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公开(公告)号：US12230743B2
公开(公告)日：2025-02-18
申请号：US17981428
申请日：2022-11-06
Applicant: eLux Inc.
Inventor： Kenji Sasaki , Paul J. Schuele
IPC: H01L33/54 , H01L21/56 , H01L21/683 , H01L23/00 , H01L23/31 , H01L25/075 , H01L27/15 , H01L33/58 , H01L33/62 , H01L33/20 , H01L33/32 , H01L33/60
Abstract: A method is provided for fabricating an encapsulated emissive element. Beginning with a growth substrate, a plurality of emissive elements is formed. The growth substrate top surface is conformally coated with an encapsulation material. The encapsulation material may be photoresist, a polymer, a light reflective material, or a light absorbing material. The encapsulant is patterned to form fluidic assembly keys having a profile differing from the emissive element profiles. In one aspect, prior to separating the emissive elements from the handling substrate, a fluidic assembly keel or post is formed on each emissive element bottom surface. In one variation, the emissive elements have a horizontal profile. The fluidic assembly key has horizontal profile differing from the emissive element horizontal profile useful in selectively depositing different types of emissive elements during fluidic assembly. In another aspect, the emissive elements and fluidic assembly keys have differing vertical profiles useful in preventing detrapment.
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公开(公告)号：US11916163B2
公开(公告)日：2024-02-27
申请号：US17464892
申请日：2021-09-02
Applicant: eLux Inc.
Inventor： Jong-Jan Lee , Paul J. Schuele
CPC classification number: H01L33/0093 , H01L33/0095 , H01L33/24 , H01L33/38
Abstract: A system and method are provided for repairing an emissive element display. If a defective emissive element is detected in a subpixel, a subpixel repair interface isolates the defective emissive element. The repair interface may be a parallel repair interface with n number of selectively fusible electrically conductive repair nodes, connected in parallel to a control line of the matrix. Alternatively, the repair interface may be a series repair interface with m number of repair nodes, selectively connectable to bypass adjacent (defective) series-connected emissive elements. If the subpixel emissive elements are connected in parallel, and a defective low impedance emissive element is detected, a parallel repair interface fuses open a connection between the defective emissive element and a matrix control line. If the subpixels include series-connected emissive elements, and a high impedance emissive element is detected, a series repair interface forms a connection bypassing the defective emissive element.
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公开(公告)号：US11908841B2
公开(公告)日：2024-02-20
申请号：US17326779
申请日：2021-05-21
Applicant: eLux Inc.
Inventor： Paul J. Schuele , Kurt Ulmer , Kenji Sasaki , Jong-Jan Lee
IPC: H01L25/075 , H01L33/48 , H01L33/38
CPC classification number: H01L25/0753 , H01L33/38 , H01L33/486 , H01L2933/0033 , H01L2933/0066
Abstract: Disclosed herein is a micro light emitting diode (microLED) display structure with emission from the back side of a transparent substrate, which can be manufactured by fluidic assembly. The architecture allows microLED displays or display tiles to be fabricated simply, with processing and interconnection only on one side of the backplane. The structure may incorporate reflectors in the fluidic assembly structures to direct substantially all of the emitted light toward the viewer. Also disclosed are microLEDs and emission backplanes designed to support a back emission display.
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公开(公告)号：US11894350B2
公开(公告)日：2024-02-06
申请号：US17101016
申请日：2020-11-23
Applicant: eLux Inc.
Inventor： Paul J. Schuele , Kenji Sasaki , Kurt Ulmer , Jong-Jan Lee
IPC: H01L25/075 , H01L33/48 , H01L33/38 , H01L21/673 , H01L21/70
CPC classification number: H01L25/0753 , H01L21/67316 , H01L21/67343 , H01L21/70 , H01L33/38 , H01L33/486 , H01L2933/0033 , H01L2933/0066
Abstract: A microLED mass transfer stamping system includes a stamp substrate with an array of trap sites, each configured with a columnar-shaped recess to temporarily secure a keel extended from a bottom surface of a microLED. In the case of surface mount microLEDs, the keel is electrically nonconductive. In the case of vertical microLEDs, the keel is an electrically conductive second electrode. The stamping system also includes a fluidic assembly carrier substrate with an array of wells having a pitch separating adjacent wells that matches the pitch separating the stamp substrate trap sites. A display substrate includes an array of microLED pads with the same pitch as the trap sites. The stamp substrate top surface is pressed against the display substrate, with each trap site interfacing a corresponding microLED site, and the microLEDs are transferred. Fluidic assembly stamp substrates are also presented for use with microLEDs having keels or axial leads.
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公开(公告)号：US20230261153A9
公开(公告)日：2023-08-17
申请号：US16984491
申请日：2020-08-04
Applicant: eLux Inc.
Inventor： Kenji Sasaki , Paul J. Schuele
IPC: H01L33/54 , H01L27/15 , H01L33/62 , H01L21/683 , H01L21/56 , H01L23/31 , H01L33/58 , H01L25/075 , H01L23/00
CPC classification number: H01L33/54 , H01L27/156 , H01L33/62 , H01L21/6835 , H01L21/561 , H01L23/3185 , H01L33/58 , H01L25/0753 , H01L24/97 , H01L33/32
Abstract: A method is provided for fabricating an encapsulated emissive element. Beginning with a growth substrate, a plurality of emissive elements is formed. The growth substrate top surface is conformally coated with an encapsulation material. The encapsulation material may be photoresist, a polymer, a light reflective material, or a light absorbing material. The encapsulant is patterned to form fluidic assembly keys having a profile differing from the emissive element profiles. In one aspect, prior to separating the emissive elements from the handling substrate, a fluidic assembly keel or post is formed on each emissive element bottom surface. In one variation, the emissive elements have a horizontal profile. The fluidic assembly key has horizontal profile differing from the emissive element horizontal profile useful in selectively depositing different types of emissive elements during fluidic assembly. In another aspect, the emissive elements and fluidic assembly keys have differing vertical profiles useful in preventing detrapment.
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Patent Agency Ranking
公开(公告)号：US10930819B2
公开(公告)日：2021-02-23
申请号：US16268416
申请日：2019-02-05
Applicant: eLux Inc.
Inventor： Kenji Alexander Sasaki , Paul J. Schuele , Mark Albert Crowder
Abstract: Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.
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公开(公告)号：US20200286870A1
公开(公告)日：2020-09-10
申请号：US16875995
申请日：2020-05-16
Applicant: eLux Inc.
Inventor： Kenji Sasaki , Kurt Ulmer , Paul J. Schuele , Jong-Jan Lee
IPC: H01L25/075 , H01L33/48 , H01L33/38
Abstract: A method is provided for the selective harvest of microLED devices from a carrier substrate. Defect regions are predetermined that include a plurality of adjacent defective microLED devices on a carrier substrate. A solvent-resistant binding material is formed overlying the predetermined defect regions and exposed adhesive is dissolved with an adhesive dissolving solvent. Non-defective microLED devices located outside the predetermined defect regions are separated from the carrier substrate while adhesive attachment is maintained between the microLED devices inside the predetermined defect regions and the carrier substrate. Methods are also provided for the dispersal of microLED devices on an emissive display panel by initially optically measuring a suspension of microLEDs to determine suspension homogeneity and calculate the number of microLEDs per unit volume. If the number of harvested microLED devices in the suspension is known, a calculation can be made of the number of microLED devices per unit of suspension volume.
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公开(公告)号：US10516084B2
公开(公告)日：2019-12-24
申请号：US16125671
申请日：2018-09-08
Applicant: eLux Inc.
Inventor： Kenji Sasaki , Paul J. Schuele
IPC: H01L33/54 , H01L27/15 , H01L33/62 , H01L21/683 , H01L21/56 , H01L23/31 , H01L33/58 , H01L25/075 , H01L23/00 , H01L33/32 , H01L33/60 , H01L33/20
Abstract: A method is provided for fabricating an encapsulated emissive element. Beginning with a growth substrate, a plurality of emissive elements is formed. The growth substrate top surface is conformally coated with an encapsulation material. The encapsulation material may be photoresist, a polymer, a light reflective material, or a light absorbing material. The encapsulant is patterned to form fluidic assembly keys having a profile differing from the emissive element profiles. In one aspect, prior to separating the emissive elements from the handling substrate, a fluidic assembly keel or post is formed on each emissive element bottom surface. In one variation, the emissive elements have a horizontal profile. The fluidic assembly key has horizontal profile differing from the emissive element horizontal profile useful in selectively depositing different types of emissive elements during fluidic assembly. In another aspect, the emissive elements and fluidic assembly keys have differing vertical profiles useful in preventing detrapment.
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公开(公告)号：US10431718B2
公开(公告)日：2019-10-01
申请号：US16025167
申请日：2018-07-02
Applicant: eLux Inc.
Inventor： Mark Albert Crowder , Paul J. Schuele , Changqing Zhan , Kenji Alexander Sasaki , Kurt Michael Ulmer
Abstract: Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.
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公开(公告)号：US10243098B2
公开(公告)日：2019-03-26
申请号：US15859672
申请日：2018-01-01
Applicant: eLux Inc.
Inventor： David Robert Heine , Sean Mathew Garner , Avinash Tukaram Shinde
Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate. In some cases, embodiments include a substrate including a plurality of wells each having a sidewall where a through hole via extends from a bottom of at least one of the plurality of wells; and a post enhanced diode including a post extending from a top surface of a diode structure.
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