公开(公告)号：US20140268581A1

公开(公告)日：2014-09-18

申请号：US14289335

申请日：2014-05-28

Applicant: YAZAKI CORPORATION

Inventor： Akira HARAO ,  Mototatsu MATSUNAGA ,  Yasuhiro SUGIURA ,  Minoru KUBOTA

IPC: H05K1/02

CPC classification number: H05K1/0204 ,  H01L23/49861 ,  H01L2224/05571 ,  H01L2224/48091 ,  H01L2225/1094 ,  H01R12/728 ,  H05K1/0203 ,  H05K1/05 ,  H05K1/056 ,  H05K1/11 ,  H05K1/14 ,  H05K3/10 ,  H05K3/202 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/1046 ,  H05K2201/09009 ,  H05K2201/09063 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2203/025 ,  Y10T29/49147 ,  Y10T29/49155

Abstract: Disclosed is a wiring substrate and method of manufacturing thereof, the wiring substrate including: a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a connection terminal extended from the substrate and bending in a direction that is perpendicular to a surface of the substrate; and a heat radiation piece section integrally installed to the connection terminal.

Abstract translation: 公开了一种布线基板及其制造方法，所述布线基板包括：具有高导热层的基板，其中所述基板的前表面和后表面中的至少一个是用于各种部件的安装表面 ; 连接端子，从所述基板延伸并且在垂直于所述基板的表面的方向上弯曲; 以及一体地安装在连接端子上的散热片部分。