Semiconductor device fabrication method

    公开(公告)号:US07645711B2

    公开(公告)日:2010-01-12

    申请号:US11106468

    申请日:2005-04-15

    IPC分类号: H01L21/31

    摘要: According to the present invention, there is provided a semiconductor device fabrication method comprising: forming a first insulating film on a semiconductor substrate; forming a conductive layer on the first insulating film; exposing the first insulating film by removing a portion of the conductive layer; forming a second insulating film on the exposed surface of the first insulating film in a first processing chamber isolated from an outside; performing a modification process on the second insulating film in the first processing chamber, and then unloading the semiconductor substrate from the first processing chamber to the outside; and annealing the second insulating film in a second processing chamber.

    Control System, Integrated Control Apparatus, And Control Program
    82.
    发明申请
    Control System, Integrated Control Apparatus, And Control Program 有权
    控制系统,集成控制装置和控制程序

    公开(公告)号:US20090308089A1

    公开(公告)日:2009-12-17

    申请号:US12485490

    申请日:2009-06-16

    IPC分类号: F25D21/06 G05B15/00

    摘要: An object of the present invention is to provide a control system, an integrated control apparatus, and a control program that are capable of well maintaining freshness and quality of food articles, by reducing time for performing a recovery operation following a frost removing operation of cooling devices. In response to a start of the frost removing operation of a first showcase, an integrated control apparatus provides a second device controller (device control unit) with a “lower limit cooling instruction (increase instruction)” to increase the refrigerant supplied to a second showcase to an amount larger than that before the frost removing operation starts. In response to the “lower limit cooling instruction (increase instruction),” the second device controller (device control unit) increases the amount of the refrigerant supplied to the second showcase.

    摘要翻译: 本发明的目的是提供一种控制系统,综合控制装置和控制程序,其能够通过在冷却除霜操作之后减少执行恢复操作的时间来保持食品的新鲜度和质量 设备。 响应于第一展示柜的霜除去操作的开始,集成控制装置向第二设备控制器(设备控制单元)提供“下限冷却指令(增加指令)”,以增加供应到第二陈列柜的制冷剂 达到大于除霜操作开始之前的量。 响应于“下限制冷指令(增加指令)”,第二设备控制器(设备控制单元)增加供给第二陈列柜的制冷剂量。

    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
    83.
    发明申请
    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME 有权
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US20090294828A1

    公开(公告)日:2009-12-03

    申请号:US12405474

    申请日:2009-03-17

    IPC分类号: H01L29/788 H01L21/336

    摘要: A nonvolatile semiconductor memory device includes: a semiconductor member; a memory film provided on a surface of the semiconductor member and being capable of storing charge; and a plurality of control gate electrodes provided on the memory film, spaced from each other, and arranged along a direction parallel to the surface. Average dielectric constant of a material interposed between one of the control gate electrodes and a portion of the semiconductor member located immediately below the control gate electrode adjacent to the one control gate electrode is lower than average dielectric constant of a material interposed between the one control gate electrode and a portion of the semiconductor member located immediately below the one control gate electrode.

    摘要翻译: 非易失性半导体存储器件包括:半导体部件; 记录膜,设置在所述半导体构件的表面上并能够存储电荷; 以及设置在所述存储膜上的多个控制栅电极,彼此间​​隔开并且沿着与所述表面平行的方向布置。 插入在一个控制栅电极之间的材料和位于与控制栅电极相邻的控制栅电极正下方的部分的平均介电常数低于介于一个控制栅之间的材料的平均介电常数 电极和位于一个控制栅电极正下方的半导体部件的一部分。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    84.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20090273021A1

    公开(公告)日:2009-11-05

    申请号:US12432453

    申请日:2009-04-29

    IPC分类号: H01L29/792 H01L21/28

    CPC分类号: H01L29/4234 H01L29/7887

    摘要: A semiconductor device includes a semiconductor substrate, a tunnel insulating film on the semiconductor substrate, a charge storage layer on the tunnel insulating film, a block insulating film on the charge storage layer, and a control gate electrode on the block insulating film, the charge storage layer including a plurality of layers including first and second charge storage layers, the second charge storage layer being provided on a nearest side of the block insulating film, the first charge storage layer being provided between the tunnel insulating film and the second charge storage layer, the second charge storage layer having a higher trap density than the first charge storage layer, the second charge storage layer having a smaller band gap than the first charge storage layer, and the second charge storage layer having a higher permittivity than the first charge storage layer and a silicon nitride film.

    摘要翻译: 半导体器件包括半导体衬底,半导体衬底上的隧道绝缘膜,隧道绝缘膜上的电荷存储层,电荷存储层上的块绝缘膜和块绝缘膜上的控制栅电极,电荷 存储层,包括包括第一和第二电荷存储层的多个层,所述第二电荷存储层设置在所述块绝缘膜的最近侧,所述第一电荷存储层设置在所述隧道绝缘膜和所述第二电荷存储层之间 所述第二电荷存储层具有比所述第一电荷存储层高的陷阱密度,所述第二电荷存储层具有比所述第一电荷存储层更小的带隙,并且所述第二电荷存储层具有比所述第一电荷存储层高的介电常数 层和氮化硅膜。

    Semiconductor device and method of manufacturing the same
    85.
    发明授权
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US07541233B2

    公开(公告)日:2009-06-02

    申请号:US12007751

    申请日:2008-01-15

    IPC分类号: H01L21/336 H01L21/8234

    摘要: A semiconductor device comprises a semiconductor substrate, and a non-volatile memory cell provided on the semiconductor substrate, the non-volatile memory cell comprising a tunnel insulating film having a film thickness periodically and continuously changing in a channel width direction of the non-volatile memory cell, a floating gate electrode provided on the tunnel insulating film, a control gate electrode provided above the floating gate electrode, and an interelectrode insulating film provided between the control gate electrode and the floating gate electrode.

    摘要翻译: 半导体器件包括半导体衬底和设置在半导体衬底上的非易失性存储单元,所述非易失性存储单元包括隧道绝缘膜,所述隧道绝缘膜具有在非易失性的沟道宽度方向周期性且连续变化的膜厚度 存储单元,设置在隧道绝缘膜上的浮置栅电极,设置在浮置栅电极上方的控制栅电极,以及设置在控制栅电极和浮栅之间的电极间绝缘膜。

    Semiconductor device and method for manufacturing the same
    86.
    发明授权
    Semiconductor device and method for manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US07485918B2

    公开(公告)日:2009-02-03

    申请号:US11797670

    申请日:2007-05-07

    IPC分类号: H01L29/788

    摘要: A semiconductor device including a gate dielectric film provided on at least one site on a surface of a semiconductor substrate, at least one first gate electrode provided on the gate dielectric film, an inter-electrode dielectric film provided while covering a surface of the first gate electrode, at least partial film thickness of a portion covering a portion other than a corner portion that does not come into contact with the gate dielectric film from among a plurality of corner portions of the first gate electrode being formed to be smaller than at least partial film thickness of a portion covering the corner portion that does not come into contact with the gate dielectric film, and a second gate electrode provided while covering a surface of the inter-electrode dielectric film.

    摘要翻译: 一种半导体器件,包括设置在半导体衬底的表面上的至少一个位置处的栅极电介质膜,设置在栅极电介质膜上的至少一个第一栅电极,设置在覆盖第一栅极的表面的电极间电介质膜 所述第一栅电极的多个角部中的与所述栅电介质膜不接触的角部以外的部分的至少部分膜厚成形为小于至少部分 覆盖与栅极电介质膜不接触的角部的部分的膜厚度以及覆盖电极间电介质膜的表面的第二栅电极。

    Nonvolatile semiconductor memory device
    87.
    发明授权
    Nonvolatile semiconductor memory device 失效
    非易失性半导体存储器件

    公开(公告)号:US07414285B2

    公开(公告)日:2008-08-19

    申请号:US11870793

    申请日:2007-10-11

    IPC分类号: H01L27/108

    摘要: A nonvolatile semiconductor memory device includes a first insulating film provided on a surface of a semiconductor substrate, a charge accumulation layer provided on the first insulating film, a second insulating film provided above the charge accumulation layer and contains silicon and nitrogen, a third insulating film provided on the second insulating film, and composed of a single-layer insulating film containing oxygen or a plural-layer stacked insulating film at least whose films on a top layer and a bottom layer contain oxygen, relative dielectric constant thereof being larger than it of a silicon oxide film, a fourth insulating film provided on the third insulating film and contains silicon and nitrogen, a control gate provided above the fourth insulating film, and a fifth insulating film provided between the charge accumulation layer and the second insulating film or between the fourth insulating film and the control gate, and contains silicon and oxygen.

    摘要翻译: 非易失性半导体存储器件包括设置在半导体衬底的表面上的第一绝缘膜,设置在第一绝缘膜上的电荷累积层,设置在电荷累积层上方并含有硅和氮的第二绝缘膜,第三绝缘膜 设置在第二绝缘膜上,并且由包含氧的单层绝缘膜或至少其顶层和底层上的膜含有氧的多层堆叠绝缘膜组成,其相对介电常数大于 氧化硅膜,设置在第三绝缘膜上并含有硅和氮的第四绝缘膜,设置在第四绝缘膜上方的控制栅极和设置在电荷累积层和第二绝缘膜之间的第五绝缘膜, 第四绝缘膜和控制栅,并含有硅和氧。

    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
    88.
    发明申请
    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE 失效
    非易失性半导体存储器件

    公开(公告)号:US20080087937A1

    公开(公告)日:2008-04-17

    申请号:US11870793

    申请日:2007-10-11

    IPC分类号: H01L29/788

    摘要: A nonvolatile semiconductor memory device includes a first insulating film provided on a surface of a semiconductor substrate, a charge accumulation layer provided on the first insulating film, a second insulating film provided above the charge accumulation layer and contains silicon and nitrogen, a third insulating film provided on the second insulating film, and composed of a single-layer insulating film containing oxygen or a plural-layer stacked insulating film at least whose films on a top layer and a bottom layer contain oxygen, relative dielectric constant thereof being larger than it of a silicon oxide film, a fourth insulating film provided on the third insulating film and contains silicon and nitrogen, a control gate provided above the fourth insulating film, and a fifth insulating film provided between the charge accumulation layer and the second insulating film or between the fourth insulating film and the control gate, and contains silicon and oxygen.

    摘要翻译: 非易失性半导体存储器件包括设置在半导体衬底的表面上的第一绝缘膜,设置在第一绝缘膜上的电荷累积层,设置在电荷累积层上方并含有硅和氮的第二绝缘膜,第三绝缘膜 设置在第二绝缘膜上,并且由包含氧的单层绝缘膜或至少其顶层和底层上的膜含有氧的多层堆叠绝缘膜组成,其相对介电常数大于 氧化硅膜,设置在第三绝缘膜上并含有硅和氮的第四绝缘膜,设置在第四绝缘膜上方的控制栅极和设置在电荷累积层和第二绝缘膜之间的第五绝缘膜, 第四绝缘膜和控制栅,并含有硅和氧。