摘要:
This invention relates to a novel thermoplastic and amorphous polyimide which is readily soluble in organic solvent, a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the thermoplastic polyimide and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition, a polyimide-based composite obtained by molding the above soluble and thermoplastic polyimide in combination with a fibrous reinforcement, and a fibrous reinforcement having a surface modified with the above polyimide. The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein m and n are individually an integer of 0 or 1, and R is ##STR2## The polyimide of the invention is essentially amorphous, excellent in melt flow stability in the decreased temperature as compared with conventionally known polyimide and has greatly improved processability. The polyimide of the invention obtained by using a novel aromatic diamino compound as a monomer can control various properties such as melt flow ability and solubility in solvents by side chains and not by principal chain of polyimide. Thus, excellent melt flow property and solubility in solvents can be obtained while maintaining high heat resistance and adhesive property which are derived from benzophenone structure of the diamino compound of the the invention.
摘要:
Novel thermoset polyimide and composite materials comprising the thermoset polyimides and a fibrous reinforcement are prepared according to this invention. The thermoset polyimides are obtained by heat-treating a linear polyamic acid or a linear polyimide prepared by using 4,4'-bis(3-aminophenoxy)biphenyl and pyromellitic dianhydride as essential monomers or by adding 4,4'-diaminodiphenyl ether or 3,3',4,4'-biphenyltetracarboxylic dianhydride to the essential monomers and by end-capping the molecular chain end with an aromatic dicarboxylic anhydride having a carbon-carbon triple bond. The thermoset polyimides have essential excellent properties of thermoplastic polyimide and additionally has enhanced heat resistance and improved mechanical properties. The thermoset polyimide can be used to provide various kinds of composite materials for aircraft matrices, electric and electronic appliances and others.
摘要:
The heat-sensitive recording material disclosed comprises a colorless or pale colored dyestuff precursor, one or more salicylic acid derivative of the formula (1) or metal salt of the derivative and an aliphatic amide compound having 18.about.60 carbon atoms in molecular structure, and is excellent in thermal response and preservation stability of white portions and images. ##STR1## wherein X.sub.1 and X.sub.2 are a hydrogen atom, a halogen atom, an alkyl group, an alkoxy group, an aralkyl group or an aryl group, Y.sub.1 and Y.sub.2 are an oxygen atom or a sulfur atom, R.sub.1 is a hydrogen atom, an alkyl group, an aralkyl group or an aryl group, and R.sub.2 is an alkyl group, an alkenyl group, an aralkyl group or an aryl group.
摘要:
A preparation process of aliphatic polyester having a weight average molecular weight of 15,000 or more by conducting a direct polycondensation reaction of an aliphatic polyhydric alcohol or a mixed aliphatic polyhydric alcohol and an aliphatic polybasic acid or a mixed aliphatic polybasic acid, or additionally a hydroxycarboxylic acid or a mixed hydroxycarboxylic acid or an oligomer of the hydroxycarboxylic acid in a reaction mixture containing an organic solvent.The aliphatic polyester thus obtained contains an extremely small amount of impurities, has low color and can exhibit satisfactory strength in the form of films, filaments and other shaped articles.
摘要:
A process for preparing polyhydroxycarboxylic acid by conducting a dehydration condensation of a hydroxycarboxylic acid or an oligomer thereof in a reaction mixture containing an organic solvent substantially in the absence of water and the polyhydroxycarboxylic acid thus obtained. The process provides polyhydroxycarboxylic acid having excellent properties and processability.
摘要:
The heat resistant adhesive of the invention comprises polyamic acid and/or polyimide which are prepared by using 1,3-bis(3-aminophenoxy)benzene as an aromatic diamine component and 3,3',4,4'-biphenyltetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride and/or 3,3',4,4'-diphenylethertetracarboxylic dianhydride as tetracarboxylic acid dianhydrides, and further by blocking the polymer chain end with dicarboxylic anhydride or a monoamine compound; or comprises a polyimide solution containing the polyimide in a good solvent.The adhesive of the invention is a heat-resistant adhesive capable of adhering under mild temperature/mild pressure conditions. The adhesive of polyimide solution can provide desired adhesion by simple procedures such as applying to the adherend and heating under pressure and exhibits excellent adhesive strength. Consequently, the heat-resistant adhesive of the invention is very useful for the adhesion of structural and electronic materials and other industrial materials.
摘要:
In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.
摘要:
A favorably processable polyimide which has recurring structural units represented by the formula (I): ##STR1## wherein R is a tetravalent radical having from 2 to 27 carbon atoms and is selected from the group consisting of an aliphatic radical, alicyclic radical, monoaromatic radical, condensed polyaromatic radical and noncondensed aromatic radical connected to each other with a direct bond or a bridge member, and is blocked at the polymer chain end with aromatic dicarboxylic anhydride represented by the formula (II): ##STR2## wherein X is a divalent radical selected from the group consisting of a monoaromatic radical having from 6 to 27 carbon atoms, condensed polyaromatic radical and noncondensed aromatic radical connected to each other with a direct bond or a bridge member.
摘要翻译:具有由式(I)表示的重复结构单元的有利的可加工聚酰亚胺:(*化学结构*)(I)其中R是具有2至27个碳原子的四价基团,并且选自脂族基团 ,脂环族基团,单芳族基团,缩合多芳族基团和非缩合芳族基团,其与直接键合或桥连构件相互连接,并且在聚合物链端用由式(II)表示的芳族二羧酸酐封闭:(* CHEMICAL 结构*)(II)其中X是选自具有6至27个碳原子的单芳族基团的二价基团,缩合的多芳族基团和未缩合的芳香基团彼此直接连接或桥接成员。
摘要:
A hydrazone compound represented by the following formula (I): ##STR1## wherein R.sub.1 and R.sub.2 each are an aryl group or collectively with the carbon to which they are attached form a polycyclic group; R.sub.3 represents a hydrogen or halogen atom or an alkyl or phenyl group; and R.sub.4 and R.sub.5 each represent an alkyl, aralkyl or aryl group, with the proviso that at least one of R.sub.4 and R.sub.5 is an aryl group, is useful as a charge-transporting material in an electrophotographic photoreceptor and are produced by condensing the corresponding aldehyde with the corresponding H.sub.2 N--NR.sub.4 R.sub.5 hydrazine.
摘要:
Disclosed are a crystal of a fluoran compound having the formula (I) comprising exhibiting high peaks at diffraction angles (2.theta.) of 7.5.degree. and 17.0.degree. and relatively high peaks at diffraction angles (2.theta.) of 15.1.degree., 19.1.degree., 21.5.degree. and 25.3.degree. in an X-ray diffraction diagram by the Cu-K.alpha. beam and a crystal of a fluoran compound having the formula (II) comprising exhibiting high peaks at diffraction angles (2.theta.) of 5.5.degree. and 19.2.degree. in an X-ray diffraction diagram by the Cu-K.alpha. beam, which is useful as a color forming compound in recording materials. ##STR1##