公开(公告)号：US20190259632A1

公开(公告)日：2019-08-22

申请号：US15899661

申请日：2018-02-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Phillip D. ISAACS ,  Christopher M. MARROQUIN ,  Daren SIMMONS ,  Frank L. POMPEO ,  Jason R. EAGLE ,  Mark K. HOFFMEYER ,  Michael J. ELLSWORTH, JR. ,  Prabjit SINGH ,  Steve OSTRANDER

IPC: H01L21/48 ,  H01L23/367 ,  B21D53/02 ,  H05K7/20 ,  H01L23/40

Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.

公开(公告)号：US20180368285A1

公开(公告)日：2018-12-20

申请号：US16111359

申请日：2018-08-24

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Amilcar R. ARVELO ,  Alan F. BENNER ,  Michael J. ELLSWORTH, JR. ,  Eric J. McKEEVER

IPC: H05K7/20 ,  F16L37/107 ,  F16L15/08

Abstract: Coupling assemblies for connecting fluid-carrying components are provided. The coupling assemblies include, for instance: a socket fitting with a first opening and a second opening in fluid communication through the fitting, the first opening being sized to accommodate a first fluid-carrying component, and the second opening being sized to accommodate a second fluid-carrying component; a sleeve, the sleeve encircling the socket fitting and being rotatable relative to the fitting, and the sleeve including a first locking feature; and a second locking feature associated with one of the fluid-carrying components. The second locking feature is positioned and sized to engage the first locking feature of the sleeve when the one fluid-carrying component is inserted into the socket fitting. Once engaged, rotating of the sleeve locks the first and second locking features together to secure the one fluid-carrying component to the socket fitting.

公开(公告)号：US20180295754A1

公开(公告)日：2018-10-11

申请号：US16005823

申请日：2018-06-12

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC: H05K7/20 ,  G05B15/02 ,  G05D23/19

CPC classification number: H05K7/20836 ,  G05B15/02 ,  G05D23/1932 ,  H05K7/2079

Abstract: Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

公开(公告)号：US20180077824A1

公开(公告)日：2018-03-15

申请号：US15819487

申请日：2017-11-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Michael J. ELLSWORTH, JR. ,  Milnes P. DAVID ,  Dustin W. DEMETRIOU ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/20436 ,  H05K7/20545 ,  H05K7/20709 ,  H05K7/20727 ,  H05K7/20754 ,  H05K7/20818

Abstract: A method of providing a cooling apparatus for cooling a heat-dissipating component(s) of an electronics enclosure includes: providing a thermal conductor to couple to the heat-dissipating component(s), the thermal conductor including a first conductor portion coupled to the heat-dissipating component, and a second conductor portion to position along an air inlet side of the electronics enclosure, so that in operation, the first conductor portion transfers heat from the component(s) to the second conductor portion; coupling at least one air-cooled heat sink to the second conductor portion to facilitate transfer of heat to airflow ingressing into the enclosure; providing at least one thermoelectric device coupled to the first or second conductor portion to facilitate providing active auxiliary cooling to the thermal conductor; and providing a controller to control operation of the thermoelectric device(s) and to selectively switch operation of the cooling apparatus between active and passive cooling modes.

公开(公告)号：US20170127576A1

公开(公告)日：2017-05-04

申请号：US15175331

申请日：2016-06-07

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Milnes P. DAVID ,  Dustin W. DEMETRIOU ,  Michael J. ELLSWORTH, JR. ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC: H05K7/20

CPC classification number: H05K7/20781 ,  H05K7/20127 ,  H05K7/20236 ,  H05K7/203 ,  H05K7/20318 ,  H05K7/2039 ,  H05K7/20772 ,  H05K7/20809

Abstract: Cooling apparatuses and methods of fabrication are provided which facilitate immersion-cooling of an electronic component(s). The cooling apparatus includes a drawer-level enclosure sized to reside within an electronics rack. The drawer-level enclosure includes a compartment which accommodates one or more electronic components to be cooled. A dielectric fluid is disposed within the compartment. The dielectric fluid includes a liquid dielectric which at least partially immerses the electronic component(s) within the compartment(s). A hinged, liquid-cooled heat sink is also disposed within the compartment of the enclosure. The heat sink operatively facilitates cooling the one or more electronic components via the dielectric fluid within the compartment, and is rotatable between an operational position overlying the electronic component(s), and a service position which allows access to the electronic component(s).

公开(公告)号：US20170049010A1

公开(公告)日：2017-02-16

申请号：US14922324

申请日：2015-10-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Milnes P. DAVID ,  Dustin W. DEMETRIOU ,  Michael J. ELLSWORTH, JR. ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/20436 ,  H05K7/20545 ,  H05K7/20709 ,  H05K7/20727 ,  H05K7/20754 ,  H05K7/20818

Abstract: A method of providing a cooling apparatus for cooling a heat-dissipating component(s) of an electronics enclosure includes: providing a thermal conductor to couple to the heat-dissipating component(s), the thermal conductor including a first conductor portion coupled to the heat-dissipating component, and a second conductor portion to position along an air inlet side of the electronics enclosure, so that in operation, the first conductor portion transfers heat from the component(s) to the second conductor portion; coupling at least one air-cooled heat sink to the second conductor portion to facilitate transfer of heat to airflow ingressing into the enclosure; providing at least one thermoelectric device coupled to the first or second conductor portion to facilitate providing active auxiliary cooling to the thermal conductor; and providing a controller to control operation of the thermoelectric device(s) and to selectively switch operation of the cooling apparatus between active and passive cooling modes.

Abstract translation: 提供用于冷却电子外壳的散热部件的冷却装置的方法包括：提供热导体以耦合到散热部件，所述热导体包括耦合到所述散热部件的第一导体部分 散热部件和第二导体部分，以沿着电子外壳的空气入口侧定位，使得在操作中，第一导体部分将热量从部件传递到第二导体部分; 将至少一个风冷散热器耦合到所述第二导体部分以便于将热量传递到进入所述外壳的气流; 提供耦合到所述第一或第二导体部分的至少一个热电装置，以便于向所述热导体提供主动辅助冷却; 以及提供控制器以控制热电装置的操作并且选择性地切换冷却装置在主动和被动冷却模式之间的操作。

公开(公告)号：US20170013739A1

公开(公告)日：2017-01-12

申请号：US14870297

申请日：2015-09-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Milnes P. DAVID ,  Dustin W. DEMETRIOU ,  Michael J. ELLSWORTH, JR. ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC: H05K7/20

CPC classification number: H05K7/20781 ,  H05K7/20736 ,  H05K7/20836

Abstract: Thermoelectric-enhanced, rack-level cooling of airflow entering an electronics rack is provided by a cooling apparatus, which includes: an air-to-liquid heat exchanger; a coolant loop coupled to the heat exchanger, the coolant loop including a first loop portion and a second loop portion, where the heat exchanger exhausts heated coolant to the first loop portion and receives cooled coolant from the second loop portion. The cooling apparatus further includes a heat rejection unit and a thermoelectric heat pump(s). The heat rejection unit is coupled to the coolant loop between the first and second loop portions, and provides partially-cooled coolant to the second loop portion. The thermoelectric heat pump is disposed with the first and second loop portions coupled to opposite sides to transfer heat from the partially-cooled coolant within the second loop portion to provide the cooled coolant before entering the air-to-liquid heat exchanger.

Abstract translation: 通过冷却装置提供进入电子机架的气流的热电增强机架冷却，其包括：空气对液体热交换器; 冷却剂回路，其耦合到所述热交换器，所述冷却剂回路包括第一回路部分和第二回路部分，其中所述热交换器将加热的冷却剂排出到所述第一回路部分并且从所述第二回路部分接收冷却的冷却剂。 冷却装置还包括排热单元和热电热泵。 散热单元联接到第一和第二回路部分之间的冷却剂回路，并且向第二回路部分提供部分冷却的冷却剂。 热电热泵设置有第一和第二回路部分，其联接到相对侧，以在来自第二回路部分内的部分冷却的冷却剂中传递热量，以在进入空气至液体热交换器之前提供冷却的冷却剂。

公开(公告)号：US20160288279A1

公开(公告)日：2016-10-06

申请号：US15183104

申请日：2016-06-15

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC: B23P15/26

CPC classification number: B23P15/26 ,  F28D15/0266 ,  F28F3/00 ,  F28F3/12 ,  F28F13/00 ,  G06F1/20 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/2029 ,  H05K7/20772 ,  Y10T29/4935

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

公开(公告)号：US20160186896A1

公开(公告)日：2016-06-30

申请号：US15063548

申请日：2016-03-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael J. ELLSWORTH, JR. ,  Prabjit SINGH

IPC: F16L11/10 ,  F16L11/12

CPC classification number: F16L11/04 ,  F16L11/085 ,  F16L11/10 ,  F16L11/12 ,  F16L11/122 ,  F16L33/2071 ,  F16L33/30 ,  F16L35/00 ,  G06F1/20 ,  H05K7/20 ,  H05K7/20272 ,  H05K7/20781 ,  Y10T29/49002 ,  Y10T29/4994

Abstract: Formed hose configurations are provided which include an innermost elastomer layer, a first fiber-reinforcement region, and multiple second fiber-reinforcement regions. The first fiber-reinforcement region has a first fiber-reinforcement density, and is disposed, at least in part, at a bend region of the formed hose, and the multiple second fiber-reinforcement regions have a second fiber-reinforcement density, and are disposed at least at the first and second end regions of the formed hose. The second fiber-reinforcement density is greater than the first fiber-reinforcement density, and results in the first and second ends of the formed hose being less radially-deformable than the bend region of the hose. This facilitates providing a mechanical fluid-tight connection with a hose barb fitting when the formed hose is slid over the hose barb fitting, absent any clamp over the formed hose and hose barb fitting connection.

公开(公告)号：US20150359139A1

公开(公告)日：2015-12-10

申请号：US14826433

申请日：2015-08-14

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC: H05K7/20

CPC classification number: H05K7/20218 ,  H05K7/2039 ,  H05K7/20772 ,  Y10T29/4935

Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from an electronic component(s). The cooling apparatus includes a liquid-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a region of reduced cross-sectional coolant flow area. The heat sink includes a coolant inlet and outlet in fluid communication with the compartment, and the region of reduced cross-sectional coolant flow area provides an increased effective heat transfer coefficient between a main heat transfer surface of the conductive structure and the coolant. The cooling apparatus further includes a coolant loop coupled to the coolant inlet and outlet to facilitate flow of coolant through the coolant-carrying compartment, and a coolant filter positioned to filter contaminants from the coolant passing through the heat sink. The coolant filter has a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area.