公开(公告)号：US20080251769A1

公开(公告)日：2008-10-16

申请号：US11841408

申请日：2007-08-20

申请人： Gang Li ,  Xiangping Zou ,  Sanjay Gurbasappa Charati ,  Soumyadeb Ghosh

发明人： Gang Li ,  Xiangping Zou ,  Sanjay Gurbasappa Charati ,  Soumyadeb Ghosh

IPC分类号： H01B1/16

CPC分类号： H01B1/22 ,  C08K7/04 ,  C08K7/06 ,  C08K7/14 ,  C08K9/02

摘要： Disclosed herein too is a method of manufacturing an electrically conducting polymeric composition comprising blending an organic polymer composition that comprises a thermoplastic organic polymer; an electrically conducting filler composition that comprises metal fibers; and an electrically insulating composition in an extruder; wherein the electrically insulating composition is fed into the extruder downstream of the location at which the organic polymer composition is fed into the extruder and wherein the electrically conducting filler composition is fed into the extruder at a location downstream of the location at which the electrically insulating composition is fed into the extruder.

摘要翻译： 本文还公开了一种制造导电聚合物组合物的方法，包括共混包含热塑性有机聚合物的有机聚合物组合物; 包含金属纤维的导电填料组合物; 和挤出机中的电绝缘组合物; 其中所述电绝缘组合物在所述有机聚合物组合物进料到所述挤出机中的位置下游进料到所述挤出机中，并且其中所述导电填料组合物在所述电绝缘组合物的位置下游的位置进料到所述挤出机中 进料到挤出机中。

公开(公告)号：US20050106369A1

公开(公告)日：2005-05-19

申请号：US10967986

申请日：2004-10-19

申请人： Yueli Wang ,  Christopher Needes ,  Patricia Ollivier

发明人： Yueli Wang ,  Christopher Needes ,  Patricia Ollivier

IPC分类号： H01B1/22 ,  C09D5/24 ,  H01B1/16 ,  H01L23/498 ,  H05K1/09 ,  B32B1/00

CPC分类号： H01B1/16 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

摘要： A thick film composition consisting essentially of: a) electrically conductive powder; b) an inorganic binder wherein the inorganic binder is selected from TiO2 and any compounds that can generate TiO2 during firing; and c) an organic medium.

摘要翻译： 厚膜组合物，其基本上由以下组成：a）导电粉末; b）无机粘合剂，其中无机粘合剂选自TiO 2和任何在焙烧过程中可产生TiO 2的化合物; 和c）有机介质。

公开(公告)号：US06866800B2

公开(公告)日：2005-03-15

申请号：US10414109

申请日：2003-04-16

申请人： Fumiya Adachi

发明人： Fumiya Adachi

IPC分类号： B60J1/20 ,  H01B1/16 ,  H01B1/22 ,  B05D5/12

CPC分类号： C03C8/18 ,  H01B1/16

摘要： A conductive paste which can form an electrode having a sufficient solder-wetability, exhibiting sufficient bonding strength, and having a high specific resistance is provided. The conductive paste contains a silver powdery material, glass frit and an organic vehicle. The silver powdery material contains at least about 50% by weight of a high crystalline silver powdery material with a particle size of about 4.5 μm to 7 μm and a crystal size of about 10 nm or more.

摘要翻译： 提供能够形成具有足够的焊料润湿性，显示出足够的接合强度并且具有高电阻率的电极的导电膏。 导电浆料含有银粉状材料，玻璃料和有机载体。 银粉状材料含有至少约50重量％的粒度约4.5μm至7μm，晶体尺寸约10nm或更大的高结晶银粉末材料。

公开(公告)号：US6141846A

公开(公告)日：2000-11-07

申请号：US879126

申请日：1997-06-19

申请人： Hisashi Miki

发明人： Hisashi Miki

IPC分类号： H01G4/12 ,  H01B1/16 ,  H01B1/22 ,  H01G4/008 ,  H01G4/30

CPC分类号： H01G4/0085 ,  Y10T29/435

摘要： Thin, smooth conductive layers for internal electrodes of multilayer ceramic capacitors are produced by a method including the steps of forming a conductive paste layer on a green ceramic sheet with a conductive paste by screen printing so as to have a center-line mean roughness of not more than 1.0 .mu.m, a ten-point mean roughness of not more than 5.0 .mu.m and a thickness of metal in the dried conductive paste layer of 0.5 to 2.0 .mu.m. The conductive paste consists essentially of 50 to 70% of an organic vehicle and 30 to 50% of a metal powder with a particle size range of 0.1 to 1.5 .mu.m and a mean particle size of 0.3 to 1.0 .mu.m.

摘要翻译： 通过包括以下步骤的方法制造薄层的多层陶瓷电容器的内部电极的导电层，该方法包括以下步骤：通过丝网印刷在导电浆料的生坯陶瓷片上形成导电浆料层，以使中心线的平均粗糙度不为 超过1.0μm，十点平均粗糙度不大于5.0μm，干燥导电浆料层中的金属厚度为0.5-2.0μm。 导电糊基本上由50〜70％的有机载体和30〜50％的粒度范围为0.1〜1.5μm，平均粒径为0.3〜1.0μm的金属粉末组成。

公开(公告)号：US6120884A

公开(公告)日：2000-09-19

申请号：US43571

申请日：1998-05-12

申请人： Katsuhiko Igarashi ,  Hidenori Ohata ,  Takahide Kurahashi ,  Kazuaki Suzuki

发明人： Katsuhiko Igarashi ,  Hidenori Ohata ,  Takahide Kurahashi ,  Kazuaki Suzuki

IPC分类号： H01B1/16 ,  H01L23/13 ,  H01L23/498 ,  H05K1/09 ,  B32B17/00

CPC分类号： H01B1/16 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/092 ,  Y10T428/24917 ,  Y10T428/24926

摘要： An object is to provide a conductor paste of quality which uses a silver base internal conductor, suppresses the generation of voids and the concomitant occurrence of cracks even when co-fired with ceramic material by the conductor melting method, and has improved productivity, reduced cost, and improved electrical properties. The conductor paste is prepared by dispersing a silver base conductive material and a metal oxide in a vehicle. At least one of Ga oxide, La oxide, Pr oxide, Sm oxide, Eu oxide, Gd oxide, Dy oxide, Er oxide, Tm oxide, and Yb oxide is used as the metal oxide. The conductor paste is fired at a temperature between the melting point and lower than the boiling point of the conductive material.

摘要翻译： PCT No.PCT / JP97 / 02144 Sec。 371日期：1998年5月12日 102（e）日期1998年5月12日PCT提交1997年6月23日PCT公布。 第WO98 / 05045号公报。 日期1998年2月5日，目的在于提供使用银基内部导体的质量导体糊，即使在通过导体熔融法与陶瓷材料共烧的同时，也抑制空隙的产生和伴随的裂纹的发生，并具有 提高生产率，降低成本和改善电性能。 通过将银基导电材料和金属氧化物分散在载体中来制备导体糊料。 使用Ga氧化物，La氧化物，Pr氧化物，Sm氧化物，Eu氧化物，Gd氧化物，Dy氧化物，Er氧化物，Tm氧化物和Yb氧化物中的至少一种作为金属氧化物。 导体膏在熔点低于导电材料的沸点之间的温度下焙烧。

公开(公告)号：US6118212A

公开(公告)日：2000-09-12

申请号：US79286

申请日：1998-05-15

申请人： Kenji Nakaya ,  Isamu Kobori ,  Masami Mori ,  Kazutoshi Ohisa ,  Michio Arai

发明人： Kenji Nakaya ,  Isamu Kobori ,  Masami Mori ,  Kazutoshi Ohisa ,  Michio Arai

IPC分类号： H05B33/26 ,  H01B1/16 ,  H01L51/50 ,  H01L51/52 ,  H05B33/12

CPC分类号： H01L51/5221 ,  Y10S428/917

摘要： An organic EL device of the invention comprises a hole injecting electrode, an electron injecting electrode and at least one organic layer interleaved between them. The electron injecting electrode is a film of an aluminum lithium alloy formed by a sputtering technique and comprising 0.4 to 14 at % of lithium. The electron injecting electrode further includes on a side of the electron injecting electrode that is not opposite to the organic layer a protective electrode comprising at least one of aluminum, aluminum and a transition metal except titanium, titanium, and titanium nitride.

摘要翻译： 本发明的有机EL元件包括空穴注入电极，电子注入电极和在它们之间交错的至少一个有机层。 电子注入电极是通过溅射技术形成的包含0.4〜14at％的锂的铝锂合金的膜。 电子注入电极还包括在电子注入电极的与有机层相反的一侧，包括除了钛，钛和氮化钛之外的铝，铝和过渡金属中的至少一种的保护电极。

公开(公告)号：US6104044A

公开(公告)日：2000-08-15

申请号：US861820

申请日：1997-05-23

申请人： Yasushi Iyechika ,  Yoshinobu Ono ,  Tomoyuki Takada ,  Katsumi Inui

发明人： Yasushi Iyechika ,  Yoshinobu Ono ,  Tomoyuki Takada ,  Katsumi Inui

IPC分类号： H01L21/285 ,  H01B1/16 ,  H01L21/28 ,  H01L29/45 ,  H01L33/32 ,  H01L33/40 ,  H01S5/00 ,  H01S5/042 ,  H01S5/323 ,  H01L29/205 ,  H01L27/15 ,  H01S3/19

CPC分类号： H01L33/40 ,  H01L29/452 ,  H01L33/42 ,  H01S5/0425 ,  H01S5/32341

摘要： Disclosed is an electrode material for Group III-V compound semiconductor represented by the general formula In.sub.x Ga.sub.y Al.sub.z N (provided that x+y+z=1, 0.ltoreq.x.ltoreq.1, 0.ltoreq.y.ltoreq.1, and 0.ltoreq.z.ltoreq.1) doped with a p-type impurity which is capable of obtaining good ohmic contact, and an electrode using the same, thereby making it possible to reduce a driving voltage of a device using the compound semiconductor. The electrode material is a metal comprising at least Ca and a noble metal, wherein the total amount of the weight of Ca and the noble metal is not less than 50% by weight and not more than 100% by weight based on the weight of the whole electrode material.

摘要翻译： 公开了由通式In x Ga y Al z N表示的用于III-V族化合物半导体的电极材料（假定x + y + z =1,0,0≤x≤1,0≤y≤1，和 掺杂有能够获得良好的欧姆接触的p型杂质，以及使用其的电极，从而可以降低使用化合物半导体的器件的驱动电压。 电极材料是至少包含Ca和贵金属的金属，其中Ca和贵金属的重量总量不小于50重量％且不大于100重量％，基于 整个电极材料。

公开(公告)号：US6090436A

公开(公告)日：2000-07-18

申请号：US888916

申请日：1997-07-07

申请人： Akihiko Miyoshi

发明人： Akihiko Miyoshi

IPC分类号： H01B1/16 ,  H01L23/498 ,  H05K1/09 ,  B05D5/12

CPC分类号： H05K1/092 ,  H01B1/16 ,  H01L23/49883 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/19105 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/252 ,  Y10T428/2804

摘要： An improved gold paste for use in the manufacture of ceramic circuit boards is disclosed, which has a composition comprising an inorganic component, an organic binder, a solvent. The inorganic component contains (a) 84-94 wt % powdery gold with a particle size of 0.3-0.7 .mu.m, (b) 0.3-2.0 wt % powdery V.sub.2 O.sub.5 with a particle size of 0.3-2.0 .mu.m, and (c) 0.3-2.0 wt % powdery CuO with a particle size of 0.3-2.0 .mu.m.

摘要翻译： 公开了一种用于制造陶瓷电路板的改进的金膏，其具有包含无机成分，有机粘合剂和溶剂的组合物。 无机成分含有（a）84-94重量％的粉末状金，粒径为0.3〜0.7μm，（b）0.3〜2.0重量％的粉末状V2O5，粒径为0.3〜2.0μm，（c） 0.3-2.0重量％的粒径为0.3-2.0μm的CuO粉末。

公开(公告)号：US06042933A

公开(公告)日：2000-03-28

申请号：US133853

申请日：1998-08-13

申请人： Keizo Hirai ,  Hiroshi Wada ,  Akihiro Sasaki ,  Hisashi Kaga ,  Junichi Kikuchi ,  Shozo Yamana ,  Hideji Kuwajima

发明人： Keizo Hirai ,  Hiroshi Wada ,  Akihiro Sasaki ,  Hisashi Kaga ,  Junichi Kikuchi ,  Shozo Yamana ,  Hideji Kuwajima

IPC分类号： B22F1/00 ,  B22F1/02 ,  H01B1/02 ,  H01B1/16 ,  H01B1/22 ,  H01L23/498 ,  H05K1/09 ,  B32B3/00 ,  B22F3/00

CPC分类号： B22F1/0055 ,  B22F1/0007 ,  B22F1/0059 ,  B22F1/025 ,  H01B1/02 ,  H01B1/16 ,  H01B1/22 ,  H01L23/49883 ,  H05K1/092 ,  H05K1/095 ,  B22F2009/041 ,  B22F2009/043 ,  B22F2998/00 ,  B22F2999/00 ,  H01L2924/0002 ,  Y10S428/901 ,  Y10T428/12014 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/12493 ,  Y10T428/12715 ,  Y10T428/12868 ,  Y10T428/24917 ,  Y10T428/24926

摘要： Electroconductive composite metal powders comprising flat non-noble metal powders, each covered with a noble metal in an amount of 2 to 30% by weight in average based on the weight of the non-noble metal powders, on 50% or more in average of the whole surface area of the non-noble metal powders, interposing a layer of a mixture of the non-noble metal and noble metal between each non-noble metal powder and a noble metal covering layer, are suitable for providing an electroconductive paste after mixing with a binder, said paste showing excellent electroconductivity and prevention of migration.

摘要翻译： 包含平坦非贵金属粉末的导电复合金属粉末，平均非贵金属粉末的平均非贵金属粉末的平均重量平均为2〜30重量％，平均为非贵金属粉末的重量的50重量％以上 在非贵金属粉末和贵金属覆盖层之间插入非贵金属和贵金属的混合物层的非贵金属粉末的整个表面积适于在混合之后提供导电浆料 使用粘合剂，所述糊状物显示出优异的导电性并防止迁移。

公开(公告)号：US5997774A

公开(公告)日：1999-12-07

申请号：US249957

申请日：1999-02-12

申请人： Yasushi Shimizu ,  Minoru Yonezawa

发明人： Yasushi Shimizu ,  Minoru Yonezawa

IPC分类号： H01G4/12 ,  H01B1/16 ,  H01B1/20 ,  H01B1/22 ,  H01G4/005 ,  H01G4/008

CPC分类号： H01G4/0085

摘要： The present invention provides a paste for forming an internal electrode in a ceramic element. The paste causes no sudden heat generation from an organic vehicle contained therein during a degreasing step and allows Pd or Ag/Pd serving as an internal electrode to expand freely as a result of oxidation during a firing step, to thereby prevent structural defects of the ceramics such as delamination, when used for the formation of internal electrodes in a ceramic element such as a laminated ceramic capacitor. The paste contains a metal powder of Pd or Ag/Pd, Pd resinate, Cr resinate and an organic vehicle. Preferably, the Pd resinate contains sulfur in the molecule. Also preferably, the paste contains the Pd resinate in an amount of about 2.0-3.0 parts by weight as Pd, based on 100 parts by weight of Pd in the metal powder, and the Cr resinate in an amount of about 0.03-0.12 parts by weight as Cr.sub.2 O.sub.3, based on 100 parts by weight of the metal powder.

摘要翻译： 本发明提供了一种用于在陶瓷元件中形成内部电极的糊料。 糊剂在脱脂工序中不会引起其中含有的有机载体的突然发热，并且由于在烧成工序中的氧化，可以使作为内部电极的Pd或Ag / Pd自由扩展，从而防止陶瓷的结构缺陷 例如在陶瓷元件如层叠陶瓷电容器中用于形成内部电极时的分层。 该糊料含有Pd或Ag / Pd，Pd树脂酸盐，Cr树脂酸盐和有机载体的金属粉末。 优选地，Pd树脂酸盐在分子中含有硫。 还优选地，基于100重量份的金属粉末中的Pd，所述糊料包含Pd的量为约2.0-3.0重量份的Pd树脂酸盐，并且Cr树脂酸盐的量为约0.03-0.12重量份 重量为Cr 2 O 3，基于100重量份的金属粉末。