LOAD-REDUCED DRAM STACK
    81.
    发明申请

    公开(公告)号:US20230072674A1

    公开(公告)日:2023-03-09

    申请号:US17800601

    申请日:2021-02-25

    Applicant: Rambus Inc.

    Abstract: Power consumption in a three-dimensional stack of integrated-circuit memory dies is reduced through selective enabling/disabling of physical signaling interfaces in those dies in response to early transmission of chip identifier information relative to command execution.

    Testing through-silicon-vias
    82.
    发明授权

    公开(公告)号:US11600349B2

    公开(公告)日:2023-03-07

    申请号:US17226216

    申请日:2021-04-09

    Applicant: RAMBUS INC.

    Abstract: Embodiments generally relate to integrated circuit devices having through silicon vias (TSVs). In one embodiment, an integrated circuit (IC) device includes a field of TSVs and an address decoder that selectably couples at least one of the TSVs to at least one of a test input and a test evaluation circuit. In another embodiment, a method includes selecting one or more TSVs from a field of TSVs in at least one IC device, and coupling each selected TSV to at least one of a test input and a test evaluation circuit.

    MEMORY COMPONENT HAVING INTERNAL READ-MODIFY-WRITE OPERATION

    公开(公告)号:US20220357893A1

    公开(公告)日:2022-11-10

    申请号:US17824665

    申请日:2022-05-25

    Applicant: Rambus Inc.

    Abstract: An memory component includes a memory bank and a command interface to receive a read-modify-write command, having an associated read address indicating a location in the memory bank and to either access read data from the location in the memory bank indicated by the read address after an adjustable delay period transpires from a time at which the read-modify-write command was received or to overlap multiple read-modify-write commands. The memory component further includes a data interface to receive write data associated with the read-modify-write command and an error correction circuit to merge the received write data with the read data to form a merged data and write the merged data to the location in the memory bank indicated by the read address.

    Multi-Modal Refresh of Dynamic, Random-Access Memory

    公开(公告)号:US20220137843A1

    公开(公告)日:2022-05-05

    申请号:US17503058

    申请日:2021-10-15

    Applicant: Rambus Inc.

    Abstract: A memory system includes two or more memory controllers capable of accessing the same dynamic, random-access memory (DRAM), one controller having access to the DRAM or a subset of the DRAM at a time. Different subsets of the DRAM are supported with different refresh-control circuitry, including respective refresh-address counters. Whichever controller has access to a given subset of the DRAM issues refresh requests to the corresponding refresh-address counter. Counters are synchronized before control of a given subset of the DRAM is transferred between controllers to avoid a loss of stored data.

    Fractional-readout oversampled image sensor

    公开(公告)号:US11284034B2

    公开(公告)日:2022-03-22

    申请号:US16859243

    申请日:2020-04-27

    Applicant: Rambus Inc.

    Abstract: Signals representative of total photocharge integrated within respective image-sensor pixels are read out of the pixels after a first exposure interval that constitutes a first fraction of a frame interval. Signals in excess of a threshold level are read out of the pixels after an ensuing second exposure interval that constitutes a second fraction of the frame interval, leaving residual photocharge within the pixels. After a third exposure interval that constitutes a third fraction of the frame interval, signals representative of a combination of at least the residual photocharge and photocharge integrated within the pixels during the third exposure interval are read out of the pixels.

    Reduced transport energy in a memory system

    公开(公告)号:US11257539B2

    公开(公告)日:2022-02-22

    申请号:US16919653

    申请日:2020-07-02

    Applicant: Rambus Inc.

    Abstract: A memory stack comprises at least two memory components. The memory components have a first data link interface and are to transmit signals on a data link coupled to the first data link interface at a first voltage level. A buffer component has a second data link interface coupled to the data link. The buffer component is to receive signals on the second data link interface at the first voltage level. A level shifting latch produces a second voltage level in response to receiving the signals at the second data link interface, where the second voltage level is higher than the first voltage level.

    Memory system with multiple open rows per bank

    公开(公告)号:US11114150B2

    公开(公告)日:2021-09-07

    申请号:US16838646

    申请日:2020-04-02

    Applicant: Rambus Inc.

    Abstract: A dynamic random access memory (DRAM) component (e.g., module or integrated circuit) can be configured to have multiple rows in the same bank open concurrently. The controller of the component divides the address space of the banks into segments based on row address ranges. These row address ranges do not necessarily correspond to row address ranges of the bank's subarrays (a.k.a. memory array tiles—MATs). When a command is sent to open a row, the controller marks a plurality of the segments as blocked. The controller thereby tracks address ranges in a bank where it will not open a second row unless and until the first row is closed. The memory component may store information about which, and how many, segments should be blocked in response to opening a row. This information may be read by the controller during initialization.

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