公开(公告)号：US20210054222A1

公开(公告)日：2021-02-25

申请号：US16996744

申请日：2020-08-18

Applicant: Applied Materials, Inc.

Inventor： Yingdong Luo ,  Sivapackia Ganapathiappan ,  Ashwin Murugappan Chockalingam ,  Daihua Zhang ,  Uma Sridhar ,  Daniel Redfield ,  Rajeev Bajaj ,  Nag B. Patibandla ,  Hou T. Ng ,  Sudhakar Madhusoodhanan

IPC: C09D11/107 ,  C09K3/14 ,  B24B37/24 ,  B33Y70/10 ,  B33Y80/00 ,  B33Y40/10 ,  B29C64/112 ,  B33Y10/00

Abstract: A formulation, system, and method for additive manufacturing of a polishing pad. The formulation includes monomer, dispersant, and nanoparticles. A method of preparing the formulation includes adding a dispersant that is a polyester derivative to monomer, adding metal-oxide nanoparticles to the monomer, and subjecting the monomer having the nanoparticles and dispersant to sonication to disperse the nanoparticles in the monomer.

公开(公告)号：US10692923B2

公开(公告)日：2020-06-23

申请号：US16020692

申请日：2018-06-27

Applicant: Applied Materials, Inc.

Inventor： Mingwei Zhu ,  Sivapackia Ganapathiappan ,  Boyi Fu ,  Hou T. Ng ,  Nag B. Patibandla

IPC: H01L21/66 ,  H01L33/48 ,  H01L27/15 ,  H01L33/00 ,  H01L21/683 ,  H01L23/00 ,  H01L25/075

Abstract: An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate.

公开(公告)号：US10399201B2

公开(公告)日：2019-09-03

申请号：US15296015

申请日：2016-10-17

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Daniel Redfield ,  Rajeev Bajaj ,  Mahendra C. Orilall ,  Hou T. Ng ,  Jason G. Fung ,  Mayu Yamamura

IPC: B24D3/28 ,  C09D4/00 ,  C09G1/16 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D11/00 ,  B24D11/04 ,  B33Y10/00 ,  B33Y80/00 ,  B29C64/112 ,  B29C35/08 ,  B29K33/04 ,  B33Y70/00

Abstract: Embodiments herein relate to advanced polishing pads with tunable chemical, material and structural properties, and manufacturing methods related thereto. According to one or more embodiments herein, a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments herein thus may provide an advanced polishing pad having discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments herein further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US20180315793A1

公开(公告)日：2018-11-01

申请号：US16020692

申请日：2018-06-27

Applicant: Applied Materials, Inc.

Inventor： Mingwei Zhu ,  Sivapackia Ganapathiappan ,  Boyi Fu ,  Hou T. Ng ,  Nag B. Patibandla

IPC: H01L27/15 ,  H01L23/00 ,  H01L33/48 ,  H01L21/66

Abstract: An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate.

公开(公告)号：US20180304538A1

公开(公告)日：2018-10-25

申请号：US15809965

申请日：2017-11-10

Applicant: Applied Materials, Inc.

Inventor： Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan

IPC: B29C64/393 ,  B29C64/227 ,  B29C64/209 ,  B29C64/245 ,  B29C64/277 ,  B33Y30/00 ,  B33Y50/02

Abstract: An additive manufacturing apparatus includes a platform, a first support, a first actuator to create relative motion along a first axis such that the first support scans across the platform, one or more printheads supported on the first support above the platform and configured to dispense successive layers of feed material to form a polishing pad, a second support, a second actuator to create relative motion along a second axis substantially perpendicular to the first axis such that the second support scans across the platform in a direction perpendicular to the first axis, and a plurality of individually addressable energy sources supported on the second support above the platform, and a controller. The energy sources are arranged in an array that extends at least along the first axis and configured to emit radiation toward the platform.

公开(公告)号：US20180093411A1

公开(公告)日：2018-04-05

申请号：US15717617

申请日：2017-09-27

Applicant: Applied Materials, Inc.

Inventor： Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan

IPC: B29C64/112 ,  B24B37/20 ,  B24B37/24 ,  B29C41/02 ,  B29C64/245 ,  B29C64/264 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00

CPC classification number: B29C64/112 ,  B24B37/20 ,  B24B37/24 ,  B29C41/02 ,  B29C64/245 ,  B29C64/264 ,  B29C70/78 ,  B29K2075/00 ,  B29L2031/736 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00

Abstract: An apparatus for fabricating a polishing pad includes a conveyor belt, a casting station to form a layer of the polishing pad and to deliver the layer of the polishing pad onto the conveyor belt, a printing station including one or more printheads configured to deposit one or more layers to form a polishing pad, a motor to drive the conveyor belt, and an energy source. The one or more printheads include a plurality of nozzles configured to eject droplets of a liquid polishing pad material precursor on the layer formed by the casting station. The motor drives the conveyor belt while the one or more printheads eject the droplets such that droplets provide a layer of polishing pad material precursor. The energy source at least partially cure the pad material precursor to form a solidified layer of polishing pad material.