公开(公告)号：US20240297260A1

公开(公告)日：2024-09-05

申请号：US18534074

申请日：2023-12-08

申请人： Melexis Technologies NV

发明人： Rachel GLEESON ,  Luc BUYDENS

IPC分类号： H01L31/0203 ,  H01L23/26 ,  H01L31/18

CPC分类号： H01L31/0203 ,  H01L23/26 ,  H01L31/18

摘要： A method of manufacturing a sensor device (100) comprises forming (200) a substrate (102) comprising a sensor element followed by forming (202) a cap layer (104). The cap layer (104) is then bonded (204) to the substrate (102) before the substrate (102) is thinned (206). A via is formed (210) between the sensor element and a back side of the thinned substrate (102). An electrical connection is provided between the sensor element and the back side of the thinned substrate (102). A mask is formed (208) on the cap layer (104) to define an area about a predetermined window region (108) before forming (210) of the via. A portion of the cap layer (104) about the predetermined window region (108) of the cap layer (104) is removed (212) after formation (210) of the via.

公开(公告)号：US20240194707A1

公开(公告)日：2024-06-13

申请号：US18530100

申请日：2023-12-05

申请人： DRS Network & Imaging Systems, LLC

发明人： Thomas Schimert ,  Kuni Shimizu

IPC分类号： H01L27/146 ,  H01L23/26

CPC分类号： H01L27/14618 ,  H01L23/26 ,  H01L27/14683

摘要： Methods and systems utilizing an enhanced area getter architecture for wafer-level vacuum packaged, uncooled focal plane array (FPA) assembly are disclosed. The FPA assembly includes a device die having a first device surface, an infrared detector array disposed on the first device surface, an infrared reference pixel disposed on the first device surface, and a window die bonded to the device die. The window die includes a recess and comprises a first die surface that overlies the infrared detector array, a second die surface that overlies the infrared reference pixel, and a die wall surface joining the first die surface and the second die surface. The die wall surface forms a perimeter of the recess and a getter material is disposed on at least one of the die wall surface or the first die surface.

公开(公告)号：US20240162102A1

公开(公告)日：2024-05-16

申请号：US18545120

申请日：2023-12-19

申请人： ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.

发明人： Rajesh Katkar ,  Liang Wang

IPC分类号： H01L23/26 ,  B81B7/00 ,  B81C3/00 ,  H01L21/322 ,  H01L23/00 ,  H01L23/04 ,  H01L23/10

CPC分类号： H01L23/26 ,  B81B7/0038 ,  B81C3/001 ,  H01L21/3221 ,  H01L23/04 ,  H01L23/10 ,  H01L24/03 ,  H01L24/09

摘要： A bonded structure is disclosed. The bonded structure can include a first element that has a first bonding surface. The bonded structure can further include a second element that has a second bonding surface. The first and second bonding surfaces are bonded to one another along a bonding interface. The bonded structure can also include an integrated device that is coupled to or formed with the first element or the second element. The bonded structure can further include a channel that is disposed along the bonding interface around the integrated device to define an effectively closed profile The bonded structure can also include a getter material that is disposed in the channel. The getter material is configured to reduce the diffusion of gas into an interior region of the bonded structure.

公开(公告)号：US11764117B2

公开(公告)日：2023-09-19

申请号：US17043561

申请日：2019-04-02

申请人： CORNING INCORPORATED

发明人： Robert Alan Bellman ,  Jin Su Kim

IPC分类号： H01L23/053 ,  B32B3/30 ,  B32B17/06 ,  B81B7/00 ,  B81C1/00 ,  C03C15/00 ,  H01L21/52 ,  H01L23/04 ,  H01L23/26 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/48 ,  H01L23/10 ,  H01L23/08

CPC分类号： H01L23/053 ,  B32B3/30 ,  B32B17/06 ,  B81B7/0038 ,  B81B7/0067 ,  B81C1/00317 ,  C03C15/00 ,  H01L21/52 ,  H01L23/041 ,  H01L23/08 ,  H01L23/10 ,  H01L23/26 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/483 ,  B32B2315/08 ,  B32B2457/14 ,  B81C2203/0109 ,  H01L2933/0033

摘要： Wafer level encapsulated packages includes a wafer, a glass substrate hermetically sealed to the wafer, and an electronic component. The glass substrate includes a glass cladding layer fused to a glass core layer and a cavity formed in the glass substrate. The electronic component is encapsulated within the cavity. In various embodiments, the floor of the cavity is planar and substantially parallel to a plane defined by a top surface of the glass cladding layer. The glass cladding layer has a higher etch rate in an etchant than the glass core layer. In various embodiments, the wafer level encapsulated package is substantially optically transparent. Methods for forming the wafer level encapsulated package and electronic devices formed from the wafer level encapsulated package are also described.

公开(公告)号：US20230123544A1

公开(公告)日：2023-04-20

申请号：US17913956

申请日：2021-04-08

申请人： LYNRED

发明人： Sylvain Lemettre

IPC分类号： B81B7/00 ,  H01L23/26

摘要： A method of manufacturing a microelectromechanical system includes forming of an electromechanical element on a substrate. The method further includes preparation of an encapsulation package to form a sealed cavity integrating the electromechanical element, with the sealed cavity having a volume smaller than 10 mm3. The method includes physical vapor deposition of a getter film on the substrate or on a wall of the encapsulation package so that the getter film has a specific absorption surface area smaller than 8 m2/g, and sealing of the encapsulation package on the substrate by means of a thermal sealing cycle having a temperature enabling to activate said getter film.

公开(公告)号：US11569181B2

公开(公告)日：2023-01-31

申请号：US17113032

申请日：2020-12-05

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Sushumna Iruvanti ,  Shidong Li ,  Steve Ostrander ,  Jon Alfred Casey ,  Brian Richard Sundlof

IPC分类号： H01L23/00 ,  H01L21/02 ,  H01L23/26 ,  H01L21/768

摘要： Moisture-driven degradation of a crack stop in a semiconductor die is mitigated by forming a groove in an upper surface of the die between an edge of the die and the crack stop; entirely filling the groove with a moisture barrier material; preventing moisture penetration of the semiconductor die by presence of the moisture barrier material; and dissipating mechanical stress in the moisture barrier material without presenting a stress riser in the bulk portion of the die. The moisture barrier material is at least one of moisture-absorbing, moisture adsorbing, and hydrophobic.

公开(公告)号：US11482693B2

公开(公告)日：2022-10-25

申请号：US17043881

申请日：2020-04-14

申请人： BOE TECHNOLOGY GROUP CO., LTD.

发明人： Chengyuan Luo

IPC分类号： H01L51/00 ,  H01L51/50 ,  H01L51/52 ,  H01L27/32 ,  H01L23/26 ,  H01L23/28 ,  H01L23/00

摘要： An electroluminescent device, includes: a base substrate; a light emitting unit provided on the base substrate; a first accommodating structure surrounding the light emitting unit and provided on the base substrate; a first color rendering material filled in the first accommodating structure; a first inorganic thin film encapsulation layer covering the light emitting unit and the first color rendering material; a second accommodating structure provided on one side of the first inorganic thin film encapsulation layer distal to the first color rendering material; a second color rendering material filled in the second accommodating structure; and a second inorganic thin film encapsulation layer sealing the second color rendering material in the second accommodating structure; wherein the first color rendering material and the second color rendering material are capable of producing a color development reaction after mixture.

公开(公告)号：US11094911B2

公开(公告)日：2021-08-17

申请号：US16309450

申请日：2018-09-12

申请人： Wuhan China Star Optoelectronics Technology Co., Ltd.

发明人： Yeqing Wu

IPC分类号： H01L51/52 ,  H01L27/32 ,  H01L51/56 ,  H01L23/26 ,  H01L23/00

摘要： Provided are an organic light emitting diode display panel and packaging method thereof. The organic light emitting diode display panel is provided with an adhesive layer on a passivation layer corresponding to a position of a sealant. When packaging the organic light emitting diode, the sealant on a cover plate is adhered corresponding to a position of the adhesive layer. The adhesive layer has a good bonding force with the sealant and also has a good bonding force with the passivation layer. Thus, water vapor does not easily enter the organic light emitting diode element, which will not reduce the performance of the organic light emitting diode element to improve a service life of organic light emitting diode element and to possess a good reliability performance.

公开(公告)号：US10937665B2

公开(公告)日：2021-03-02

申请号：US16327713

申请日：2016-09-30

申请人： Intel Corporation

发明人： Aaron D. Lilak ,  Harold W. Kennel ,  Patrick Morrow ,  Rishabh Mehandru ,  Stephen M. Cea

IPC分类号： H01L21/322 ,  H01L21/265 ,  H01L21/768 ,  H01L21/38 ,  H01L21/70 ,  H01L23/26

摘要： Methods and apparatus for gettering impurities in semiconductors are disclosed. A disclosed example multilayered die includes a substrate material, a component layer below the substrate material, and an impurity attractant region disposed in the substrate material.

公开(公告)号：US10892233B2

公开(公告)日：2021-01-12

申请号：US16177100

申请日：2018-10-31

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Sushumna Iruvanti ,  Shidong Li ,  Steve Ostrander ,  Jon Alfred Casey ,  Brian Richard Sundlof

IPC分类号： H01L23/00 ,  H01L21/02 ,  H01L23/26 ,  H01L21/768

摘要： Moisture-driven degradation of a crack stop in a semiconductor die is mitigated by forming a groove in an upper surface of the die between an edge of the die and the crack stop; entirely filling the groove with a moisture barrier material; preventing moisture penetration of the semiconductor die by presence of the moisture barrier material; and dissipating mechanical stress in the moisture barrier material without presenting a stress riser in the bulk portion of the die. The moisture barrier material is at least one of moisture-absorbing, moisture adsorbing, and hydrophobic.