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81.发明申请LIGHT-EMITTING DIODE HAVING A WAVELENGTH CONVERSION MATERIAL LAYER, AND METHOD FOR FABRICATING SAME 审中-公开具有波长转换材料层的发光二极管及其制造方法公开(公告)号：US20120086040A1
公开(公告)日：2012-04-12
申请号：US13376714
申请日：2010-06-10
Applicant: Kwang-Cheol Lee , Jae-Pil Kim , Sang-Bin Song , Sang-Mook Kim
Inventor： Kwang-Cheol Lee , Jae-Pil Kim , Sang-Bin Song , Sang-Mook Kim
IPC: H01L33/50
CPC classification number: H01L33/507 , H01L33/501 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
Abstract: Provided is a light-emitting diode having a wavelength conversion material and a method for fabricating the same. The light-emitting diode comprises: a base structure; a light-emitting diode chip arranged on the base structure; and a wavelength conversion material layer arranged on the light-emitting diode chip, such that the area adjacent the upper surface of the light-emitting diode chip is thicker than the area adjacent to the side surface of the light-emitting diode chip. In addition, the method for fabricating a light-emitting diode comprises: a step of arranging the light-emitting diode chip on the base structure; and a step of arranging a wavelength conversion material layer containing a light-transmitting photocurable material on the light-emitting diode chip, such that the area thereof adjacent to the upper surface of the light-emitting diode chip is thicker than the area thereof adjacent to the side surface of the light-emitting diode chip.
Abstract translation: 提供一种具有波长转换材料的发光二极管及其制造方法。 发光二极管包括：基座结构; 布置在基底结构上的发光二极管芯片; 以及布置在发光二极管芯片上的波长转换材料层，使得与发光二极管芯片的上表面相邻的区域比与发光二极管芯片的侧表面相邻的区域更厚。 此外，制造发光二极管的方法包括：将发光二极管芯片布置在基底结构上的步骤; 以及在发光二极管芯片上布置含有透光性光固化性材料的波长转换材料层的步骤，使得其与发光二极管芯片的上表面相邻的面积比邻近发光二极管芯片的面积厚 发光二极管芯片的侧面。
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82.发明授权公开(公告)号：US07612385B2
公开(公告)日：2009-11-03
申请号：US11323487
申请日：2005-12-30
Applicant: Young-Woo Kim , Tae-Hoon Kim , Young-Moon Yu
Inventor： Young-Woo Kim , Tae-Hoon Kim , Young-Moon Yu
CPC classification number: H01L33/642 , H01L25/0753 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/00012 , H01L2924/00014
Abstract: Disclosed herein is a package structure including at least one high power light-emitting diode to exhibit excellent heat release properties. In the package structure, a light-emitting diode chip which generates heat is directly attached to a beacon processed to protrude from part of a heat spreader having high heat conductivity, whereby an electrical wiring portion is separated from a heat release portion, thus maximizing heat release properties and realizing high luminance and reliability. The package structure is composed of a beacon formed on a metal or non-metal substrate having high heat conductivity to mount a high power light-emitting diode chip, to increase heat release properties; a wiring portion provided on the same line as the diode to input and output power and signals; and a reflection cup having a cavity, which may be inserted into or attached to the heat spreader or the wiring substrate, including a low temperature co-fired ceramic substrate, a high temperature co-fired ceramic substrate, or a printed circuit board.
Abstract translation: 本文公开了包括至少一个高功率发光二极管以显示出优异的散热特性的封装结构。 在封装结构中，产生热量的发光二极管芯片直接附着在处理成从具有高导热性的散热器的一部分突出的信标处，由此将电线路部分与放热部分分开，从而使热量最大化 释放性能，实现高亮度和可靠性。 封装结构由形成在具有高导热性的金属或非金属基板上的信标构成，以安装大功率发光二极管芯片，以增加散热性能; 设置在与二极管相同的线路上的布线部分，用于输入和输出功率和信号; 以及具有空腔的反射杯，其可以插入或附着到散热器或布线基板，包括低温共烧陶瓷基板，高温共烧陶瓷基板或印刷电路板。
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83.发明申请公开(公告)号：US20080019133A1
公开(公告)日：2008-01-24
申请号：US11323487
申请日：2005-12-30
Applicant: Young-Woo Kim , Tae-Hoon Kim , Young-Moon Yu
Inventor： Young-Woo Kim , Tae-Hoon Kim , Young-Moon Yu
IPC: F21V29/00
CPC classification number: H01L33/642 , H01L25/0753 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/00012 , H01L2924/00014
Abstract: Disclosed herein is a package structure including at least one high power light-emitting diode to exhibit excellent heat release properties. In the package structure, a light-emitting diode chip which generates heat is directly attached to a beacon processed to protrude from part of a heat spreader having high heat conductivity, whereby an electrical wiring portion is separated from a heat release portion, thus maximizing heat release properties and realizing high luminance and reliability. The package structure is composed of a beacon formed on a metal or non-metal substrate having high heat conductivity to mount a high power light-emitting diode chip, to increase heat release properties; a wiring portion provided on the same line as the diode to input and output power and signals; and a reflection cup having a cavity, which may be inserted into or attached to the heat spreader or the wiring substrate, including a low temperature co-fired ceramic substrate, a high temperature co-fired ceramic substrate, or a printed circuit board.
Abstract translation: 本文公开了包括至少一个高功率发光二极管以显示出优异的散热特性的封装结构。 在封装结构中，产生热量的发光二极管芯片直接附着在处理成从具有高导热性的散热器的一部分突出的信标处，由此将电线路部分与放热部分分开，从而使热量最大化 释放性能，实现高亮度和可靠性。 封装结构由形成在具有高导热性的金属或非金属基板上的信标构成，以安装大功率发光二极管芯片，以增加散热性能; 设置在与二极管相同的线路上的布线部分，用于输入和输出功率和信号; 以及具有空腔的反射杯，其可以插入或附着到散热器或布线基板，包括低温共烧陶瓷基板，高温共烧陶瓷基板或印刷电路板。
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公开(公告)号：US12276939B2
公开(公告)日：2025-04-15
申请号：US17744628
申请日：2022-05-14
Applicant: KOREA PHOTONICS TECHNOLOGY INSTITUTE
Inventor： Seon Kyu Yoon , Jin Su Lee
Abstract: According to an embodiment, a holographic image sensor comprises a lens focusing object light incident from outside of the holographic image sensor to the holographic image sensor, a filter transmitting a predetermined wavelength band of light of the focused object light, a light receiving unit receiving interference light to sense a holographic image, and a reference light source directly emitting reference light having the predetermined wavelength band to the light receiving unit.
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公开(公告)号：US12270979B2
公开(公告)日：2025-04-08
申请号：US18315947
申请日：2023-05-11
Applicant: Korea Photonics Technology Institute
Inventor： Seon Kyu Yoon , Jin Su Lee , Sung Kuk Chun
Abstract: This disclosure relates to a digital holographic microscope which is robust to an external environment. According to an aspect of the present embodiment, there is provided an optical system for a digital holographic microscope, the optical system including a beam splitter which reflects a light radiated from a light source toward an object, or passes a light reflected from and traveling from the object; an objective lens focusing the light reflected by the beam splitter on the object; a transflective mirror which is located on the surface of the objective lens and is determined to be transparent or reflective depending on a polarization direction of a light incident to the transflective mirror; and a wave plate which converts the light passing through the beam splitter into a circularly polarized light.
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Patent Agency Ranking
公开(公告)号：US20240429359A1
公开(公告)日：2024-12-26
申请号：US18701697
申请日：2022-10-05
Applicant: KOREA PHOTONICS TECHNOLOGY INSTITUTE
Inventor： Tak JEONG , Jun Beom PARK
Abstract: The present invention relates to a micro LED package, a display having the same, and a method for manufacturing the display and, more specifically, to a micro LED package, a display having the same, and a method for manufacturing the display, in which a plurality of micro LEDs having different colors are packaged in a single pixel unit or a plurality of pixel units to facilitate connection to a driving connection electrode unit of the display. In the micro LED package and the display having the same according to the present invention, even if the size of the micro LED chips becomes small, the driving connection electrode unit of the display may be easily connected to the display driving connection electrode unit without rearranging or redesigning the driving connection electrode unit of the display, thereby making it possible to utilize the driving connection electrode unit of the existing display.
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87.发明公开公开(公告)号：US20240196102A1
公开(公告)日：2024-06-13
申请号：US18482841
申请日：2023-10-06
Applicant: KOREA PHOTONICS TECHNOLOGY INSTITUTE
Inventor： An Jin PARK , Jeong Ho KIM , Byung Sup RHO
CPC classification number: H04N23/76 , G06T3/4053 , G06T7/11 , G06V10/60 , G06T2207/20081
Abstract: An electronic device for image processing using an image conversion network comprises: a communication unit communicating with a user terminal to receive a nighttime image having an illuminance lower than a threshold level from the user terminal and a daytime image captured by a camera of the user terminal; and a control unit for inputting the nighttime image into an image conversion network to generate a daytime image having an illuminance equal to or higher than the threshold level, wherein the image conversion network includes: a pre-processing unit for generating an input image by reducing the size of the nighttime image at a predetermined ratio; a day/night conversion network for generating a first daytime image by converting an illuminance on the basis of the input image; and a resolution conversion network for generating a final image by converting a resolution on the basis of the first daytime image.
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公开(公告)号：US20240168434A1
公开(公告)日：2024-05-23
申请号：US18508393
申请日：2023-11-14
Applicant: Korea Photonics Technology Institute
Inventor： Kwang Hoon LEE , Hoe Min KIM , Kyung Il JOO , Min Kyu PARK
CPC classification number: G03H1/2294 , G06V10/54 , G06V10/60 , G03H2001/0224
Abstract: Disclosed is an apparatus for measuring texture characteristics of a holographic image that is reconstructed optically by a holographic display device. Provided is an apparatus for measuring texture characteristics of a holographic image, which measures texture characteristics of a holographic image that is reconstructed optically by a holographic display device.
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公开(公告)号：US20240168270A1
公开(公告)日：2024-05-23
申请号：US18315947
申请日：2023-05-11
Applicant: Korea Photonics Technology Institute
Inventor： Seon Kyu YOON , Jin Su Lee , Sung Kuk CHUN
CPC classification number: G02B21/04 , G02B21/365 , G03H1/0005 , G03H2001/005
Abstract: This disclosure relates to a digital holographic microscope which is robust to an external environment. According to an aspect of the present embodiment, there is provided an optical system for a digital holographic microscope, the optical system including a beam splitter which reflects a light radiated from a light source toward an object, or passes a light reflected from and traveling from the object; an objective lens focusing the light reflected by the beam splitter on the object; a transflective mirror which is located on the surface of the objective lens and is determined to be transparent or reflective depending on a polarization direction of a light incident to the transflective mirror; and a wave plate which converts the light passing through the beam splitter into a circularly polarized light.
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公开(公告)号：US20240126206A1
公开(公告)日：2024-04-18
申请号：US18533186
申请日：2023-12-08
Applicant: Korea Photonics Technology Institute
Inventor： Seon Kyu YOON , Ha Mong SHIM , Jin Su LEE , Kwang Hoon LEE
CPC classification number: G03H1/0005 , G01B9/021 , G01B11/164 , G03H1/0402 , G03H1/0443 , G03H1/0866 , G03H2001/005 , G03H2001/0415
Abstract: According to an embodiment, a holographic microscope comprises a light source, an optical system splitting light emitted from the light source into an object and a reflective mirror and inducing interference between light reflected by the object or transmitted through the object and light reflected by the reflective mirror, a first image sensor receiving the interference light and sensing interference information for the interference light, a second image sensor receiving the light reflected by the object or transmitted through the object and sensing information for the received light, and an image processor deriving a shape of the object based on the interference information sensed by the first image sensor and the information sensed by the second image sensor.
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