Abstract:
Methods which include providing a single crystal silicon substrate having a device pattern formed on a portion of the substrate where the device pattern has a protrusion, forming a protection layer on a portion of the protrusion, and forming an oxide insulation layer between the protrusion and the substrate using a thermal oxidation process; methods of forming a partial SOI structure which include providing a single crystal silicon substrate having a device pattern formed thereon where the device pattern comprises a non-SOI region and an SOI region having a protrusion, forming a protection layer on a portion of the protrusion, and forming an oxide insulation layer between the protrusion and the substrate using a thermal oxidation process; structures formed by such methods; and partial silicon-on-insulator structures comprising a single crystal silicon substrate having an device pattern disposed on a surface thereof where the device pattern includes a non-SOI region and an SOI region having a protrusion, and an oxide insulation layer disposed in the device pattern where a portion of the insulation layer is disposed under the protrusion such that the protrusion is isolated from the single crystal substrate, and where the non-SOI region is not isolated from the single crystal structure.
Abstract:
A digital signal processing system and method applied for chroma transition, wherein the method has the acts of: performing a difference process on an original chroma signal C to obtain a first difference signal C′; calculating an absolute value |C′| of the first difference signal C′; performing a difference process on the absolute value |C′| to obtain a second difference signal Ca′; determining whether the second difference signal Ca′ is a positive signal or a negative signal; wherein based on a determined result, an optimized chroma signal is generated by either mixing the original input chroma signal C with a k-delayed chroma signal, or mixing the k-delayed chroma signal C[n−k] with a 2k-delayed chroma signal C[n−2k], where k is a constant.
Abstract:
A method for analyzing the interaction between threshold states of a multiple-bit memory cell on a coordinate system is provided. The coordinate system is formed using a plurality of axes with one axis being a threshold state of a first side of a memory cell and the second axis being a threshold state of a second side of a multiple-bit memory cell. An operation is initiated on the first side of the memory cell from a start point and continues to a first target point of the first side. Then, a trace is plotted from the start point of the first side of the memory cell to a target point of the first side of the memory cell. This plot illustrates the interaction of the threshold state of the first side of the memory cell to the threshold state of the second side of the memory cell.
Abstract:
A method for fabricating a contact is provided. First, a substrate is provided. A patterned first material layer is formed over the substrate. The first material layer is fabricated using a conductive material. Thereafter, a treatment operation is performed to transform a portion of the first material layer into a second material layer with insulating properties. The second material layer is located on sidewall sections and a top section of the first material layer. A dielectric layer is formed over the second material layer and the substrate. A portion of the dielectric layer and the second material layer are removed to expose the first material layer. Because a treatment transformation is used to reduce the dimension of contacts, this invention eliminates the limitations associated with forming a contact through an etching process.
Abstract:
A 3D polysilicon read only memory at least including: a silicon substrate, an isolated silicon dioxide (SiO2) layer, a N-Type heavily doped (N+) polysilicon layer, a first oxide layer, a dielectric layer, a P-Type lightly doped (P−) polysilicon layer, at least a neck structure, and a second oxide layer. The isolated SiO2 layer is deposited on the silicon substrate, and the N+ polysilicon layer is deposited on the isolated SiO2 layer. The N+ polysilicon layer is further defined a plurality of parallel, separate word lines (WL), and the first oxide layer is filled in the space between the word lines. The dielectric layer is deposited on the word lines and the first oxide layer. The P-Type lightly doped (P−) polysilicon layer is deposited on the dielectric layer and is further defined a plurality of parallel, separate bit lines (BL). The bit lines overlap the word lines, from a top view, to form a shape approximately as a cross. There are at least a neck structure individually formed between the first polysilicon layer and the second polysilicon layer by isotropy wet etching the dielectric layer, with using dilute hydrofluoric acid (HF) as the example. The second oxide layer is filled in the space between the bit lines and is on the word lines and the first oxide layer.
Abstract:
A digital signal processing system and method applied for chroma transition, wherein the method has the acts of: performing a difference process on an original chroma signal C to obtain a first difference signal C′; calculating an absolute value |C′| of the first difference signal C′; performing a difference process on the absolute value |C′| to obtain a second difference signal Ca′; determining whether the second difference signal Ca′ is a positive signal or a negative signal; wherein based on a determined result, an optimized chroma signal is generated by either mixing the original input chroma signal C with a k-delayed chroma signal, or mixing the k-delayed chroma signal C[n−k] with a 2k-delayed chroma signal C[n−2k], where k is a constant.
Abstract:
A method for fabricating a contact is provided. First, a substrate is provided. A patterned first material layer is formed over the substrate. The first material layer is fabricated using a conductive material. Thereafter, a treatment operation is performed to transform a portion of the first material layer into a second material layer with insulating properties. The second material layer is located on sidewall sections and a top section of the first material layer. A dielectric layer is formed over the second material layer and the substrate. A portion of the dielectric layer and the second material layer are removed to expose the first material layer. Because a treatment transformation is used to reduce the dimension of contacts, this invention eliminates the limitations associated with forming a contact through an etching process.
Abstract:
A programmable metallization device comprises a first electrode and a second electrode, and a dielectric layer, a conductive ion-barrier layer, and an ion-supplying layer in series between the first and second electrodes. In operation, a conductive bridge is formed or destructed in the dielectric layer to represent a data value using bias voltages having the same polarity, enabling the use of diode access devices. To form a conductive bridge, a bias is applied that is high enough to cause ions to penetrate the conductive ion-barrier layer into the dielectric layer, which then form filaments or bridges. To destruct the conductive bridge, a bias of the same polarity is applied that causes current to flow through the structure, while ion flow is blocked by the conductive ion-barrier layer. As a result of Joule heating, any bridge in the dielectric layer disintegrates.
Abstract:
The invention describes a semiconductor cell including a gate, a dielectric layer, a channel layer, a source region, a drain region and an oxide region. The dielectric layer is adjacent to the gate. The channel layer is adjacent to the dielectric layer and is formed above a source region, a drain region, and an oxide region.
Abstract:
A switching device and an operating method for the same and a memory array are provided. The switching device comprises a first solid electrolyte, a second solid electrolyte and a switching layer. The switching layer is adjoined between the first solid electrolyte and the second solid electrolyte.