchimoto ,  Takashi Mimura ,  Junpei Ohashi

IPC分类号： B32B027/00 ,  B32B027/06 ,  B32B027/28 ,  B32B027/36

CPC分类号： H05K1/036 ,  B32B27/36 ,  C08J7/04 ,  C08J7/045 ,  C08J2329/04 ,  C09J7/29 ,  C09J2201/162 ,  C09J2461/006 ,  C09J2467/006 ,  C09J2477/006 ,  C09J2479/086 ,  C09J2481/006 ,  C09K21/00 ,  H01B3/421 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2203/124 ,  Y10T428/31721 ,  Y10T428/31736 ,  Y10T428/31786

摘要： The present invention is a flame-retardant polyester film including resin layers laminated on both surfaces of a polyester film, wherein the resin layer satisfies 15null(Wc1nullWc2)/Wc0null100null99 (where Wc0 represents the weight of the resin layer, Wc1 represents the weight of the resin layer after the temperature thereof is raised from 25null C. to 600null C. in air, and Wc2 represents the weight of the resin layer after the temperature thereof is raised from 25null C. to 800null C. in air), and has a non-flammable gas generating rate of 3 to 40 percent over the range of 180null C. to 450null C. The present invention provides a flame-retardant polyester film having an excellent flame retardancy, and adhesive tapes, flexible printed circuits, a membrane switch, a film heater, and a flat cable, each including the flame-retardant polyester film.

摘要翻译： 本发明是一种阻燃聚酯膜，其包括层压在聚酯膜的两面上的树脂层，其中树脂层满足15 <=（WC1-Wc2）/ Wc0×100 <= 99（WHERE WC0表示树脂层的重量 Wc1表示在空气中将温度从25℃升温至600℃后的树脂层的重量，Wc2表示在温度从25℃升温至800℃后树脂层的重量 ℃），在180℃〜450℃的范围内具有3〜40％的不燃性气体发生率。本发明提供阻燃聚酯膜，其阻燃性优异， 和胶带，柔性印刷电路，薄膜开关，薄膜加热器和扁平电缆，各自包括阻燃聚酯薄膜。

公开(公告)号：US20190203075A1

公开(公告)日：2019-07-04

申请号：US16332818

申请日：2017-09-19

申请人： Zephyros, Inc.

发明人： Michael Czaplicki ,  Ken Mazich ,  Yuan Lu ,  Kevin Hicks ,  Austin O'Connor ,  Jason Walker

IPC分类号： C09J5/04 ,  C09J5/06 ,  C09J135/02 ,  C09J135/04 ,  C08J5/12

CPC分类号： C09J5/04 ,  B32B27/12 ,  C08J5/124 ,  C08J5/128 ,  C08J2327/14 ,  C08J2361/06 ,  C08J2433/04 ,  C08J2435/02 ,  C08J2435/04 ,  C09J5/06 ,  C09J135/02 ,  C09J135/04 ,  C09J2427/006 ,  C09J2427/008 ,  C09J2433/00 ,  C09J2461/006 ,  C09J2461/008

摘要： The present teachings contemplate a method comprising providing a first and second substrate, locating an initiator onto a surface of the first or second substrate, the initiator including a substance for initiating polymerization of a polymerizable adhesive, locating the polymerizable adhesive onto a surface of the first and second substrate, the adhesive including a monofunctional, difunctional, or multifunctional methylene malonate, or cyanoacrylate, and contacting first and second substrate.

公开(公告)号：US07479412B2

公开(公告)日：2009-01-20

申请号：US12099238

申请日：2008-04-08

申请人： Toshiyasu Kawai ,  Hidekazu Matsuura

发明人： Toshiyasu Kawai ,  Hidekazu Matsuura

IPC分类号： H01L21/00

CPC分类号： H01L23/49513 ,  C09J7/10 ,  C09J7/22 ,  C09J7/35 ,  C09J177/00 ,  C09J179/08 ,  C09J2461/006 ,  C09J2467/006 ,  C09J2477/006 ,  C09J2479/08 ,  C09J2479/086 ,  C09J2481/006 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/83801 ,  H01L2224/97 ,  H01L2924/09701 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3511 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/28 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An adhesive film for semiconductor, which comprises at least one resin layer, and, after bonded to a lead frame, has at 25° C. a 90°-peel strength of at least 5 N/m between the resin layer and the lead frame, and, after a lead frame is bonded to the adhesive film for semiconductor and sealed with a sealing material, has at least at one point of temperatures ranging from 0 to 250° C. a 90°-peel strength of at most 1000 N/m between the resin layer and each of the lead frame and the sealing material; a lead frame and a semiconductor device using the adhesive film for semiconductor; and a method of producing a semiconductor device.

摘要翻译： 一种用于半导体的粘合膜，其包括至少一个树脂层，并且在引线框架结合之后具有25℃，树脂层和引线框架之间的90°剥离强度为至少5N / m 并且在将引线框架结合到用于半导体的粘合剂膜并用密封材料密封之后，至少在0-250℃的温度的一个点处，90°的强度为至多1000N / 树脂层和引线框架和密封材料中的每一个之间; 引线框架和使用半导体用粘合膜的半导体器件; 以及半导体器件的制造方法。

公开(公告)号：US20060093810A1

公开(公告)日：2006-05-04

申请号：US10516063

申请日：2003-05-29

申请人： Gary Blake ,  Stephen Ashton

发明人： Gary Blake ,  Stephen Ashton

IPC分类号： B32B27/40 ,  B32B27/36 ,  B32B27/32 ,  B29C71/04

CPC分类号： C08J3/28 ,  B32B7/12 ,  B32B17/10018 ,  B32B27/16 ,  B32B27/36 ,  B32B2307/558 ,  B32B2307/584 ,  B32B2551/00 ,  B32B2571/00 ,  C09J7/22 ,  C09J7/25 ,  C09J7/29 ,  C09J2201/162 ,  C09J2423/006 ,  C09J2461/006 ,  C09J2467/006 ,  C09J2475/006 ,  C09J2483/006 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/31551 ,  Y10T428/31663 ,  Y10T428/31786 ,  Y10T428/31938

摘要： A laminated film (10) for application to a substrate (30) comprises at least a base layer (12), formed from an organic polymer, and an adhesive layer (16). Gamma or electron beam irradiation is applied at least to the base layer (12) to modify the polymer structure thereof, thereby strengthening the laminated film (10) and the substrate (30) to which it is applied. Glass substrates to which the laminated product is applied demonstrate improved fragment retention in the event of an impact.

摘要翻译： 用于施加到基板（30）的层压膜（10）至少包括由有机聚合物形成的基底层（12）和粘合剂层（16）。 至少向基底层（12）施加γ或电子束照射，以改变其聚合物结构，从而加强其所施加的层压膜（10）和基底（30）。 施加层压产品的玻璃基材在冲击的情况下表现出改善的片段保留性。

公开(公告)号：US08211268B1

公开(公告)日：2012-07-03

申请号：US12661388

申请日：2010-03-16

申请人： Venkatkrishna Raghavendran ,  Ryan W. Johnson ,  Pradip Bahukudumbi ,  Kirkland W. Vogt

发明人： Venkatkrishna Raghavendran ,  Ryan W. Johnson ,  Pradip Bahukudumbi ,  Kirkland W. Vogt

IPC分类号： B32B27/00 ,  B29C65/00

CPC分类号： B32B27/08 ,  B29C65/02 ,  B29C65/4815 ,  B29C65/4835 ,  B29C65/5014 ,  B29C65/5021 ,  B29C65/5057 ,  B29C66/1122 ,  B29C66/45 ,  B29C66/71 ,  B29C66/712 ,  B29C66/7212 ,  B29C66/72141 ,  B29C66/72143 ,  B29C66/7392 ,  B29C66/7394 ,  B29C66/81455 ,  B29C70/06 ,  B32B7/12 ,  B32B27/30 ,  B32B27/38 ,  B32B27/42 ,  B32B2262/00 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2270/00 ,  C08J5/128 ,  C08J2323/00 ,  C08J2361/00 ,  C08J2363/00 ,  C08J2423/00 ,  C09J5/06 ,  C09J2423/00 ,  C09J2423/006 ,  C09J2461/006 ,  C09J2463/006 ,  G01N3/20 ,  B29K2063/00 ,  B29K2307/04 ,  B29K2309/08 ,  B29K2277/10 ,  B29K2301/12 ,  B29K2077/00 ,  B29K2075/00 ,  B29K2067/003 ,  B29K2061/04 ,  B29K2031/00 ,  B29K2023/00

摘要： A process for simultaneously consolidating to form a fiber reinforced thermoplastic and thermoset structural element that contain, in order; a fiber reinforced thermoplastic member, a tie layer, and a fiber reinforced thermoset member. The fiber reinforced thermoplastic member, contains multiple layers of fibers and a thermoplastic matrix at least partially surrounding the fibers. The fiber reinforced thermoset member contains multiple layers of fibers and a thermoset matrix at least partially surrounding the fibers. The tie layer contains a first polymer and a second polymer.

摘要翻译： 一种同时固结以形成纤维增强热塑性和热固性结构元素的方法，其按顺序包含; 纤维增强热塑性构件，粘结层和纤维增强热固性构件。 纤维增强热塑性构件包含多层纤维和至少部分地围绕纤维的热塑性基质。 纤维增强热固性构件包含多层纤维和至少部分地围绕纤维的热固性基质。 连接层包含第一聚合物和第二聚合物。

公开(公告)号：US20080194062A1

公开(公告)日：2008-08-14

申请号：US12099238

申请日：2008-04-08

申请人： Toshiyasu KAWAI ,  Hidekazu Matsuura

发明人： Toshiyasu KAWAI ,  Hidekazu Matsuura

IPC分类号： H01L21/60

CPC分类号： H01L23/49513 ,  C09J7/10 ,  C09J7/22 ,  C09J7/35 ,  C09J177/00 ,  C09J179/08 ,  C09J2461/006 ,  C09J2467/006 ,  C09J2477/006 ,  C09J2479/08 ,  C09J2479/086 ,  C09J2481/006 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/83801 ,  H01L2224/97 ,  H01L2924/09701 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3511 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/28 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An adhesive film for semiconductor, which comprises at least one resin layer, and, after bonded to a lead frame, has at 25° C. a 90°-peel strength of at least 5 N/m between the resin layer and the lead frame, and, after a lead frame is bonded to the adhesive film for semiconductor and sealed with a sealing material, has at least at one point of temperatures ranging from 0 to 250° C. a 90°-peel strength of at most 1000 N/m between the resin layer and each of the lead frame and the sealing material; a lead frame and a semiconductor device using the adhesive film for semiconductor; and a method of producing a semiconductor device.

摘要翻译： 一种用于半导体的粘合膜，其包括至少一个树脂层，并且在引线框架结合之后具有25℃，树脂层和引线框架之间的90°剥离强度为至少5N / m 并且在将引线框架结合到用于半导体的粘合剂膜并用密封材料密封之后，至少在0-250℃的温度的一个点处，90°的强度为至多1000N / 树脂层和引线框架和密封材料中的每一个之间; 引线框架和使用半导体用粘合膜的半导体器件; 以及半导体器件的制造方法。

公开(公告)号：US20030180505A1

公开(公告)日：2003-09-25

申请号：US10378240

申请日：2003-03-03

发明人： Hidetoshi Abe ,  Hideto Endoh

IPC分类号： B32B003/00

CPC分类号： G03G7/0086 ,  B32B27/40 ,  B41M5/504 ,  B41M5/52 ,  B41M5/5272 ,  B41M5/5281 ,  B41M7/0027 ,  C08G18/4277 ,  C08G18/44 ,  C08L61/00 ,  C09D175/06 ,  C09J7/25 ,  C09J7/29 ,  C09J2201/162 ,  C09J2201/28 ,  C09J2461/006 ,  C09J2475/006 ,  Y10T428/24612 ,  Y10T428/24901 ,  Y10T428/2848 ,  C08L2666/14

摘要： To provide a marking film, which has good resistance to petroleum and moisture and is suitable as a marking film of a vehicle that moves using a petroleum fuel. A marking film comprising a receptor film having a front colorant-receptive surface, and a back surface, and an adhesive layer provided on the back surface of the receptor film and comprising an adhesive which serves to adhere the receptor film to an adherend, wherein the adhesive layer has projections containing the adhesive, which are formed on an adhesion surface to be adhered to the adherend, and depressions surrounding the projections, and the depressions define conduits, which communicate with the atmosphere, between the surface of the adherend and the adhesion surface of the adhesive layer when the adhesive layer is being adhered to the adherend, characterized in that the receptor film comprises a receptor layer formed of a thermoplastic resin film having a surface which serves as the colorant-receptive surface, and the thermoplastic resin film comprises a resinous component containing at least one petroleum-resistant resin selected from the group consisting of polyurethane comprising polyol units derived from polycarbonate polyol, polyurethane comprising polyol units derived from polycaprolactone polyol and phenoxy resins.

摘要翻译： 提供具有良好的耐石油和水分的标记膜，并且适合作为使用石油燃料移动的车辆的标记膜。 一种标记膜，其包括具有前着色剂接收表面的接收膜和背面，以及设置在接收膜的背面上的粘合剂层，并且包括用于将受体膜粘附到被粘物上的粘合剂，其中， 粘合剂层具有包含粘合剂的突起，其形成在粘合表面上以粘合到被粘物上，并且凹陷围绕突起，并且凹陷限定了与被粘附物的表面和粘附表面之间的大气连通的导管 所述粘合剂层粘合到所述被粘物上时，所述粘合剂层的特征在于，所述受体膜包括由具有作为着色剂接受表面的表面的热塑性树脂膜形成的受体层，所述热塑性树脂膜包含 含有至少一种选自聚氨酯组合物的耐油树脂的树脂组分 衍生自聚碳酸酯多元醇的上升多元醇单元，包含衍生自聚己内酯多元醇的多元醇单元的聚氨酯和苯氧树脂。

公开(公告)号：US07081288B2

公开(公告)日：2006-07-25

申请号：US10626013

申请日：2003-07-24

申请人： Liping Guo ,  Scott H. Kogler

发明人： Liping Guo ,  Scott H. Kogler

IPC分类号： B32B9/00

CPC分类号： C09J7/25 ,  C09J2461/006 ,  C09J2467/006 ,  H05K1/0266 ,  Y10S428/922 ,  Y10T428/14 ,  Y10T428/1405 ,  Y10T428/1438 ,  Y10T428/1452 ,  Y10T428/1462 ,  Y10T428/2843 ,  Y10T428/2848

摘要： A heat resistant label stock comprised of an unsupported cast face sheet layer, an adhesive layer and a release liner characterized by a face sheet, an adhesive layer and a release liner. The label stock is generally tamper-evident in that removal destroys or damages the label. In certain embodiments the label stock is electrostatic dissipative.

摘要翻译： 一种耐热标签原料，由无支撑的铸面板层，粘合剂层和剥离衬垫构成，其特征在于：面板，粘合剂层和剥离衬垫。 标签库存通常是显而易见的，因为拆卸会破坏或损坏标签。 在某些实施方案中，标签原料是静电耗散的。

公开(公告)号：US07057266B2

公开(公告)日：2006-06-06

申请号：US10734124

申请日：2003-12-15

申请人： Toshiyasu Kawai ,  Hidekazu Matsuura

发明人： Toshiyasu Kawai ,  Hidekazu Matsuura

IPC分类号： H01L23/495

CPC分类号： H01L23/49513 ,  C09J7/10 ,  C09J7/22 ,  C09J7/35 ,  C09J177/00 ,  C09J179/08 ,  C09J2461/006 ,  C09J2467/006 ,  C09J2477/006 ,  C09J2479/08 ,  C09J2479/086 ,  C09J2481/006 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/83801 ,  H01L2224/97 ,  H01L2924/09701 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3511 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/28 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An adhesive film for semiconductor, which comprises at least one resin layer, and, after bonded to a lead frame, has at 25° C. a 90°-peel strength of at least 5 N/m between the resin layer and the lead frame, and, after a lead frame is bonded to the adhesive film for semiconductor and sealed with a sealing material, has at least at one point of temperatures ranging from 0 to 250° C. a 90°-peel strength of at most 1000 N/m between the resin layer and each of the lead frame and the sealing material; a lead frame and a semiconductor device using the adhesive film for semiconductor; and a method of producing a semiconductor device.