摘要:
A semiconductor memory device and method of performing a stress test on a semiconductor memory device are provided. In an example, the semiconductor memory device includes a multiplexer arrangement configured to switch a timing signal that controls an internal timing of the semiconductor memory device from an internal signal to an external signal during a stress mode, and further includes one or more word lines of the semiconductor memory device receiving a stress voltage during the stress mode, a duration of the stress mode based upon the external signal. In another example, the semiconductor memory device includes one or more word lines configured to receive a stress voltage during a stress mode, and a precharge circuit configured to provide a precharge voltage to a bit line of the semiconductor memory device during the stress mode.
摘要:
A procedure is provided for identifying an operating mode of a device, such as an EEPROM memory that communicates according to a communication protocol, such as “I2C” (Inter Integrated Circuit). The signal is an “ACK” or “ACKNOWLEDGE” signal. At least one operating mode of a device is identified by a time lag from the time the signal (ACK) is transmitted relative to the time foreseen by the protocol for the signal. This approach can be used to verify that the test mode commands (read or write) have been taken into account correctly.
摘要:
A semiconductor device and a method of testing the semiconductor device are provided. The semiconductor device includes a memory cell array, a sense amplifier, a control circuit, a row decoder, a bitline-pair voltage setting circuit, and a wordline driver. The memory cell array is connected to one of a plurality of wordlines and a plurality of bitline pairs. The memory cell array comprises a plurality of memory cells, wherein each memory cell is connected to one of the plurality of wordlines and the plurality of bitline pairs. The sense amplifier amplifies data read from the memory cell array. The control circuit controls writing/reading of data to/from the memory cell array. The row decoder decodes an address signal and outputs a decoded signal to select one of the plurality of wordlines. The bitline-pair voltage setting circuit sets the voltage of at least one of the plurality of bitline pairs to a bitline test voltage in a test mode. The wordline driver sets the low-level voltages of the plurality of wordlines to a wordline test voltage in the test mode. The wordline test voltage level can be set to be different from the low-level voltage of the plurality of wordlines in a normal operation mode.
摘要:
First dummy memory cells connected to a first dummy signal line have the same shape and characteristics as those of a real memory cell. The first dummy memory cells are arranged to be adjacent to outermost real memory cells. A voltage setting circuit changes the voltage of the first dummy signal line from a first voltage to a second voltage in order to write test data onto the first dummy memory cell during a test mode. By writing data of a logic opposite to that of the test data onto the real memory cell adjacent to the first dummy memory cell by means of an operation control circuit, a leak failure that may occur between the first dummy memory cell and the real memory cell adjacent thereto can be checked.
摘要:
An apparatus for testing a defect, includes a semiconductor element. In the semiconductor element, a conductive film is formed on an STI (shallow trench isolation) insulating film, which fills a shallow trench extending into a semiconductor region, through an insulating film in an ordinary state, and the shallow trench is not completely or sufficiently filled with the STI insulating film in a defective state. Also, the apparatus includes a control circuit configured to set a test mode in response to a test mode designation signal, a first voltage applying circuit configured to output a first voltage to the conductive film in the test mode, and a second voltage applying circuit configured to output a second voltage to the semiconductor region in the test mode. The first voltage is higher than the second voltage, and a voltage difference between the first voltage and the second voltage is sufficient to cause breakdown between the conductive film and the semiconductor region in the defective state.
摘要:
In a burn-in test, a sense amplifier circuit is separated from each bit line by a bit line separation switch. In this state, a bit line switch circuit connects one of complementary bit lines to a first voltage node, and connects the other complementary bit line to a second voltage node in blocks on both sides. A first bit line voltage supplied by the first voltage node and a second bit line voltage supplied by the second voltage node can be set independently of each other at least in the burn-in test.
摘要:
A semiconductor memory device includes a memory cell block composed of a memory cell unit having memory cells each containing a ferroelectric capacitor, and a test memory cell unit having test memory cells. The layout pattern of the test memory cells is identical to the layout pattern of the memory cells. The test memory cell unit is arranged close to a memory cell of a plurality of memory cells which is at a position where the ferroelectric capacitor is susceptible to degradation. The memory cell unit and test memory cell unit are subjected to a first cycling test consisting of N1 cycles. Then, the test memory cell unit is subjected to a second cycling test consisting of N2 cycles. The sum (N1+N2) of the number of cycles in the first and second cycling tests equals an assurance number of cycles T, where N1
摘要翻译:半导体存储器件包括由具有各自含有铁电电容器的存储单元的存储单元单元和具有测试存储单元的测试存储单元组成的存储单元块。 测试存储单元的布局模式与存储器单元的布局模式相同。 测试存储单元单元布置在靠近强电介质电容器容易劣化的位置的多个存储单元的存储单元附近。 对存储单元单元和测试存储单元单元进行由N 1个循环组成的第一循环测试。 然后,对测试存储单元单元进行由N 2个循环组成的第二循环测试。 第一循环和第二次循环试验中的循环次数的总和(N N 1 N N N N N 2 N)等于循环T的保证数,其中N 1 < / SUB> SUB>。
摘要:
An internal power supply potential generation circuit includes an overcharge prevention circuit connected to an internal power supply node. The overcharge prevention circuit includes a circuit outputting a signal to be determined that is determined by an internal power supply potential, a differential amplification circuit amplifying a difference in potential between the signal to be determined and a reference potential for output to a node as a signal indicating that current should be drawn, and a current draw circuit drawing current from the internal power supply node in response to the signal indicating that current should be drawn. Thus the semiconductor integrated circuit device of interest can provide a steady internal power supply potential.
摘要:
A semiconductor memory device having a burn-in test capability. The semiconductor memory device includes a detection circuit, which is connected to the plurality of word lines. The detection circuit detects whether a stress voltage for a burn-in test has been applied to all of the word lines along their entire lengths in the burn-in test.
摘要:
A semiconductor storage device contains a row redundancy cell array in which redundancy cells are arranged in connection with redundancy word lines respectively and a memory cell array in which memory cells are arranged in connection with word lines respectively. In a normal operation mode, the word lines are sequentially activated in response to input addresses, so that stored information is read out from each of the memory cells of the memory cell array. If an input address coincides with a defective word line address designating a word line being connected with a defective memory cell within the memory cell array, a redundancy word line is selectively activated as a replacement of the word line which is inhibited from being activated, so that stored information is read out from each of the redundancy cells connected with the redundancy word line. In a burn-in test mode, the redundancy word lines and word lines are collectively activated and are subjected to stress, so that a burn-in test is performed on the redundancy cells and memory cells collectively. Thus, it is possible to reduce the time required for the burn-in test in manufacture. In a defectiveness test mode, the redundancy word lines are sequentially activated and are subjected to stress, so that a defectiveness test is performed to check each of the redundancy cells in quality.