公开(公告)号：US10525657B2

公开(公告)日：2020-01-07

申请号：US15078097

申请日：2016-03-23

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Garrett Andrew Piech ,  Kristopher Allen Wieland

IPC: B23B3/24 ,  B32B3/26 ,  B32B17/06

Abstract: A gas permeable glass window, suitable for use with liquid interface additive manufacturing, has an optically transparent glass article greater than about 0.5 millimeters in thickness defining a first surface and a second surface. A plurality of gas channels are disposed through the article from the first surface to the second surface. The gas channels occupy less than about 1.0% of a surface area of the article and are configured such that the article has a gas permeability between about 10 barrers and about 2000 barrers.

公开(公告)号：US20190321921A1

公开(公告)日：2019-10-24

申请号：US16377947

申请日：2019-04-08

Applicant: Corning Incorporated

Inventor： Bertrand Paris ,  Garrett Andrew Piech ,  Kristopher Allen Wieland

IPC: B23K26/382 ,  C03C15/00 ,  C03C23/00 ,  C04B41/00 ,  C04B41/53 ,  C04B41/45 ,  B23K26/00 ,  B23K26/16 ,  B23K26/53

Abstract: Methods for forming holes in a substrate by reducing back reflections of a quasi-non-diffracting beam into the substrate are described herein. In some embodiments, a method of processing a substrate having a first surface and a second surface includes applying an exit material to the second surface of the substrate, wherein a difference between a refractive index of the exit material and a refractive index of the substrate is 0.4 or less, and focusing a pulsed laser beam into a quasi-non-diffracting beam directed into the substrate such that the quasi-non-diffracting beam enters the substrate through the first surface. The substrate is transparent to at least one wavelength of the pulsed laser beam. The quasi-non-diffracting beam generates an induced absorption within the substrate that produces a damage track within the substrate.

公开(公告)号：US10442719B2

公开(公告)日：2019-10-15

申请号：US14530410

申请日：2014-10-31

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Albert Roth Nieber ,  Garrett Andrew Piech ,  Helmut Schillinger ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: B23K26/02 ,  B23K26/08 ,  C03B33/02 ,  C03B33/08 ,  C03B33/09 ,  B23K26/53 ,  B24B9/10 ,  B23K26/04 ,  B23K26/035 ,  B23K26/361 ,  B23K26/0622 ,  B23K26/362 ,  B23K26/402 ,  C03C21/00 ,  B23K103/00

Abstract: Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a CO2 laser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or CO2 lasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.

公开(公告)号：US10424606B1

公开(公告)日：2019-09-24

申请号：US15972628

申请日：2018-05-07

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  Daniel Wayne Levesque, Jr. ,  Robert George Manley ,  Garrett Andrew Piech ,  Rajesh Vaddi ,  Heather Nicole Vanselous

IPC: H01L27/12 ,  H01L27/15

Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for reducing substrate surface disruption during via formation.

公开(公告)号：US20190177203A1

公开(公告)日：2019-06-13

申请号：US16276909

申请日：2019-02-15

Applicant: Corning Incorporated

Inventor： Moussa N'Gom ,  Garrett Andrew Piech ,  James Joseph Watkins ,  Kristopher Allen Wieland ,  Chad Michael Wilcox

IPC: C03B33/02 ,  B23K26/359 ,  B23K26/402 ,  B23K26/53 ,  B23K26/38 ,  B23K26/0622

Abstract: Systems and methods for laser-cutting thermally tempered substrates are disclosed. In one embodiment, a method of separating a thermally tempered substrate includes directing a laser beam focal line such that at least a portion of the laser beam focal line is within a bulk of the thermally tempered substrate. The focused pulsed laser beam is pulsed to form a sequence of pulse bursts comprising one or more sub-pulses. The laser beam focal line produces a damage track within the bulk of the tempered substrate along the laser beam focal line. Relative motion is provided between the focused pulsed laser beam and the tempered substrate such that the pulsed laser beam forms a sequence of damage tracks within the tempered substrate. Individual damage tracks of the sequence of damage tracks are separated by a lateral spacing, and one or more microcracks connect adjacent damage tracks of the sequence of damage tracks.

公开(公告)号：US10293436B2

公开(公告)日：2019-05-21

申请号：US14535800

申请日：2014-11-07

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Garrett Andrew Piech ,  Shyamala Shanmugam ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: B23K26/04 ,  B23K26/06 ,  B23K26/38 ,  B23K26/53 ,  B23K26/55 ,  B32B17/06 ,  C03B33/02 ,  C03B33/09 ,  C03C15/00 ,  C03C17/00 ,  B23K26/384 ,  B23K26/402 ,  B23K26/0622 ,  C09K13/00 ,  B23K103/00

Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

公开(公告)号：US10233112B2

公开(公告)日：2019-03-19

申请号：US15251605

申请日：2016-08-30

Applicant: Corning Incorporated

Inventor： Thomas Hackert ,  Sasha Marjanovic ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: C03B33/08 ,  B23K26/00 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/53 ,  C03B33/02 ,  C03B33/04 ,  C03B33/09 ,  B23K26/382 ,  B23K26/55 ,  B23K26/359 ,  B23K103/00

Abstract: The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam to promote full separation about the perforated line.

公开(公告)号：US10183885B2

公开(公告)日：2019-01-22

申请号：US15496393

申请日：2017-04-25

Applicant: Corning Incorporated

Inventor： Dana Craig Bookbinder ,  Stephan Lvovich Logunov ,  Sasha Marjanovic ,  Albert Roth Nieber ,  Garrett Andrew Piech ,  Kamjula Pattabhirami Reddy ,  Pushkar Tandon ,  Sergio Tsuda ,  Natesan Venkataraman ,  Robert Stephen Wagner

IPC: C03B33/02 ,  C03B25/087 ,  C03B33/07 ,  B23K26/53 ,  B23K26/0622 ,  B23K26/402 ,  C03B17/06 ,  C03B33/09 ,  B23K26/359 ,  B23K103/00 ,  B23K103/16

Abstract: The present disclosure relates to a process for cutting and separating arbitrary shapes of thin substrates of transparent materials, particularly tailored composite fusion drawn glass sheets, and the disclosure also relates to a glass article prepared by the method. The developed laser method can be tailored for manual separation of the parts from the panel or full laser separation by thermally stressing the desired profile. The self-separation method involves the utilization of an ultra-short pulse laser that can be followed by a CO2 laser (coupled with high pressure air flow) for fully automated separation.

公开(公告)号：US10134657B2

公开(公告)日：2018-11-20

申请号：US15630363

申请日：2017-06-22

Applicant: CORNING INCORPORATED

Inventor： Daniel Wayne Levesque, Jr. ,  Garrett Andrew Piech ,  Aric Bruce Shorey

IPC: H01L29/40 ,  H01L23/48 ,  H01L21/762 ,  H01L21/311 ,  H01L21/768 ,  H01L21/306 ,  H01L21/268 ,  H01L21/683 ,  B81B7/00 ,  B81C1/00

Abstract: A process comprises bonding a semiconductor wafer to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. After the bonding, a damage track is formed in the inorganic wafer using a laser that emits the wavelength of light. The damage track in the inorganic wafer is enlarged to form a hole through the inorganic wafer by etching. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer. An article is also provided, comprising a semiconductor wafer bonded to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. The inorganic wafer has a hole formed through the inorganic wafer. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer.

公开(公告)号：US20180057390A1

公开(公告)日：2018-03-01

申请号：US15560390

申请日：2016-03-23

Applicant: Corning Incorporated

Inventor： Thomas Hackert ,  Xinghua Li ,  Sasha Marjanovic ,  Moussa N'Gom ,  David Andrew Pastel ,  Garrett Andrew Piech ,  Daniel Schnitzler ,  Robert Stephen Wagner ,  James Joseph Watkins

IPC: C03B33/02 ,  B23K26/364 ,  C03C3/093

CPC classification number: C03B33/0222 ,  B23K26/364 ,  B23K26/53 ,  B23K2103/54 ,  C03B33/0215 ,  C03C3/093 ,  Y02P40/57

Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >0.25 m/sec, to cut sharp radii outer corners (