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公开(公告)号：US20140140423A1
公开(公告)日：2014-05-22
申请号：US14170111
申请日：2014-01-31
Inventor： Karthik MURALIDHAR , George A. VLANTIS
CPC classification number: H04L25/03821 , H04B7/0413 , H04L5/0048 , H04L25/0204 , H04L25/022 , H04L25/0226 , H04L27/2601
Abstract: In an embodiment, a transmitter includes a transmission path configurable to generate first pilot clusters in response to a matrix, each first pilot cluster including a respective first pilot subsymbol in a first cluster position and a respective second pilot subsymbol in a second cluster position such that a vector formed by the first pilot subsymbols is orthogonal to a vector formed by the second pilot subsymbols, the matrix having a dimension related to a number of cluster positions in each of the first pilot clusters. For example, where such a transmitter transmits simultaneous orthogonal-frequency-division-multiplexed (OFDM) signals (e.g., MIMO-OFDM signals) over respective channels that may impart inter-carrier interference (ICI) to the signals due to Doppler spread, the pattern of the pilot symbols that compose the pilot clusters may allow a receiver of these signals to estimate the responses of these channels more accurately than conventional receivers.
Abstract translation: 在实施例中，发射机包括可配置为响应于矩阵生成第一导频簇的传输路径，每个第一导频簇包括第一簇位置中的相应第一导频子符号和第二簇位置中的相应第二导频子符号，使得 由第一导频子符号形成的矢量与由第二导频子符号形成的矢量正交，该矩阵具有与每个第一导频簇中的簇的位置数相关的维数。 例如，在这种发射机通过可能由于多普勒扩展而给予信号的载波间干扰（ICI）的相应信道上发射同时正交频分复用（OFDM）信号（例如，MIMO-OFDM信号）的情况下， 构成导频簇的导频符号的模式可以允许这些信号的接收机比常规接收机更准确地估计这些信道的响应。
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公开(公告)号：US20040199849A1
公开(公告)日：2004-10-07
申请号：US10729828
申请日：2003-12-04
Inventor： Christopher Aldridge , Mridula Pradhan , Chong Yee Lee
IPC: H03M013/00
CPC classification number: H03M13/235 , H03M13/09 , H03M13/2903 , H03M13/2957
Abstract: A method of calculating a Cyclic Redundancy Check (CRC) value for a multi-bit input data word, using a defined generator polynomial is disclosed. The method includes the steps of: serially shifting at least a portion of the input data word into a register; XORing the contents of the register with the generator polynomial if the LSB of the register is null1null; shifting the contents of the register right by one position; shifting into the MSB position of the register a new bit of the input data word, having been XORed with the LSB of the register; repeating the previous step for all message data bits; shifting into the register a number of null0nulls equal to the length of the generator polynomial; reading from the register the calculated CRC value. Apparatus for performing the method is also disclosed.
Abstract translation: 公开了一种使用定义的生成多项式来计算多位输入数据字的循环冗余校验（CRC）值的方法。 该方法包括以下步骤：将输入数据字的至少一部分串行地移位到寄存器中; 如果寄存器的LSB为“1”，则使用生成多项式对寄存器的内容进行异或; 将登记册的内容移位一个位置; 将寄存器的MSB位移入输入数据字的新位，与寄存器的LSB进行异或运算; 对所有消息数据位重复上一步骤; 向寄存器中移动数个“0”等于生成多项式的长度; 从寄存器读取计算出的CRC值。 还公开了用于执行该方法的装置。
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公开(公告)号：US20040159927A1
公开(公告)日：2004-08-19
申请号：US10712981
申请日：2003-11-13
Applicant: STMicroelectronics Asia Pacific Pte Ltd
Inventor： Kum-Weng Loo , Chek-Lim Kho
IPC: H01L023/02
CPC classification number: B81C1/00269 , G01L19/143 , H01L23/04 , H01L23/3135 , H01L23/473 , H01L24/97 , H01L2224/83101 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/15787 , H01L2924/181 , H01L2924/00
Abstract: A semiconductor package having a substrate; a semiconductor die attached to the substrate; a housing attached to the substrate and arranged to surround the semiconductor die; and solidified molding material arranged around the housing and adhering to the substrate to secure the housing in position on the substrate. A method of manufacturing the package is also disclosed.
Abstract translation: 一种具有衬底的半导体封装; 附着在基板上的半导体管芯; 壳体，其附接到所述基板并且布置成围绕所述半导体管芯; 以及固化的模制材料，其布置在壳体周围并且附着到基板上以将壳体固定在基板上的适当位置。 还公开了制造封装的方法。
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公开(公告)号：US12119735B2
公开(公告)日：2024-10-15
申请号：US17680666
申请日：2022-02-25
Applicant: STMicroelectronics Asia Pacific Pte Ltd
Inventor： Yannick Guedon , Teerasak Lee
IPC: H02M1/00
CPC classification number: H02M1/0009
Abstract: Disclosed herein is a wireless power reception system that utilizes a switched capacitor DC-DC voltage converter to charge a load. Current sensing circuits described herein enable the measurement of the input current to the switched capacitor DC-DC voltage converter while being relatively insensitive to temperature variation. Voltage/current sensing circuits described herein enable the selective measurement of load voltage, high side load current, and low side load current. One of the current sensing circuits may be used together with one of the voltage/current sensing circuits in a single device, or the current sensing circuits and voltage/current sensing circuits may be used separately in different devices.
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公开(公告)号：US12014005B2
公开(公告)日：2024-06-18
申请号：US18171582
申请日：2023-02-20
Applicant: STMicroelectronics Asia Pacific Pte Ltd.
Inventor： Sa Hyang Hong , Sang Hoon Jeon , Yun Sang On , Min Sang Kim
CPC classification number: G06F3/04166 , G06F3/0442 , G06F3/0446 , G06F1/1652 , G06F2203/04102 , G09F9/301
Abstract: A method for operating an electronic device, the method including: displacing a rollable touchscreen to a first position along a first direction, a first side of the rollable touchscreen being mounted in a housing, the rollable touchscreen being configured to be rolled into or unrolled out of the housing along the first direction, detecting an active electrode at a first location on the rollable touchscreen, the active electrode being mounted in the housing, and determining the first position of the rollable touchscreen based on the first location, the first positing being indicative of a fractional amount of the rollable touchscreen outside the housing.
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Patent Agency Ranking
公开(公告)号：US11983594B2
公开(公告)日：2024-05-14
申请号：US17587645
申请日：2022-01-28
Applicant: STMICROELECTRONICS ASIA PACIFIC PTE LTD
Inventor： Jaehyun Kwak , Kyoung Min Cho
IPC: G06K19/077 , G06K19/073 , H01H1/12
CPC classification number: G06K19/07749 , G06K19/07345 , H01H1/12 , H01H2231/05
Abstract: The present disclosure is directed to a contactless card including an actuation security structure that is actuated to provide authorization in accessing identifying information on an integrated circuit within the contactless card. In at least one embodiment, the actuation security structure includes a pair of conductive layers and a pair of electrodes. Ends of the pair of conductive layers overlap respective ones of the pair of electrodes. The ends of the pair of conductive layers are at and in a first elastically deformable region and the respective ones of the pair of electrodes are at and in a second elastically deformable region. An owner of the contactless card may provide authorization to access the identification information on the contactless card by applying force to both the first and second elastically deformable regions inward resulting in the ends of the conductive layers moving into electrical communication with the pair of electrodes.
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公开(公告)号：US11946742B2
公开(公告)日：2024-04-02
申请号：US17374560
申请日：2021-07-13
Applicant: STMicroelectronics Asia Pacific Pte Ltd.
Inventor： Tae-gil Kang , Sung Kyu Kim , Sa Hyang Hong , Chang Woo Lee
CPC classification number: G01B7/30 , G01B7/32 , G06F3/0446 , G09G3/035 , G06F2203/04102 , G09G2340/0407 , G09G2340/045 , G09G2340/0464
Abstract: In an example, a display device includes a rollable display including a display side and an opposite non-display side. The rollable display includes a conductive material with a pattern disposed on the non-display side. The device includes a housing configured to house the rollable display and configured to roll in and roll out the rollable display along a first direction, and a capacitive sensor including a transmitter and a receiver electrode disposed within the housing and configured to sense the pattern.
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公开(公告)号：US11798967B2
公开(公告)日：2023-10-24
申请号：US17495047
申请日：2021-10-06
Inventor： How Yang Lim , Olivier Zanellato
IPC: H01L27/146 , H01L23/31 , H01L23/00 , H04N23/55
CPC classification number: H01L27/14627 , H01L23/31 , H01L24/14 , H04N23/55
Abstract: An integrated circuit package includes a support substrate having a front side and a back side and an optical integrated circuit die having a back side mounted to the front side of the support substrate and having a front side with an optical sensing circuit. A glass optical element die has a back side mounted to the front side of the optical integrated circuit die over the optical sensing circuit. The mounting of the glass optical element die is made by a layer of transparent adhesive which extends to the cover the optical sensing circuit and a portion of the front side of the optical integrated circuit die peripherally surrounding the optical sensing circuit. An encapsulation material body encapsulates the glass optical element die and the optical integrated circuit die.
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公开(公告)号：US20230163633A1
公开(公告)日：2023-05-25
申请号：US18158462
申请日：2023-01-23
Applicant: STMicroelectronics Asia Pacific Pte Ltd.
Inventor： Yannick Guedon
Abstract: An over-voltage protection circuit and methods of operation are provided. In one embodiment, a method includes monitoring a voltage at an output of a rectifier, a voltage at an output of a voltage regulator, or a combination thereof. The method further includes determining the over-voltage condition based on the monitoring; and in response to determining the over-voltage condition, regulating the voltage at the output of the rectifier in accordance with a voltage difference between the voltage at the output of the rectifier and the voltage at the output of the voltage regulator.
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公开(公告)号：US11588344B2
公开(公告)日：2023-02-21
申请号：US17374840
申请日：2021-07-13
Applicant: STMicroelectronics Asia Pacific Pte Ltd.
Inventor： Yannick Guedon
Abstract: An over-voltage protection circuit and methods of operation are provided. In one embodiment, a method includes monitoring a voltage at an output of a rectifier, a voltage at an output of a voltage regulator, or a combination thereof. The method further includes determining the over-voltage condition based on the monitoring; and in response to determining the over-voltage condition, regulating the voltage at the output of the rectifier in accordance with a voltage difference between the voltage at the output of the rectifier and the voltage at the output of the voltage regulator.
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