公开(公告)号：US09027249B2

公开(公告)日：2015-05-12

申请号：US13703137

申请日：2010-06-10

Applicant: Holger Schmitt ,  Daniel Meister ,  Roman Lewandowski ,  Andrzej Broniszewski

Inventor： Holger Schmitt ,  Daniel Meister ,  Roman Lewandowski ,  Andrzej Broniszewski

IPC: C22C9/00 ,  B23P15/00 ,  C22C1/04 ,  C22C9/02 ,  F16C33/12

CPC classification number: B23P15/003 ,  C22C1/0425 ,  C22C9/02 ,  F16C33/121 ,  F16C33/14 ,  F16C2204/10 ,  F16C2204/12 ,  Y02T10/865 ,  Y10T29/49709

Abstract: In a method for producing a lead-free sliding bearing, a copper-based material comprising a total of 0.1% to 3% of the elements aluminum, magnesium, silicon, titanium, zircon, and chromium is sintered. Additionally, up to 15% tin can be included in order to ensure optimal properties for use in the internal combustion engine.

Abstract translation: 在无铅滑动轴承的制造方法中，烧结含有铝，镁，硅，钛，锆石和铬的总量为0.1％〜3％的铜基材料。 另外，最多可以包含15％的锡，以确保在内燃机中使用最佳性能。

公开(公告)号：US20150107726A1

公开(公告)日：2015-04-23

申请号：US14583894

申请日：2014-12-29

Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)

Inventor： Yasuhiro ARUGA ,  Katsura Kajihara ,  Takeshi Kudo

IPC: C22F1/08 ,  B22D21/02 ,  C22C9/00 ,  C22C9/05 ,  C22C9/04 ,  C22C9/02

CPC classification number: C22F1/08 ,  B21B2003/005 ,  B22D11/004 ,  B22D21/025 ,  C22C1/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/05 ,  C22C9/06

Abstract: The present invention provides a Cu—Fe—P alloy which has a high strength, high conductivity and superior bending workability. The copper alloy comprises 0.01 to 1.0% Fe, 0.01 to 0.4% P, 0.1 to 1.0% Mg, and the remainder Cu and unavoidable impurities. The size of oxides and precipitates including Mg in the copper alloy is controlled so that the ratio of the amount of Mg measured by a specified measurement method in the extracted residue by a specified extracted residue method to the Mg content in said copper alloy is 60% or less, thus endowing the alloy with a high strength and superior bending workability.

Abstract translation: 本发明提供了具有高强度，高导电性和优异的弯曲加工性的Cu-Fe-P合金。 铜合金含有0.01〜1.0％的Fe，0.01〜0.4％的P，0.1〜1.0％的Mg，余量为Cu和不可避免的杂质。 控制铜合金中包含Mg的氧化物和析出物的大小，使得通过规定的提取残渣法，通过规定的测定方法测定的Mg量与所述铜合金中的Mg含量之比为60％ 以下，从而赋予合金高强度和优异的弯曲加工性。

公开(公告)号：US08940404B2

公开(公告)日：2015-01-27

申请号：US13746512

申请日：2013-01-22

Applicant: Mitsubishi Materials Corporation

Inventor： Yuki Taninouchi ,  Naoki Kato ,  Kenji Kubota

IPC: B32B15/20 ,  H01R13/03 ,  C25D5/50 ,  B32B15/01 ,  C25D5/12 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/06 ,  C25D3/12 ,  C25D3/30 ,  C25D3/38

CPC classification number: B32B15/01 ,  B32B15/20 ,  C22C1/0483 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/06 ,  C25D3/12 ,  C25D3/30 ,  C25D3/38 ,  C25D5/12 ,  C25D5/505 ,  H01R13/03 ,  Y10S428/929 ,  Y10S428/939 ,  Y10S428/941 ,  Y10T428/12063 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/1291

Abstract: Tin-plated copper-alloy material for terminal having: a substrate made of Cu or Cu alloy; an Sn-based surface layer formed on a surface of the substrate; and a Cu—Ni—Sn alloy layer including Ni formed between the Sn-based surface layer and the substrate, in which the Cu—Ni—Sn alloy layer is made of: fine Cu—Ni—Sn alloy particles; and coarse Cu—Ni—Sn alloy particles, an average thickness of the Sn-based surface layer is not less than 0.2 μm and not more than 0.6 μm, an area ratio of the Cu—Ni—Sn alloy layer exposed at a surface of the Sn-based surface layer is not less than 10% and not more than 40%, and a coefficient of kinetic friction of the tin-plated copper-alloy material for terminal is not more than 0.3.

Abstract translation: 用于端子的镀锡铜合金材料：具有由Cu或Cu合金制成的基板; 形成在所述基板的表面上的Sn系表面层; 以及Cu-Ni-Sn合金层，其中，所述Cu-Ni-Sn合金层包括形成在所述Sn基表面层和所述基板之间的Ni，其中所述Cu-Ni-Sn合金层由细小的Cu-Ni-Sn合金粒子构成; 和粗Cu-Ni-Sn合金粒子，Sn系表面层的平均厚度为0.2μm以上且0.6μm以下，Cu-Ni-Sn合金层的表面露出面积比 Sn系表面层为10％以上且40％以下，终端用镀锡铜合金材料的动摩擦系数为0.3以下。

公开(公告)号：US08834747B2

公开(公告)日：2014-09-16

申请号：US13040207

申请日：2011-03-03

Applicant: Alfred A. Zinn

Inventor： Alfred A. Zinn

IPC: H01B1/02 ,  H01B1/22 ,  B22F1/00 ,  B22F3/00 ,  B22F1/02 ,  B22F9/00 ,  C21B3/02 ,  C21B5/02 ,  C21B7/06 ,  C21B15/04 ,  C21C5/02 ,  C21C7/04 ,  C22B7/04 ,  C22B9/10 ,  C22B5/20 ,  C22C1/06 ,  C22C1/04 ,  C22C7/00 ,  C22C9/02 ,  C22C9/06 ,  C22C11/00 ,  C22C12/00 ,  C22C13/00 ,  C22C20/00 ,  C22C21/00 ,  C22C24/00 ,  C22C25/00 ,  C22C28/00 ,  C22F1/16 ,  B23K35/26 ,  H05K1/09 ,  B22F9/24

CPC classification number: H01B1/22 ,  B22F1/0018 ,  B22F1/0062 ,  B22F9/24 ,  B23K35/262 ,  C01P2004/62 ,  C01P2004/64 ,  C22F1/16 ,  H05K1/092 ,  Y10S977/773 ,  Y10S977/777

Abstract: Compositions containing tin nanoparticles and electrically conductive particles are described herein. The tin nanoparticles can have a size below about 25 nm so as to make the compositions fusable at temperatures below that of bulk tin (m.p.=232° C.). Particularly, when the tin nanoparticles are less than about 10 nm in size, the compositions can have a fusion temperature of less than about 200° C. The compositions can contain a whisker suppressant to inhibit or substantially minimize the formation of tin whiskers after tin nanoparticle fusion. In some embodiments, the compositions contain tin nanoparticles, electrically conductive particles comprising copper particles, and a whisker suppressant comprising nickel particles. Methods for using the present compositions are also described herein. The present compositions can be used as a lead solder replacement that allows rework to be performed.

Abstract translation: 本文描述了含有锡纳米颗粒和导电颗粒的组合物。 锡纳米颗粒可以具有低于约25nm的尺寸，以使组合物在低于体积锡的温度（m.p. = 232℃）下熔化。 特别地，当锡纳米颗粒的尺寸小于约10nm时，组合物可以具有小于约200℃的熔化温度。组合物可以含有晶须抑制剂以抑制或基本上最小化锡纳米颗粒之后的锡晶须的形成 融合。 在一些实施方案中，组合物含有锡纳米颗粒，包含铜颗粒的导电颗粒和包含镍颗粒的晶须抑制剂。 本文还描述了使用本发明组合物的方法。 本发明的组合物可以用作允许返工进行的铅焊料替代物。

公开(公告)号：US08795446B2

公开(公告)日：2014-08-05

申请号：US13091688

申请日：2011-04-21

Applicant: Hiroshi Kaneko ,  Kiyoshige Hirose ,  Tatsuhiko Eguchi

Inventor： Hiroshi Kaneko ,  Kiyoshige Hirose ,  Tatsuhiko Eguchi

IPC: C22C9/02 ,  C22F1/08

CPC classification number: H01B1/026 ,  C22C9/06 ,  C22C9/10 ,  C22F1/00 ,  C22F1/08 ,  H01B13/0016

Abstract: A copper alloy material, having an alloy composition containing any one or both of Ni and Co in an amount of 0.4 to 5.0 mass % in total, and Si in an amount of 0.1 to 1.5 mass %, with the balance being copper and unavoidable impurities, wherein a ratio of an area of grains in which an angle of orientation deviated from S-orientation {2 3 1} is within 30° is 60 % or more, according to a crystal orientation analysis in EBSD measurement; an electrical or electronic part formed by working the copper alloy material; and a method of producing the copper alloy material.

Abstract translation: 一种铜合金材料，其合金组成含有总量为0.4〜5.0质量％的Ni和Co中的任一种或两者，Si为0.1〜1.5质量％，余量为铜和不可避免的杂质 其中，根据EBSD测定中的晶体取向分析，其中取向于S取向{2 3 1} <3 4 6>的取向角在30°以内的晶粒面积的比率为60％以上。 通过加工铜合金材料形成的电气或电子部件; 以及铜合金材料的制造方法。

公开(公告)号：US08784580B2

公开(公告)日：2014-07-22

申请号：US12523070

申请日：2008-02-14

Applicant: Akira Fugono ,  Hiroshi Sakamoto

Inventor： Akira Fugono ,  Hiroshi Sakamoto

IPC: C22C9/06 ,  C22C9/10 ,  C22C9/02 ,  C22C9/04 ,  C22F1/08

CPC classification number: C22F1/08 ,  C22C9/06 ,  C22F1/00

Abstract: Disclosed is a Cu—Ni—Si copper alloy sheet that excels in strength and formability and is used in electrical and electronic components. The copper alloy sheet contains, by mass, 1.5% to 4.5% Ni and 0.3% to 1.0% of Si and optionally contains at least one member selected from 0.01% to 1.3% of Sn, 0.005% to 0.2% of Mg, 0.01% to 5% of Zn, 0.01% to 0.5% of Mn, and 0.001% to 0.3% of Cr, with the remainder being copper and inevitable impurities. The average size of crystal grains is 10 μm or less, the standard deviation σ of crystal grain size satisfies the condition: 2σ

Abstract translation: 公开了一种在强度和成形性方面优异并用于电气和电子部件的Cu-Ni-Si铜合金板。 铜合金板以质量计含有1.5％〜4.5％的Ni和0.3％〜1.0％的Si，并且任选地含有选自Sn的0.01〜1.3％，Mg：0.005〜0.2％，0.01％ 至5％的Zn，0.01％至0.5％的Mn和0.001％至0.3％的Cr，其余为铜和不可避免的杂质。 晶粒的平均尺寸为10μm以下，标准偏差＆sgr; 的晶粒尺寸满足条件：2＆lt;＆lt;10μm，并且位于晶界上并且具有30至300nm的晶粒尺寸的分散沉淀物的数量为每毫米500以上。

公开(公告)号：US20130264040A1

公开(公告)日：2013-10-10

申请号：US13913915

申请日：2013-06-10

Applicant: Luvata Espoo Oy

Inventor： M. Parker Finney ,  Larz Ignberg ,  Claes Anders Kamf ,  Timothy L. Goebel ,  Ying Gong ,  Edward G. Rottmann

IPC: F28F1/00 ,  C22C9/00 ,  C22C9/02

Abstract: Alloys comprising copper, iron, tin and, optionally, phosphorus or copper, zinc, tin and, optionally, phosphorus, which can be used in, for example, a copper alloy tube for heat exchangers that provides excellent fracture strength and processability for reducing the weight of the tube and for use in high pressure applications with cooling media such as carbon dioxide.

Abstract translation: 包括铜，铁，锡和任选的磷或铜，锌，锡和任选的磷的合金，其可以用于例如用于热交换器的铜合金管，其提供优异的断裂强度和加工性以减少 管的重量并用于具有诸如二氧化碳的冷却介质的高压应用中。

公开(公告)号：US20130045130A1

公开(公告)日：2013-02-21

申请号：US13491942

申请日：2012-06-08

Applicant: Yasuhiro ARUGA ,  Akira FUGONO ,  Takeshi KUDO ,  Katsura KAJIHARA

Inventor： Yasuhiro ARUGA ,  Akira FUGONO ,  Takeshi KUDO ,  Katsura KAJIHARA

IPC: C22C9/06 ,  C22C9/04 ,  C22C9/02 ,  C22C9/10

CPC classification number: H01B1/026 ,  C22C1/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/06 ,  C22C9/10 ,  C22F1/00 ,  C22F1/08 ,  H01H1/025

Abstract: The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer.

Abstract translation: 本发明涉及一种具有高强度，高导电性和优异的弯曲性的铜合金，铜合金以质量％计含有0.4〜4.0％的Ni; 0.05〜1.0％的Si; 作为元素M，选自0.005〜0.5％的P，0.005〜1.0％的Cr和0.005〜1.0％的Ti，其余为铜和不可避免的杂质，其中原子数比M / 在铜合金的组织中，尺寸为50〜200nm的析出物中含有的元素M和Si的Si平均为0.01〜10，原子数比通过场致发射透射电子显微镜测定，放大率 30,000和能量色散分析仪。

公开(公告)号：US08349097B2

公开(公告)日：2013-01-08

申请号：US12561980

申请日：2009-09-17

Applicant: Wen Lin Lo ,  Xiao Rong Fang

Inventor： Wen Lin Lo ,  Xiao Rong Fang

IPC: C22C9/02

CPC classification number: C22C9/04 ,  B22D7/005 ,  C22F1/08

Abstract: A dezincification-resistant copper alloy and a method for producing a product containing the same are proposed by the present invention. The dezincification-resistant alloy of the present invention contains 59.5 to 64 wt % of copper (Cu); 0.1 to 0.5 wt % of bismuth (Bi); 0.08 to 0.16 wt % of arsenic (As); 5 to 15 ppm of boron (B); 0.3 to 1.5 wt % of tin (Sn); 0.1 to 0.7 wt % of zirconium (Zr); less than 0.05 wt % of lead (Pb); and zinc (Zn) in balance. The dezincification-resistant copper alloy of the present invention has excellent casting properties, good toughness and machinability, and can be corrosion-resistant. Thus, the alloy can reduce dezincification on the surfaces.

Abstract translation: 本发明提出了一种耐脱锌铜合金及其制备方法。 本发明的脱锌化合金含有铜（Cu）59.5〜64重量％。 0.1〜0.5重量％的铋（Bi）; 0.08〜0.16重量％的砷（As）; 5至15ppm的硼（B）; 0.3〜1.5重量％的锡（Sn）; 0.1〜0.7重量％的锆（Zr）; 小于0.05重量％的铅（Pb）; 和锌（锌）。 本发明的耐脱锌铜合金具有优异的铸造性能，良好的韧性和可加工性，并且可以耐腐蚀。 因此，合金可以减少表面上的脱锌。

公开(公告)号：US20120294754A1

公开(公告)日：2012-11-22

申请号：US13522530

申请日：2011-01-06

Applicant: Kazunari Maki ,  Yuki Ito

Inventor： Kazunari Maki ,  Yuki Ito

IPC: C22C9/02 ,  C22C9/04 ,  C22C9/01

CPC classification number: H01B1/026 ,  C22C9/00 ,  C22C9/01 ,  C22C9/02 ,  C22C9/04 ,  C22C9/05 ,  C22C9/06 ,  C22F1/02 ,  C22F1/08 ,  H01L23/49579 ,  H01L2924/0002 ,  H01L2924/00

Abstract: This copper alloy with high strength and high electrical conductivity includes: Mg: more than 1.0% by mass to less than 4% by mass; and Sn: more than 0.1% by mass to less than 5% by mass, with a remainder including Cu and inevitable impurities, wherein a mass ratio Mg/Sn of a content of Mg to a content of Sn is in a range of 0.4 or more. This copper alloy with high strength and high electrical conductivity may further include Ni: more than 0.1% by mass to less than 7% by mass.

Abstract translation: 这种具有高强度和高导电性的铜合金包括：Mg：大于1.0质量％至小于4质量％; 和Sn：大于0.1质量％至小于5质量％，余量包括Cu和不可避免的杂质，其中Mg含量与Sn含量之间的质量比Mg / Sn在0.4的范围内，或者 更多。 这种具有高强度和高导电性的铜合金可以进一步包括Ni：大于0.1质量％至小于7质量％。