公开(公告)号：US20090117681A1

公开(公告)日：2009-05-07

申请号：US12349026

申请日：2009-01-06

申请人： Junya Maruyama ,  Toru Takayama ,  Masafumi Morisue ,  Ryosuke Watanabe ,  Eiji Sugiyama ,  Susumu Okazaki ,  Kazuo Nishi ,  Jun Koyama ,  Takeshi Osada ,  Takanori Matsuzaki

发明人： Junya Maruyama ,  Toru Takayama ,  Masafumi Morisue ,  Ryosuke Watanabe ,  Eiji Sugiyama ,  Susumu Okazaki ,  Kazuo Nishi ,  Jun Koyama ,  Takeshi Osada ,  Takanori Matsuzaki

IPC分类号： H01L21/02 ,  H01L31/18

CPC分类号： H01L27/1266 ,  H01L27/1214 ,  H01L27/1218 ,  H01L27/14609 ,  H01L27/14665 ,  H01L2224/16225

摘要： The object of the present invention is to miniaturize the area occupied by the element and to integrate a plenty of elements in a limited area so that the sensor element can have higher output and smaller size.In the present invention, higher output and miniaturization are achieved by uniting a sensor element using an amorphous semiconductor film (typically an amorphous silicon film) and an output amplifier circuit including a TFT with a semiconductor film having a crystal structure (typically a poly-crystalline silicon film) used as an active layer over a plastic film substrate that can resist the temperature in the process for mounting such as a solder reflow process. According to the present invention, the sensor element that can resist the bending stress can be obtained.

摘要翻译： 本发明的目的是使元件占据的面积小型化，并将大量的元件集成在有限的区域中，使传感器元件具有更高的输出和更小的尺寸。 在本发明中，通过使用非晶半导体膜（通常为非晶硅膜）的传感器元件和包括具有晶体结构的半导体膜（通常为多晶体）的TFT的输出放大器电路来实现更高的输出和小型化 硅膜）用作塑料膜基材上的活性层，其能够抵抗诸如焊料回流工艺的安装过程中的温度。 根据本发明，可以获得能够抵抗弯曲应力的传感器元件。

公开(公告)号：US20080013944A1

公开(公告)日：2008-01-17

申请号：US11678352

申请日：2007-02-23

申请人： Akira Yamane ,  Eiji Sugiyama

发明人： Akira Yamane ,  Eiji Sugiyama

IPC分类号： G03B17/00

CPC分类号： F16M11/2014 ,  F16M11/10 ,  F16M11/18 ,  H04N5/2251

摘要： In the imaging apparatus of the invention, a camera assembly 200 including a camera 202 is mounted on and supported by a base 110 in a pivotally rotatable manner both in a vertical direction and in a horizontal direction to allow tilting motions and panning motions of the camera 202. The camera assembly 200 is supported on an assembly fixation structure 114 of the base 110 to allow the tilting motions of the camera assembly 200. The assembly fixation structure 114 is panned relative to a base foot 112 of the base 110. A panning rotation gear 175 for the panning motions of the camera 202 is fixed on a ground plate 121, which has a positional change relative to a pedestal plate unit 130 in the assembly fixation structure 114. A tilting motor 160, a panning motor 162, and relevant vertical and horizontal rotation transmission mechanisms required for the tilting motions and the panning motions of the camera 202 are collectively arranged on the pedestal plate unit 130 of the assembly fixation structure 114. The tilting motor 160 and the panning motor 162 are arranged in an attitude having respective output shafts in the horizontal direction and are disposed to face each other across a pivot shaft fitting element 135 on the pedestal plate unit 130. This arrangement of the invention enables further downsizing of the whole imaging apparatus applied to, for example, a security camera.

摘要翻译： 在本发明的成像装置中，包括相机202的照相机组件200在垂直方向和水平方向上以可枢转的方式安装在基座110上并由基座110支撑，以允许相机的倾斜运动和平移运动 202。 相机组件200被支撑在基座110的组件固定结构114上，以允许相机组件200的倾斜运动。 组合固定结构114相对于基座110的基座112进行平移。 用于相机202的平移运动的平移旋转齿轮175固定在接合板121上，该接地板121在组装固定结构114中相对于基座板单元130具有位置变化。 倾斜电动机160，平移电动机162以及照相机202的倾斜运动和平移运动所需的相关垂直和水平旋转传递机构共同设置在组装固定结构114的基座板单元130上。 倾斜电动机160和摇摄电动机162被布置成在水平方向上具有各自的输出轴的姿态，并且被布置成跨越基座板单元130上的枢轴安装元件135彼此面对。 本发明的这种布置使得可以将应用于例如安全照相机的整个成像装置进一步小型化。

公开(公告)号：US20060085152A1

公开(公告)日：2006-04-20

申请号：US10533686

申请日：2004-03-05

申请人： Eiji Sugiyama ,  Kenichi Osakabe ,  Mitsuaki Katayanagi ,  Reiko Ono ,  Tatsunori Kaiden ,  Shinichi Satou

发明人： Eiji Sugiyama ,  Kenichi Osakabe ,  Mitsuaki Katayanagi ,  Reiko Ono ,  Tatsunori Kaiden ,  Shinichi Satou

IPC分类号： G01N37/00 ,  G06F19/00

CPC分类号： G06Q10/00 ,  G06Q30/06 ,  G06Q50/10 ,  Y02P90/84 ,  Y02P90/845

摘要： In respect to emissions trading, although the emission of carbon dioxide may be reduced, there arises a need for reduction of energy so used in conjunction therewith with the possibility of global recession. The present invention purports to facilitate supply of organic compounds having environmentally-friendly values by providing a support system, an certification system and a method of trading environmentally-friendly values of organic compounds, in conjunction with accompanying computer software, to operators creating environmentally-friendly values of organic compounds; to a wide range of companies wishing to purchase organic compounds having said environmentally-friendly values and products produced by using said organic compounds; and to individual consumers.

摘要翻译： 在排放交易方面，尽管二氧化碳的排放量可能会减少，但是需要减少与此同时使用的能源与全球经济衰退的可能性。 本发明旨在通过提供支持系统，认证系统和将有机化合物的环境价值与所附计算机软件交易的方法向促成环境友好的操作者提供具有环境价值的有机化合物的供应。 有机化合物的值; 涉及广泛的希望购买具有环保价值的有机化合物的公司和使用所述有机化合物生产的产品; 和个人消费者。

公开(公告)号：US20060063309A1

公开(公告)日：2006-03-23

申请号：US11229497

申请日：2005-09-20

申请人： Eiji Sugiyama ,  Kyosuke Ito

发明人： Eiji Sugiyama ,  Kyosuke Ito

IPC分类号： H01L21/50 ,  H01L21/78 ,  H01L21/00

CPC分类号： H01L27/1266 ,  H01L21/7806 ,  H01L27/1214

摘要： In the case where an integrated circuit formed of a thin film is formed over a substrate and peeled from the substrate, a fissure (also referred to as crack) is generated in the integrated circuit in some cases. The present invention is to restrain the generation of a fissure by fixing the proceeding direction of etching in one direction to make a peeled layer warp in one direction in accordance with the proceeding of etching. For example, the proceeding of etching can be controlled by utilizing the fact that a portion where a substrate is in contact with a base insulating layer is not etched in the case of patterning a peeling layer provided over the substrate, then forming the base insulating layer, and then fixing a peeled layer by the portion where the substrate is in contact with the base insulating layer.

摘要翻译： 在由薄膜形成的集成电路形成在基板上并从基板剥离的情况下，在某些情况下，在集成电路中产生裂缝（也称为裂纹）。 本发明是通过在一个方向上固定前进方向的蚀刻来抑制裂缝的产生，以便根据蚀刻的进行使剥离层在一个方向上翘曲。 例如，可以通过利用以下事实来控制蚀刻的进行：在图案化设置在基板上的剥离层的情况下，基板与基底绝缘层接触的部分不被蚀刻，然后形成基底绝缘层 ，然后通过基板与基底绝缘层接触的部分固定剥离层。

公开(公告)号：US20050167573A1

公开(公告)日：2005-08-04

申请号：US10952914

申请日：2004-09-30

申请人： Junya Maruyama ,  Toru Takayama ,  Masafumi Morisue ,  Ryosuke Watanabe ,  Eiji Sugiyama ,  Susumu Okazaki ,  Kazuo Nishi ,  Jun Koyama ,  Takeshi Osada ,  Takanori Matsuzaki

发明人： Junya Maruyama ,  Toru Takayama ,  Masafumi Morisue ,  Ryosuke Watanabe ,  Eiji Sugiyama ,  Susumu Okazaki ,  Kazuo Nishi ,  Jun Koyama ,  Takeshi Osada ,  Takanori Matsuzaki

IPC分类号： H01L27/146 ,  H01J40/14 ,  H01L21/82 ,  H01L27/14 ,  H01L31/00 ,  H01L31/10

CPC分类号： H01L27/1266 ,  H01L27/1214 ,  H01L27/1218 ,  H01L27/14609 ,  H01L27/14665 ,  H01L2224/16225

摘要： The object of the present invention is to miniaturize the area occupied by the element and to integrate a plenty of elements in a limited area so that the sensor element can have higher output and smaller size. In the present invention, higher output and miniaturization are achieved by uniting a sensor element using an amorphous semiconductor film (typically an amorphous silicon film) and an output amplifier circuit including a TFT with a semiconductor film having a crystal structure (typically a poly-crystalline silicon film) used as an active layer over a plastic film substrate that can resist the temperature in the process for mounting such as a solder reflow process. According to the present invention, the sensor element that can resist the bending stress can be obtained.

摘要翻译： 本发明的目的是使元件占据的面积小型化，并将大量的元件集成在有限的区域中，使传感器元件具有更高的输出和更小的尺寸。 在本发明中，通过使用非晶半导体膜（通常为非晶硅膜）的传感器元件和包括具有晶体结构的半导体膜（通常为多晶体）的TFT的输出放大器电路来实现更高的输出和小型化 硅膜）用作塑料膜基材上的活性层，其能够抵抗诸如焊料回流工艺的安装过程中的温度。 根据本发明，可以获得能够抵抗弯曲应力的传感器元件。

公开(公告)号：US5570766A

公开(公告)日：1996-11-05

申请号：US403469

申请日：1995-03-14

申请人： Eichi Sato ,  Yoshihiro Kaku ,  Yuji Yokota ,  Hiroshi Shibata ,  Masanori Hatanaka ,  Eiji Sugiyama ,  Jun Sonoda ,  Tetsuaki Numata

发明人： Eichi Sato ,  Yoshihiro Kaku ,  Yuji Yokota ,  Hiroshi Shibata ,  Masanori Hatanaka ,  Eiji Sugiyama ,  Jun Sonoda ,  Tetsuaki Numata

IPC分类号： F16C33/12 ,  F16D41/07 ,  F16H57/08 ,  F16D41/06

CPC分类号： F16C33/12 ,  F16C33/122 ,  F16D41/07 ,  F16H57/08 ,  F16C2204/60

摘要： An end bearing for one-way clutch which is preferred for use in an automatic transmission is disclosed. The end bearing comprises a body formed of a steel plate, a hard coating applied to the surface of the body, and a soft coating applied to the surface of the hard coating. The steel plate of the body assures a sufficient rigidity. Regions of the end bearing which provide sliding surfaces are covered by a soft coating and a hard coating, which improves the anti-seizing resistance and the durability of the end bearing.

摘要翻译： 公开了一种优选用于自动变速器的单向离合器的端部轴承。 端轴承包括由钢板形成的主体，施加到主体表面的硬涂层，以及施加到硬涂层表面的软涂层。 机身钢板确保足够的刚性。 提供滑动表面的端部轴承的区域被软涂层和硬涂层覆盖，这提高了端部轴承的防卡死性和耐久性。

公开(公告)号：US4779009A

公开(公告)日：1988-10-18

申请号：US886828

申请日：1986-07-18

申请人： Hiroyuki Tsunoi ,  Eiji Sugiyama ,  Motohiro Seto

发明人： Hiroyuki Tsunoi ,  Eiji Sugiyama ,  Motohiro Seto

IPC分类号： G11C11/40 ,  H03K3/289 ,  H03K3/284 ,  H03K19/00

CPC分类号： H03K3/289

摘要： In a master-slave type flip-flop circuit including a normal function in a normal mode for flip/flop operation and a scanning function in a scanning mode for testing an integrated circuit, the master-slave type flip-flop circuit comprises: a master stage having a first pair of differential transistors for taking in data, a second pair of differential transistors for latching data taken in to the first pair of differential transistors, a third pair of differential transistors for taking in scanning data, and a fourth pair of differential transistors for activating the second and third pair of differential transistors in the scanning mode; and a slave stage having a first pair of differential transistors for taking in data from the master stage, a second pair of differential transistors for latching data taken in to the first pair of differential transistors, a third pair of differential transistors for latching scanning data, and a fourth pair of differential transistors for activating the first and third pair of differential transistors in the scanning mode.

摘要翻译： 主从型触发电路包括：主从触发器电路，包括用于触发/翻转操作的正常模式的正常功能和用于测试集成电路的扫描模式的扫描功能，主从触发器电路包括：主器件 阶段具有用于接收数据的第一对差分晶体管，用于锁存取入第一对差分晶体管的数据的第二对差分晶体管，用于接收扫描数据的第三对差分晶体管和第四对差分 用于在扫描模式下激活第二和第三对差分晶体管的晶体管; 以及具有用于从主级接收数据的第一对差分晶体管的子级，用于锁存取入第一对差分晶体管的数据的第二对差分晶体管，用于锁存扫描数据的第三对差分晶体管， 以及第四对差分晶体管，用于在扫描模式下激活第一和第三对差分晶体管。