公开(公告)号：US20240128203A1

公开(公告)日：2024-04-18

申请号：US18369441

申请日：2023-09-18

Applicant: STMicroelectronics PTE LTD

Inventor： Jing-En LUAN

IPC: H01L23/00 ,  H01L21/3065 ,  H01L21/768 ,  H01L21/78 ,  H01L23/36 ,  H01L23/48

CPC classification number: H01L23/562 ,  H01L21/3065 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/36 ,  H01L23/481 ,  H01L24/03 ,  H01L24/16 ,  H01L2224/0346 ,  H01L2224/16145 ,  H01L2224/16227

Abstract: A method of manufacturing a chip-sized package includes providing a wafer having a die area formed therein adjacent a front face thereof, with the die area having pads formed thereon. Vias in the wafer are formed to extend between a back face of the wafer and a back side of some of the pads of the die area. Solder pads connected to the vias are formed, and a thermal pad is formed on the back side of the wafer opposite to the die area. Cavities are formed in the back face of the wafer to define pillars extending outwardly from a planar portion of the die area, some of the pillars having the solder pads at a distal end thereof, at least one of the pillars having the thermal pad at a distal end thereof. The wafer is singulated to form a chip-sized package including an integrated circuit die.

公开(公告)号：US11808723B2

公开(公告)日：2023-11-07

申请号：US17236750

申请日：2021-04-21

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Malek Brahem ,  Hatem Majeri ,  Olivier Le Neel ,  Ravi Shankar

IPC: G01N27/12 ,  G01N33/00

CPC classification number: G01N27/123 ,  G01N27/125 ,  G01N33/0031 ,  G01N33/0047 ,  G01N33/0065 ,  G01N33/0075

Abstract: The present disclosure is directed to a gas sensor device that includes a plurality of gas sensors. Each of the gas sensors includes a semiconductor metal oxide (SMO) film, a heater, and a temperature sensor. Each of the SMO films is designed to be sensitive to a different gas concentration range. As a result, the gas sensor device is able to obtain accurate readings for a wide range of gas concentration levels. In addition, the gas sensors are selectively activated and deactivated based on a current gas concentration detected by the gas sensor device. Thus, the gas sensor device is able to conserve power as gas sensors are on when appropriate instead of being continuously on.

公开(公告)号：US11721657B2

公开(公告)日：2023-08-08

申请号：US16874392

申请日：2020-05-14

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L24/14 ,  H01L23/49816

Abstract: A wafer level chip scale package (WLCSP) with portions that have different thicknesses. A first passive surface of a die in the WLSCP includes a plurality of surfaces. The plurality of surfaces may include inclined surfaces or flat surfaces. Thicker portions of die, with more semiconductor material remaining are non-critical portions that increase a WLCSP's strength for further processing and handling after formation, and the thinner portions are critical portions that reduce a Coefficient of Thermal Expansion (CTE) mismatch between a WLCSP and a PCB.

公开(公告)号：US20230230949A1

公开(公告)日：2023-07-20

申请号：US18153937

申请日：2023-01-12

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yong CHEN ,  David GANI

IPC: H01L23/00

CPC classification number: H01L24/24 ,  H01L24/16 ,  H01L24/73 ,  H01L2924/35121 ,  H01L2224/2402 ,  H01L2224/2405 ,  H01L2224/24226 ,  H01L2224/16058 ,  H01L2224/16059 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/73209

Abstract: A semiconductor package includes a die and a first lamination layer on the die with openings through the first lamination layer. A redistribution layer is on the first lamination layer and extends through the openings to the die. A plurality of conductive extensions are on the redistribution layer with each stud including a first surface on the redistribution layer, a second surface opposite to the first surface, and a sidewall between the first surface and the second surface. A second lamination layer is on the redistribution layer and the first lamination layer with the die encapsulated in molding compound. The second lamination layer is removed around the conductive extensions to expose the second surface and at least a portion of the sidewall of each stud to improve solder bond strength when mounting the package to a circuit board.

公开(公告)号：US11693149B2

公开(公告)日：2023-07-04

申请号：US17411948

申请日：2021-08-25

Applicant: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED ,  STMICROELECTRONICS PTE LTD

Inventor： Wing Shenq Wong ,  Andy Price ,  Eric Christison

IPC: H01L25/16 ,  H01L31/167 ,  G01V8/12

CPC classification number: G01V8/12 ,  H01L25/167 ,  H01L31/167 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.

公开(公告)号：US20230071048A1

公开(公告)日：2023-03-09

申请号：US18055138

申请日：2022-11-14

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En LUAN ,  Jerome TEYSSEYRE

IPC: G01S17/04 ,  H01L25/16 ,  G01S7/481 ,  H01L31/173

Abstract: A proximity sensor includes a printed circuit board substrate, a semiconductor die, electrical connectors, a lens, a light emitting assembly, and an encapsulating layer. The semiconductor die is positioned over the printed circuit board substrate with its upper surface facing away from the printed circuit board substrate. Each of the electrical connectors is in electrical communication with a contact pad of the semiconductor die and a respective contact pad of the printed circuit board substrate. The lens is positioned over a sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads facing the printed circuit board substrate. The encapsulating layer is positioned on the printed circuit board substrate, at least one of the electrical connectors, the semiconductor die, the lens, and the light emitting assembly.

公开(公告)号：US11585847B2

公开(公告)日：2023-02-21

申请号：US17826705

申请日：2022-05-27

Applicant: STMicroelectronics Pte Ltd

Inventor： Pedro Jr Santos Peralta ,  David Gani

IPC: G01R31/28 ,  H01L21/66 ,  G01R31/3185 ,  G01R31/26

Abstract: A method of testing an integrated circuit die (IC) for cracks includes performing an assembly process on a wafer including multiple ICs including: lowering a tip of a first manipulator arm to contact and pick up a given IC, flipping the given IC such that a surface of the IC facing the wafer faces a different direction, and transferring the IC to a tip of a second manipulator arm, applying pressure from the second manipulator arm to the given IC such that pogo pins extending from the tip of the first manipulator arm make electrical contact with conductive areas of the IC for connection to a crack detector on the IC, and performing a conductivity test on the crack detector using the pogo pins. If the conductivity test indicates a lack of presence of a crack, then the second manipulator arm is used to continue processing of the given IC.

公开(公告)号：US20220368100A1

公开(公告)日：2022-11-17

申请号：US17712932

申请日：2022-04-04

Applicant: STMicroelectronics PTE LTD

Inventor： Loic Pierre Louis RENARD

IPC: H01S5/026 ,  H01S5/00 ,  H01S5/02218 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/0239 ,  G02F1/01 ,  H01S5/183

Abstract: An optical sensor package includes an emitter die mounted to an upper surface of a package substrate. A sensor die is mounted to the upper surface of the package substrate using a film on die (FOD) adhesive layer that extends over the upper surface and encapsulates the emitter die. The sensor die is positioned in a stacked relationship with respect to the emitter die such that a light channel region which extends through the sensor die is optically aligned with the emitter die. Light emitted by the emitter die passes through the light channel region of the sensor die. The emitter die and the sensor die are each electrically coupled to the package substrate.

公开(公告)号：US11245273B2

公开(公告)日：2022-02-08

申请号：US16282097

申请日：2019-02-21

Applicant: STMicroelectronics Pte Ltd

Inventor： Prabhu Jyoti ,  Cho Seng Dominic Tay

IPC: H02J7/00 ,  H01M50/10 ,  H01M50/20 ,  H01M50/204 ,  H01M50/207 ,  H01M10/46

Abstract: A battery charging system includes a first electrical connector disposed facing a first shelf, a second electrical connector disposed facing a second shelf, a first charge device coupled to the first electrical connector, and a second charge device coupled to the second electrical connector. A mobile device includes a first electrical connector, a first shelf portion and a second shelf portion, which are facing the first electrical connector, and a third shelf portion and a fourth shelf portion, which are facing the second electrical connector. Each of the electrical connectors of the battery charging system and the mobile device includes a first conductor, a second conductor, and a third conductor, with the first conductor electrically coupled to the third conductor, and the second conductor electrically isolated from and disposed between the first and third conductors, which enable the battery charging system and mobile device to easily swap batteries.

公开(公告)号：US20210305438A1

公开(公告)日：2021-09-30

申请号：US17187510

申请日：2021-02-26

Applicant: STMICROELECTRONICS LTD ,  STMICROELECTRONICS PTE LTD

Inventor： David GANI ,  Yiying KUO

IPC: H01L31/0203 ,  H01L31/02 ,  H01L31/18 ,  H01L31/0392

Abstract: The present disclosure is directed to a package, such as a wafer level chip scale package (WLCSP), with a die coupled to a central portion of a transparent substrate. The transparent substrate includes a central portion having and a peripheral portion surrounding the central portion. The package includes a conductive layer coupled to a contact of the die within the package that extends from the transparent substrate to an active surface of the package. The active surface is utilized to mount the package within an electronic device or to a printed circuit board (PCB) accordingly. The package includes a first insulating layer separating the die from the conductive layer, and a second insulating layer on the conductive layer.