利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

189 条记录 (耗时 0.069 秒)

    Monitoring method and system for determining airflow rate through and heat removal rate of an air-conditioning unit
    81.
    发明授权
    Monitoring method and system for determining airflow rate through and heat removal rate of an air-conditioning unit 有权
    用于确定空调机组的通风速率和除热率的监控方法和系统

    公开(公告)号：US07878007B2

    公开(公告)日：2011-02-01

    申请号：US12031982

    申请日：2008-02-15

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

    IPC分类号： F25B49/00 ,  G01K13/00

    CPC分类号： F24F11/0001 ,  G06F1/20 ,  H05K7/20836

    摘要： Monitoring method and system are provided for dynamically determining airflow rate through and heat removal rate of an air-conditioning unit, such as a computer room air-conditioning unit. The method includes: sensing inlet and outlet temperatures of fluid passing through a heat exchanger associated with the air-conditioning unit; sensing air temperature at an air inlet side of the heat exchanger; automatically determining at least one of airflow rate through or heat removal rate of the air-conditioning unit, the automatically determining employing the sensed inlet temperature and outlet temperature of fluid passing through the heat exchanger, and the sensed air temperature at the air inlet side of the heat exchanger; and outputting the determined airflow rate through or heat removal rate of the air-conditioning unit. In one embodiment, the heat exchanger is an auxiliary air-to-air heat exchanger, and in another embodiment, the heat exchanger is the air-to-liquid heat exchanger of the air-conditioner.

    摘要翻译： 提供监测方法和系统，用于动态地确定诸如计算机室空调单元之类的空调单元的空气流量和排热率。 该方法包括：检测通过与空调单元相关联的热交换器的流体的入口和出口温度; 感测热交换器的空气入口侧的空气温度; 自动确定空气调节单元的气流速率或排热速率中的至少一个，使用感测到的通过热交换器的流体的入口温度和出口温度以及感测到的空气入口侧的空气温度的自动确定 热交换器; 并输出所确定的空气流量通过或所述空调单元的除热率。 在一个实施例中，热交换器是辅助空气 - 空气热交换器，在另一个实施例中，热交换器是空调器的空气 - 液体热交换器。

    System and method for facilitating cooling of a liquid-cooled electronics rack
    82.
    发明授权
    System and method for facilitating cooling of a liquid-cooled electronics rack 失效
    用于促进液冷电子机架的冷却的系统和方法

    公开(公告)号：US07757506B2

    公开(公告)日：2010-07-20

    申请号：US11942207

    申请日：2007-11-19

    申请人： Michael J. Ellsworth, Jr. ,  Francis R. Krug, Jr. ,  Robert K. Mullady ,  Roger R. Schmidt ,  Edward J. Seminaro

    发明人： Michael J. Ellsworth, Jr. ,  Francis R. Krug, Jr. ,  Robert K. Mullady ,  Roger R. Schmidt ,  Edward J. Seminaro

    IPC分类号： F25D23/12

    CPC分类号： H05K7/2079 ,  H05K7/20772

    摘要： Systems and methods are provided for cooling an electronics rack, which includes a heat-generating electronics subsystem across which air flows from an air inlet to an air outlet side of the rack. First and second modular cooling units (MCUs) are associated with the rack and configured to provide system coolant to the electronics subsystem for cooling thereof. System coolant supply and return manifolds are in fluid communication with the MCUs for facilitating providing of system coolant to the electronics subsystem, and to an air-to-liquid heat exchanger associated with the rack for cooling air passing through the rack. A controller monitors the system coolant and automatically shuts off flow of system coolant through the heat exchanger, using at least one isolation valve, upon detection of failure at one of the MCUs, while allowing the remaining operational MCU to provide system coolant to the electronics subsystem for liquid cooling thereof.

    摘要翻译： 提供了用于冷却电子机架的系统和方法，该电子机架包括发热电子系统，空气从空气入口流到机架的空气出口侧。 第一和第二模块化冷却单元（MCU）与机架相关联并且被配置为向电子子系统提供系统冷却剂用于冷却。 系统冷却剂供应和返回歧管与MCU流体连通，以便于向电子系统提供系统冷却剂，以及与机架相关联的空气 - 液体热交换器，用于冷却通过机架的空气。 控制器监测系统冷却液，并且在检测到一个MCU的故障时，使用至少一个隔离阀自动关闭系统冷却剂流过热交换器的流量，同时允许剩余的操作MCU向系统冷却剂提供电子子系统 用于液体冷却。

    Monitoring method and system for determining rack airflow rate and rack power consumption
    83.
    发明授权
    Monitoring method and system for determining rack airflow rate and rack power consumption 有权
    确定机架气流速率和机架功耗的监控方法和系统

    公开(公告)号：US07707880B2

    公开(公告)日：2010-05-04

    申请号：US12031976

    申请日：2008-02-15

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

    IPC分类号： G01F1/68

    CPC分类号： G01F1/68 ,  G01F1/34 ,  G01F25/0007 ,  H05K7/20836

    摘要： Monitoring method and system are provided for dynamically determining rack airflow rate and rack power consumption employing a heat exchanger disposed at an air outlet side of the electronics rack. The method includes: sensing air temperature at the air outlet side of the electronics rack, sensing coolant temperature at a coolant inlet and coolant temperature at a coolant outlet of the heat exchanger, and determining airflow rate through the electronics rack; and outputting the determined airflow rate through the electronics rack. The determining employs the sensed air temperature at the air outlet side of the rack and the sensed coolant temperatures at the coolant inlet and outlet of the heat exchanger. In one embodiment, the heat exchanger is an air-to-air heat exchanger, and in another embodiment, the heat exchanger is an air-to-liquid heat exchanger.

    摘要翻译： 提供监测方法和系统，用于使用布置在电子机架的空气出口侧的热交换器动态地确定机架气流速率和机架功率消耗。 该方法包括：感测电子机架的空气出口侧的空气温度，感测冷却剂入口处的冷却剂温度和在热交换器的冷却剂出口处的冷却剂温度，以及确定通过电子机架的气流速率; 并且通过电子机架输出确定的气流速率。 该确定采用在机架的空气出口侧处的感测到的空气温度和在热交换器的冷却剂入口和出口处感测到的冷却剂温度。 在一个实施例中，热交换器是空气 - 空气热交换器，在另一个实施例中，热交换器是空气 - 液体热交换器。

    Liquid-based cooling system for cooling a multi-component electronics system
    84.
    发明授权
    Liquid-based cooling system for cooling a multi-component electronics system 有权
    液体冷却系统，用于冷却多组件电子系统

    公开(公告)号：US07518871B2

    公开(公告)日：2009-04-14

    申请号：US12168267

    申请日：2008-07-07

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20 ,  F28F7/00

    CPC分类号： H05K7/20009 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20772

    摘要： A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes. When in use, the multiple liquid-cooled cold plates engage respective electronic components of the electronics system, and liquid coolant is distributed through the liquid-coolant header subassembly and plurality of coolant-carrying tubes to the cold plates for removal of heat generated by the respective electronic components.

    摘要翻译： 提供了一种用于冷却电子系统的系统。 冷却系统包括预先配置用于冷却电子系统的多个电子部件的单片结构，当与其耦合时。 整体结构包括多个液冷冷板，其配置和间隔设置，以耦合到相应的电子部件; 多个与多个液冷冷却板流体连通地冶金结合的冷却剂供给管，以及与多个冷却剂供给管道流体连通地冶金结合的液体 - 冷却剂集管组件。 头部组件包括冶金地结合到冷却剂供应管的冷却剂供应头和与冷却剂返回管冶金结合的冷却剂回流头。 当使用时，多个液冷冷板接合电子系统的各个电子部件，并且液体冷却剂通过液体 - 冷却剂集管子组件和多个冷却剂供给管分配到冷板以除去由 各自的电子元件。

    Liquid-based cooling system for cooling a multi-component electronics system
    85.
    发明授权
    Liquid-based cooling system for cooling a multi-component electronics system 有权
    液体冷却系统，用于冷却多组件电子系统

    公开(公告)号：US07420808B2

    公开(公告)日：2008-09-02

    申请号：US11539910

    申请日：2006-10-10

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20 ,  F28F7/00

    CPC分类号： H05K7/20009 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20772

    摘要： A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes. When in use, the multiple liquid-cooled cold plates engage respective electronic components of the electronics system, and liquid coolant is distributed through the liquid-coolant header subassembly and plurality of coolant-carrying tubes to the cold plates for removal of heat generated by the respective electronic components.

    摘要翻译： 提供了一种用于冷却电子系统的系统。 冷却系统包括预先配置用于冷却电子系统的多个电子部件的单片结构，当与其耦合时。 整体结构包括多个液冷冷板，其配置和间隔设置，以耦合到相应的电子部件; 多个与多个液冷冷却板流体连通地冶金结合的冷却剂供给管，以及与多个冷却剂供给管道流体连通地冶金结合的液体 - 冷却剂集管组件。 头部组件包括冶金地结合到冷却剂供应管的冷却剂供应头和与冷却剂返回管冶金结合的冷却剂回流头。 当使用时，多个液冷冷板接合电子系统的各个电子部件，并且液体冷却剂通过液体 - 冷却剂集管子组件和多个冷却剂输送管分配到冷板以除去由 各自的电子元件。

    Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins
    89.
    发明授权
    Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins 有权
    冷却装置，冷却电子模块及其采用集成歧管和多个导热翅片的制造方法

    公开(公告)号：US07233494B2

    公开(公告)日：2007-06-19

    申请号：US11124064

    申请日：2005-05-06

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a plurality of thermally conductive fins coupled to and projecting away from a surface to be cooled. The fins facilitate transfer of heat from the surface to be cooled. The apparatus further includes an integrated manifold having a plurality of inlet orifices for injecting coolant onto the surface to be cooled, and a plurality of outlet openings for exhausting coolant after impinging on the surface to be cooled. The inlet orifices and the outlet openings are interspersed in a common surface of the integrated manifold. Further, the integrated manifold and the surface to be cooled are disposed with the common surface of the manifold and the surface to be cooled in spaced, opposing relation, and with the plurality of thermally conductive fins disposed therebetween.

    摘要翻译： 提供冷却装置和制造方法以便于从发热电子装置中除去热量。 冷却装置包括耦合到待冷却表面并远离待冷却表面的多个导热翅片。 散热片有助于从要冷却的表面传递热量。 该装置还包括具有多个用于将冷却剂喷射到待冷却表面上的入口孔的集成歧管，以及用于在撞击待冷却表面之后排出冷却剂的多个出口开口。 入口孔和出口开口散布在集成歧管的共同表面中。 此外，集成歧管和要冷却的表面与歧管的共同表面和待冷却的表面以间隔相对的关系设置，并且多个导热翅片设置在它们之间。

    Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins
    90.
    发明授权
    Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins 失效
    电子设备冷却组件和使用保持多个导热销的弹性支撑材料的方法

    公开(公告)号：US07206203B2

    公开(公告)日：2007-04-17

    申请号：US10873432

    申请日：2004-06-22

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Roger R. Schmidt

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Roger R. Schmidt

    IPC分类号： H05K7/20 ,  H01L23/34 ,  H02G3/03 ,  F28F7/00

    CPC分类号： H01L23/4336 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    摘要： An electronic device cooling assembly and fabrication method are provided which include a manifold with an orifice for injecting a cooling liquid onto a surface to be cooled, and an elastic pin support material with an opening aligned to the orifice of the manifold. Multiple thermally conductive pins are mounted within the support material, extending therefrom, and are sized to physically contact the surface to be cooled. The support material has a thickness and compliance which facilitates thermal interfacing of the pins to the surface by allowing second ends thereof to move vertically and tilt. The second end of each pin has a planar surface which is normal to an axis of the pin, and the support material facilitates the planar surfaces of the second pin ends establishing planar contact with the surface to be cooled, notwithstanding that the surface may be other than planar.

    摘要翻译： 提供了一种电子设备冷却组件和制造方法，其包括具有用于将冷却液体喷射到待冷却表面上的孔口的歧管以及具有与歧管孔口对准的开口的弹性销支撑材料。 多个导热销安装在支撑材料内，从其延伸，并且其尺寸设计成物理接触要冷却的表面。 支撑材料具有厚度和顺从性，其通过允许其第二端垂直移动和倾斜来促进销与表面的热接合。 每个销的第二端具有垂直于销的轴线的平坦表面，并且支撑材料有助于第二销端的平面表面与待冷却的表面建立平面接触，尽管表面可以是其他 比平面。