公开(公告)号：US11894350B2

公开(公告)日：2024-02-06

申请号：US17101016

申请日：2020-11-23

Applicant: eLux Inc.

Inventor： Paul J. Schuele ,  Kenji Sasaki ,  Kurt Ulmer ,  Jong-Jan Lee

IPC: H01L25/075 ,  H01L33/48 ,  H01L33/38 ,  H01L21/673 ,  H01L21/70

CPC classification number: H01L25/0753 ,  H01L21/67316 ,  H01L21/67343 ,  H01L21/70 ,  H01L33/38 ,  H01L33/486 ,  H01L2933/0033 ,  H01L2933/0066

Abstract: A microLED mass transfer stamping system includes a stamp substrate with an array of trap sites, each configured with a columnar-shaped recess to temporarily secure a keel extended from a bottom surface of a microLED. In the case of surface mount microLEDs, the keel is electrically nonconductive. In the case of vertical microLEDs, the keel is an electrically conductive second electrode. The stamping system also includes a fluidic assembly carrier substrate with an array of wells having a pitch separating adjacent wells that matches the pitch separating the stamp substrate trap sites. A display substrate includes an array of microLED pads with the same pitch as the trap sites. The stamp substrate top surface is pressed against the display substrate, with each trap site interfacing a corresponding microLED site, and the microLEDs are transferred. Fluidic assembly stamp substrates are also presented for use with microLEDs having keels or axial leads.

公开(公告)号：US20240038561A1

公开(公告)日：2024-02-01

申请号：US18377053

申请日：2023-10-05

Applicant: Shin-Etsu Polymer Co., Ltd.

Inventor： Osamu Ogawa ,  Seiya Nakarai

IPC: H01L21/673

CPC classification number: H01L21/67383

Abstract: A substrate storage container includes a container body configured to store a substrate, a lid that closes the opening of the container body, a retainer that is attached to the lid, and a substrate support portion formed in the retainer. The substrate support portion has an arc shape in a cross-sectional view from the top-to-bottom direction perpendicular to the closing direction of the lid. The substrate support portion includes a pair of left and right substrate support portions configured to hold the substrate together with the container body to retain the substrate.

公开(公告)号：US20240038559A1

公开(公告)日：2024-02-01

申请号：US17876014

申请日：2022-07-28

Applicant: Brillian Network & Automation Integrated System Co., Ltd.

Inventor： YI-JUN GU

IPC: H01L21/673 ,  H01L21/67

CPC classification number: H01L21/673 ,  H01L21/67201 ,  H01L21/67017

Abstract: A load port and a multi-use carrier are provided. The load port includes a carrying board, two gas-inlet nozzles disposed on the carrying board, and two gas-outlet nozzles disposed on the carrying board. Each of the two gas-inlet nozzles has a shared gas-inlet channel. Each of the two gas-outlet nozzles has a first gas-outlet channel and a second gas-outlet channel that is spaced apart from the first gas-outlet channel. The shared gas-inlet channels of the two gas-inlet nozzles are selectively cooperated with the first gas-outlet channels of the two gas-outlet nozzles so as to be jointly configured to spatially communicate with a first wafer cassette. The shared gas-inlet channels of the two gas-inlet nozzles are selectively cooperated with the second gas-outlet channels of the two gas-outlet nozzles so as to be jointly configured to spatially communicate with a second wafer cassette.

公开(公告)号：US11887875B2

公开(公告)日：2024-01-30

申请号：US16981644

申请日：2018-11-28

Applicant: MIRAIAL CO., LTD.

Inventor： Yuya Narita ,  Tadatoshi Inoue

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/677

CPC classification number: H01L21/67376 ,  H01L21/67126 ,  H01L21/67386 ,  H01L21/67769

Abstract: A substrate storing container includes: a container main body; a lid body that is attachable to and detachable from a container main body opening portion and can close the container main body opening portion; and a sealing member that closes the container main body opening portion together with the lid body, in which airtightness of the substrate storing space is enhanced so that 50% or more of a gas supplied to a substrate storing space can be discharged from an exhaust filter portion in a case in which a supply amount of a gas supplied from an outer space of the container main body to the substrate storing space through a gas supply filter portion is 22 liters per minute or less.

公开(公告)号：US20240021454A1

公开(公告)日：2024-01-18

申请号：US18350546

申请日：2023-07-11

Applicant: Bum Je WOO

Inventor： Bum Je WOO

IPC: H01L21/673

CPC classification number: H01L21/67393 ,  H01L21/67386 ,  H01L21/67383

Abstract: Proposed is a wafer storage container that is connected to a wafer transfer chamber of an EFEM and supplies a purge gas to wafers to remove fumes from the wafers or to control humidity of the wafers. More particularly, proposed is a wafer storage container that effectively blocks an external gas from flowing into a storage chamber, while effectively achieving fume removal and humidity control for wafers.

公开(公告)号：US20240017903A1

公开(公告)日：2024-01-18

申请号：US18347989

申请日：2023-07-06

Applicant: Bum Je WOO

Inventor： Bum Je WOO

IPC: B65D81/20 ,  H01L21/673

CPC classification number: B65D81/2076 ,  H01L21/67389

Abstract: Proposed is a wafer storage container that supplies a purge gas to wafers stored in a storage chamber to remove fumes from the wafers or control humidity of the wafers. More particularly, proposed is a wafer storage container that generates a flow of a purge gas inside a storage chamber to block an external gas from flowing into the storage chamber and minimize dead areas on a wafer, thereby effectively achieving humidity control and fume removal for the wafer.

公开(公告)号：US11874596B2

公开(公告)日：2024-01-16

申请号：US17216724

申请日：2021-03-30

Applicant: GUDENG PRECISION INDUSTRIAL CO., LTD

Inventor： Ming-Chien Chiu ,  Chia-Ho Chuang ,  Hsing-Min Wen ,  Hsin-Min Hsueh ,  Shu-Hung Lin

IPC: G03F1/66 ,  B65D81/02 ,  H01L21/673

CPC classification number: G03F1/66 ,  B65D81/02 ,  H01L21/67369

Abstract: The instant disclosure discloses a workpiece container system comprising a storage assembly. The storage assembly comprises a seat member and a seat cover. The seat member defines a workpiece receiving region that encompasses a geometric center region thereof, configured to receive a workpiece; wherein a lower diffuse inducing component is provided on the seat member within a planar projection of the workpiece yet offsets the geometric center region. The seat cover is configured to engage the seat member at a periphery region around the workpiece receiving region thereof, so as to cooperatively form an enclosure for housing the workpiece; wherein an upper diffuse inducing component is provided on the seat cover over the planar projection of the workpiece and protectively overlaps the geometric center region of the seat member.

公开(公告)号：US20240006211A1

公开(公告)日：2024-01-04

申请号：US18329271

申请日：2023-06-05

Applicant: GUDENG PRECISION INDUSTRIAL CO., LTD. ,  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Ming-Chien CHIU ,  En-Nien SHEN ,  Chia-Ho CHUANG ,  Kuo-Hua LEE ,  Jyun-Ming LYU ,  Tzu Ang CHIANG ,  Yi-Feng HUANG ,  Tsung-Yi LIN

IPC: H01L21/673 ,  B65D81/02

CPC classification number: H01L21/67369 ,  B65D81/022

Abstract: A protective package assembly includes middle, upper, and lower packages. The middle package includes side buffer boards. The side buffer boards are connected in a ring shape to form an accommodating space communicated with upper and lower openings. The upper package includes an upper buffer board and upper buffer members. The upper buffer board is configured to cover the upper opening. The upper buffer members are distributed at intervals and protrude from a surface of the upper buffer board. The upper buffer members are disposed toward the interior of the accommodating space. The lower package includes a lower buffer board and lower buffer members. The lower buffer board is configured to cover the lower opening. The lower buffer members are distributed at intervals and protrude from a surface of the lower buffer board. The lower buffer members are disposed toward the interior of the accommodating space.

公开(公告)号：US20230420275A1

公开(公告)日：2023-12-28

申请号：US18244041

申请日：2023-09-08

Applicant: Applied Materials, Inc.

Inventor： Michael Honan ,  David Blahnik ,  Robert Brent Vopat ,  Jeffrey Blahnik ,  Charles Carlson

IPC: H01L21/67 ,  H01L21/673 ,  F27D7/02 ,  H01L21/324 ,  C30B33/02 ,  C30B35/00

CPC classification number: H01L21/67109 ,  H01L21/67323 ,  F27D7/02 ,  H01L21/324 ,  H01L21/67248 ,  C30B33/02 ,  C30B35/00

Abstract: Apparatus and methods to process one or more wafers are described. The apparatus comprises a chamber defining an upper interior region and a lower interior region. A heater assembly is on the bottom of the chamber body in the lower interior region and defines a process region. A wafer cassette assembly is inside the heater assembly and a motor is configured to move the wafer cassette assembly from the lower process region inside the heater assembly to the upper interior region.

公开(公告)号：US20230417791A1

公开(公告)日：2023-12-28

申请号：US18199855

申请日：2023-05-19

Applicant: FOXSEMICON INTEGRATED TECHNOLOGY, INC.

Inventor： SI-YU WEN ,  CHUN-KAI HUANG ,  CHUN-CHUNG CHEN

IPC: G01P5/00 ,  H01L21/673

CPC classification number: G01P5/00 ,  H01L21/67389

Abstract: A device is provided. The device is configured to measure the air speed near an air outlet of an air curtain. The air curtain is mounted near an open of a wafer box. Receiving grooves are defined in the wafer box. Each receiving groove is configured to receive a wafer. The device includes one or more fixing members and one or more air speed measuring members. Each fixing members is received and held in one receiving groove. Each air speed measuring member is arranged on one fixing member. Each air speed measuring member includes one or more sensors. Each sensor extends outside the wafer box and is positioned below the air curtain. Each sensor is configured to measure the air speed near the air outlet of the air curtain. A related wafer box is also provided.