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公开(公告)号:US08896120B2
公开(公告)日:2014-11-25
申请号:US12768267
申请日:2010-04-27
申请人: Lawrence A. Clevenger , Maxime Darnon , Qinghuang Lin , Anthony D. Lisi , Satyanarayana V. Nitta
发明人: Lawrence A. Clevenger , Maxime Darnon , Qinghuang Lin , Anthony D. Lisi , Satyanarayana V. Nitta
IPC分类号: H01L23/48 , H01L21/768 , H01L21/02 , H01L21/31 , H01L21/027 , H01L23/522
CPC分类号: H01L21/76829 , H01L21/02126 , H01L21/02274 , H01L21/02282 , H01L21/02318 , H01L21/0276 , H01L21/31 , H01L21/7682 , H01L21/76825 , H01L23/5222 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要: Methods for producing air gap-containing metal-insulator interconnect structures for VLSI and ULSI devices using a photo-patternable low k material as well as the air gap-containing interconnect structure that is formed are disclosed. More particularly, the methods described herein provide interconnect structures built in a photo-patternable low k material in which air gaps of different depths are defined by photolithography in the photo-patternable low k material. In the methods of the present invention, no etch step is required to form the air gaps. Since no etch step is required in forming the air gaps within the photo-patternable low k material, the methods disclosed in this invention provide highly reliable interconnect structures.
摘要翻译: 公开了使用可光图案化的低k材料制造用于VLSI和ULSI器件的含气隙的金属 - 绝缘体互连结构的方法以及形成的含气隙的互连结构。 更具体地,本文所述的方法提供了内置于可光图案化的低k材料中的互连结构,其中不同深度的气隙通过光刻图案中的低k材料中的光刻来定义。 在本发明的方法中,不需要蚀刻步骤来形成气隙。 由于在形成可光图案化的低k材料内的气隙中不需要蚀刻步骤,所以本发明公开的方法提供了高度可靠的互连结构。
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公开(公告)号:US08486751B2
公开(公告)日:2013-07-16
申请号:US12952465
申请日:2010-11-23
申请人: Lawrence A. Clevenger , Harold J. Hovel , Rainer Klaus Krause , Kevin S. Petrarca , Gerd Pfeiffer , Kevin M. Prettyman , Brian C. Sapp
发明人: Lawrence A. Clevenger , Harold J. Hovel , Rainer Klaus Krause , Kevin S. Petrarca , Gerd Pfeiffer , Kevin M. Prettyman , Brian C. Sapp
CPC分类号: H01L31/1804 , Y02E10/547 , Y02P70/521
摘要: A method of manufacturing a photovoltaic cell using a semiconductor wafer having a front side and a rear side, wherein the photovoltaic cell produces electricity when the front side of the semiconductor wafer is illuminated.
摘要翻译: 使用具有前侧和后侧的半导体晶片制造光伏电池的方法,其中当半导体晶片的前侧被照亮时,光伏电池产生电力。
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公开(公告)号:US08367544B2
公开(公告)日:2013-02-05
申请号:US12582137
申请日:2009-10-20
申请人: Kangguo Cheng , Lawrence A. Clevenger , Johnathan E. Faltermeier , Stephan Grunow , Kaushik A. Kumar , Kevin S. Petrarca
发明人: Kangguo Cheng , Lawrence A. Clevenger , Johnathan E. Faltermeier , Stephan Grunow , Kaushik A. Kumar , Kevin S. Petrarca
IPC分类号: H01L21/44
CPC分类号: H01L21/76808 , H01L21/76802 , H01L21/7681 , H01L21/76825 , H01L21/76829
摘要: A method of forming a semiconductor device includes patterning a photoresist layer formed over a homogeneous semiconductor device layer to be etched; subjecting the semiconductor device to an implant process that selectively implants a sacrificial etch stop layer that is self-aligned in accordance with locations of features to be etched within the homogeneous semiconductor device layer, and at a desired depth for the features to be etched; etching a feature pattern defined by the patterned photoresist layer into the homogenous semiconductor device layer, stopping on the implanted sacrificial etch stop layer; and removing remaining portion of the implanted sacrificial etch stop layer prior to filling the etched feature pattern with a fill material.
摘要翻译: 形成半导体器件的方法包括:图案化在待蚀刻的均匀半导体器件层上形成的光致抗蚀剂层; 对半导体器件进行注入工艺,该注入工艺根据待均匀半导体器件层内待蚀刻的特征的位置以及在要蚀刻的特征的期望深度选择性地埋入自对准的牺牲蚀刻停止层; 将由图案化的光致抗蚀剂层限定的特征图案蚀刻成均匀的半导体器件层,停止在注入的牺牲蚀刻停止层上; 以及在用填充材料填充蚀刻的特征图案之前去除注入的牺牲蚀刻停止层的剩余部分。
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公开(公告)号:US08304912B2
公开(公告)日:2012-11-06
申请号:US12054644
申请日:2008-03-25
申请人: Lawrence A. Clevenger , Timothy J. Dalton , Louis C. Hsu , Carl Radens , Kwong Hon Wong , Chih-Chao Yang
发明人: Lawrence A. Clevenger , Timothy J. Dalton , Louis C. Hsu , Carl Radens , Kwong Hon Wong , Chih-Chao Yang
IPC分类号: H01L23/48
CPC分类号: H01L27/1203 , H01L21/28114 , H01L21/823456 , H01L21/84 , H01L29/42376 , H01L2924/0002 , H01L2924/00
摘要: A transistor device and method of forming the same comprises a substrate; a first gate electrode over the substrate; a second gate electrode over the substrate; and a landing pad comprising a pair of flanged ends overlapping the second gate electrode, wherein the structure of the second gate electrode is discontinuous with the structure of the landing pad.
摘要翻译: 晶体管器件及其形成方法包括:衬底; 衬底上的第一栅电极; 在所述衬底上方的第二栅电极; 以及着陆垫,其包括与所述第二栅电极重叠的一对凸缘端,其中所述第二栅极的结构与所述着陆焊盘的结构不连续。
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公开(公告)号:US20120160295A1
公开(公告)日:2012-06-28
申请号:US13167792
申请日:2011-06-24
申请人: Lawrence A. Clevenger , Harold J. Hovel , Rainer Klaus Krause , Kevin S. Petrarca , Gerd Pfeiffer , Kevin Prettyman , Brian C. Sapp
发明人: Lawrence A. Clevenger , Harold J. Hovel , Rainer Klaus Krause , Kevin S. Petrarca , Gerd Pfeiffer , Kevin Prettyman , Brian C. Sapp
IPC分类号: H01L31/042 , H01L31/18 , G01R31/10
CPC分类号: H02S50/10
摘要: A method for characterizing the electronic properties of a solar cell to be used in a photovoltaic module comprises the steps of performing a room temperature IV curve measurement of the solar cell and classifying the solar cell based on this IV curve measurement. In order to take stress-related effects into account, the solar cells are reclassified depending on the result of an additional measurement conducted on the solar cells under stress. This stress-related measurement may be gained from light induced thermography (LIT) yielding information on diode shunt areas within the solar cell.
摘要翻译: 用于表征在光伏模块中使用的太阳能电池的电子特性的方法包括以下步骤:基于该IV曲线测量,执行太阳能电池的室温IV曲线测量并对太阳能电池进行分类。 为了考虑应力相关的影响,太阳能电池根据在应力下对太阳能电池进行的额外测量的结果重新分类。 该应力相关测量可以从光诱导热成像(LIT)获得,产生关于太阳能电池内的二极管分流区域的信息。
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公开(公告)号:US20110260326A1
公开(公告)日:2011-10-27
申请号:US12768267
申请日:2010-04-27
申请人: Lawrence A. Clevenger , Maxime Darnon , Qinghuang Lin , Anthony D. Lisi , Satyanarayana V. Nitta
发明人: Lawrence A. Clevenger , Maxime Darnon , Qinghuang Lin , Anthony D. Lisi , Satyanarayana V. Nitta
IPC分类号: H01L23/48 , H01L21/768
CPC分类号: H01L21/76829 , H01L21/02126 , H01L21/02274 , H01L21/02282 , H01L21/02318 , H01L21/0276 , H01L21/31 , H01L21/7682 , H01L21/76825 , H01L23/5222 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要: Methods for producing air gap-containing metal-insulator interconnect structures for VLSI and ULSI devices using a photo-patternable low k material as well as the air gap-containing interconnect structure that is formed are disclosed. More particularly, the methods described herein provide interconnect structures built in a photo-patternable low k material in which air gaps of different depths are defined by photolithography in the photo-patternable low k material. In the methods of the present invention, no etch step is required to form the air gaps. Since no etch step is required in forming the air gaps within the photo-patternable low k material, the methods disclosed in this invention provide highly reliable interconnect structures.
摘要翻译: 公开了使用可光图案化的低k材料制造用于VLSI和ULSI器件的含气隙的金属 - 绝缘体互连结构的方法以及形成的含气隙的互连结构。 更具体地,本文所述的方法提供了内置于可光图案化的低k材料中的互连结构,其中不同深度的气隙通过光刻图案中的低k材料中的光刻来定义。 在本发明的方法中,不需要蚀刻步骤来形成气隙。 由于在形成可光图案化的低k材料内的气隙中不需要蚀刻步骤,所以本发明公开的方法提供了高度可靠的互连结构。
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公开(公告)号:US20110120519A1
公开(公告)日:2011-05-26
申请号:US12952465
申请日:2010-11-23
申请人: Lawrence A. Clevenger , Harlod J. Hovel , Rainer Klaus Krause , Kevin S. Petrarca , Gerd Pfeiffer , Kevin M. Prettyman , Brian C. Sapp
发明人: Lawrence A. Clevenger , Harlod J. Hovel , Rainer Klaus Krause , Kevin S. Petrarca , Gerd Pfeiffer , Kevin M. Prettyman , Brian C. Sapp
IPC分类号: H01L31/042 , H01L21/66 , H01L31/02
CPC分类号: H01L31/1804 , Y02E10/547 , Y02P70/521
摘要: A method of manufacturing a photovoltaic cell using a semiconductor wafer having a front side and a rear side, wherein the photovoltaic cell produces electricity when the front side of the semiconductor wafer is illuminated., the method comprising the steps of:
摘要翻译: 一种使用具有前侧和后侧的半导体晶片制造光伏电池的方法,其中当半导体晶片的前侧被照亮时,该光伏电池产生电力,该方法包括以下步骤:
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公开(公告)号:US20110100453A1
公开(公告)日:2011-05-05
申请号:US12915985
申请日:2010-10-29
申请人: Lawrence A. Clevenger , Rainer K. Krause , Zhengwen O. Li , Kevin S. Petrarca , Roger A. Quon , Carl Radens , Brian C. Sapp
发明人: Lawrence A. Clevenger , Rainer K. Krause , Zhengwen O. Li , Kevin S. Petrarca , Roger A. Quon , Carl Radens , Brian C. Sapp
IPC分类号: H01L31/0224 , H01L31/18
CPC分类号: H01L31/02164 , H01L31/022425 , Y02E10/50
摘要: A method for manufacturing one or more electrically contactable grids on at least one surface of a semiconductor substrate for use in a solar cell product includes the following. A heat-sensitive masking agent layer is deposited on the surface of the substrate of the solar cell product. The masking agent layer is locally heated to form a grid mask. Selected parts of the masking agent layer defined by locally heating are removed to form openings in the grid mask. A contact metallization is applied on the grid mask.
摘要翻译: 一种用于在太阳能电池产品中使用的半导体衬底的至少一个表面上制造一个或多个电接触网格的方法包括以下。 在太阳能电池产品的基板的表面上沉积热敏屏蔽剂层。 掩蔽剂层被局部加热以形成栅格掩模。 去除由局部加热限定的掩蔽剂层的选定部分,以在网格掩模中形成开口。 在栅格掩模上施加接触金属化。
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公开(公告)号:US07868374B2
公开(公告)日:2011-01-11
申请号:US12034899
申请日:2008-02-21
IPC分类号: H01L29/788
CPC分类号: H01L27/108 , H01L27/10802 , H01L27/10826 , H01L29/66795 , H01L29/7841 , H01L29/7853
摘要: An epitaxial semiconductor layer or a stack of a silicon germanium alloy layer and an epitaxial strained silicon layer is formed on outer sidewalls of a porous silicon portion on a substrate. The porous silicon portion and any silicon germanium alloy material are removed and a semitubular epitaxial semiconductor structure in a three-walled configuration is formed. A semitubular field effect transistor comprising inner and outer gate dielectric layers, an inner gate electrode, an outer gate electrode, and source and drain regions is formed on the semitubular epitaxial semiconductor structure. The semitubular field effect transistor may operate as an SOI transistor with a tighter channel control through the inner and outer gate electrodes, or as a memory device storing electrical charges in the body region within the semitubular epitaxial semiconductor structure.
摘要翻译: 在衬底上的多孔硅部分的外侧壁上形成硅锗合金层和外延应变硅层的外延半导体层或叠层。 去除多孔硅部分和任何硅锗合金材料,并形成三壁结构的半管状外延半导体结构。 在半管外延半导体结构上形成包括内栅电介质层和外栅电介质层,内栅电极,外栅电极以及源极和漏极区的半管场效应晶体管。 半管场效应晶体管可以作为具有通过内部和外部栅极电极的更严格的沟道控制的SOI晶体管,或作为在半管外延半导体结构内的体区中存储电荷的存储器件。
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公开(公告)号:US07830019B2
公开(公告)日:2010-11-09
申请号:US12431289
申请日:2009-04-28
申请人: Kaushik Chanda , Lawrence A. Clevenger , Andrew P. Cowley , Jason P. Gill , Baozhen Li , Chih-Chao Yang
发明人: Kaushik Chanda , Lawrence A. Clevenger , Andrew P. Cowley , Jason P. Gill , Baozhen Li , Chih-Chao Yang
IPC分类号: H01L23/04
CPC分类号: H01L21/76865 , H01L21/76805 , H01L21/76846 , H01L21/76886
摘要: A method of fabricating a device includes depositing a electromigration (EM) resistive material in an etched trench formed in a substrate and a wiring layer. The EM resistive material is formed in electrical contact with an underlying diffusion barrier layer and wiring layer. The method further includes forming a via structure in electrical contact with the EM resistive material and the wiring layer. The method results in a structure which prevents an open circuit.
摘要翻译: 制造器件的方法包括在形成在衬底和布线层中的蚀刻沟槽中沉积电迁移(EM)电阻材料。 EM电阻材料形成为与下面的扩散阻挡层和布线层电接触。 该方法还包括形成与EM电阻材料和布线层电接触的通孔结构。 该方法产生防止开路的结构。
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