公开(公告)号：US20140137670A1

公开(公告)日：2014-05-22

申请号：US14081732

申请日：2013-11-15

Applicant: Toyota Jidosha Kabushiki Kaisha ,  Tohoku University ,  Kabushiki Kaisha Toyota Chuo Kenkyusho

Inventor： Yoshiyuki Hata ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Hirofumi Funabashi ,  Teruhisa Akashi ,  Yoshiteru Omura ,  Takahiro Nakayama ,  Ui Yamaguchi ,  Hitoshi Yamada ,  Shuji Tanaka ,  Masayoshi Esashi ,  Masanori Muroyama ,  Mitsutoshi Makihata

IPC: G01L1/04

CPC classification number: G01L1/144 ,  G01L1/148 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/084

Abstract: A dynamic quantity sensor includes a force receiving portion, a first movable portion that rotates in a first rotational direction around a first rotational axis according to dynamic quantity in a first direction that the force receiving portion receives, and rotates in the first rotational direction around the first rotational axis according to dynamic quantity in a second direction different from the first direction that the force receiving portion receives; and a second movable portion that rotates in a second rotational direction around a second rotational axis according to the dynamic quantity in the first direction that the force receiving portion receives, and rotates in an opposite direction to the second rotational direction around the second rotational axis according to the dynamic quantity in the second direction that the force receiving portion receives.

Abstract translation: 动力传感器包括力接收部，第一可动部，其沿着第一旋转方向围绕第一旋转轴线，沿着受力部接收的第一方向上的动力量旋转，并且沿着第一旋转方向围绕 第一旋转轴线，其在与受力部接收的第一方向不同的第二方向上的动量; 以及第二可动部，其沿第二旋转方向围绕第二旋转轴线旋转，根据受力部接收的第一方向的动量，沿与第二旋转轴相反的第二旋转方向相反的方向旋转， 相对于力接收部接收的第二方向的动量。

公开(公告)号：US20140007705A1

公开(公告)日：2014-01-09

申请号：US13934900

申请日：2013-07-03

Applicant: NextInput, Inc.

Inventor： Ian Campbell ,  Ryan Diestelhorst

IPC: G01L1/18 ,  B81C1/00 ,  B81B3/00

CPC classification number: G01L1/18 ,  B81B3/0018 ,  B81C1/00134 ,  G01L1/148 ,  G01L1/26 ,  G01L5/162

Abstract: A microelectromechanical (“MEMS”) load sensor device for measuring a force applied by a human user is described herein. In one aspect, the load sensor device has a contact surface in communication with a touch surface which communicates forces originating on the touch surface to a deformable membrane, on which load sensor elements are arranged, such that the load sensor device produces a signal proportional to forces imparted by a human user along the touch surface. In another aspect, the load sensor device has an overload protection ring to protect the load sensor device from excessive forces. In another aspect, the load sensor device has embedded logic circuitry to allow a microcontroller to individually address load sensor devices organized into an array. In another aspect, the load sensor device has electrical and mechanical connectors such as solder bumps designed to minimize cost of final component manufacturing.

Abstract translation: 本文描述了用于测量人类用户施加的力的微机电（“MEMS”）负载传感器装置。 在一个方面，负载传感器装置具有与触摸表面连通的接触表面，该接触表面将起始于触摸表面的力连接到可变形的膜上，负载传感器元件布置在其上，使得负载传感器装置产生与 由人类使用者沿着触摸表面施加的力。 在另一方面，负载传感器装置具有过载保护环以保护负载传感器装置免受过大的力。 在另一方面，负载传感器装置具有嵌入式逻辑电路，以允许微控制器分别地组织成阵列的负载传感器装置。 在另一方面，负载传感器装置具有电气和机械连接器，例如设计成最小化最终部件制造成本的焊料凸块。

公开(公告)号：US20130193532A1

公开(公告)日：2013-08-01

申请号：US13728699

申请日：2012-12-27

Applicant: WACOM CO., LTD.

Inventor： Toshihiko Horie ,  Hidetaka Takiguchi

IPC: H01L29/84

CPC classification number: H01L29/84 ,  G01L1/148 ,  G01L9/0073 ,  G01L9/12 ,  G06F3/03545

Abstract: A capacitive pressure sensing semiconductor device is provided, which has pressure resistance against pressure applied by a pressing member and can detect the pressure surely and efficiently. The pressure sensing semiconductor device includes a pressure detecting part, which detects pressure as a change in capacitance, and a package that receives the pressure detecting part within. The pressure detecting part includes a first electrode and a second electrode disposed to oppose the first electrode, with a determined distance therebetween. Capacitance is formed between the first electrode and the second electrode, and changes according to a change in said distance caused by pressure transmitted to the first electrode by a pressing member. The package also includes a pressure transmitting member that transmits, to the first electrode of the pressure detecting part, the pressure applied by the pressing member.

Abstract translation: 提供一种电容式压力感测半导体器件，其具有抵抗由加压构件施加的压力的耐压性，并且可以有效地检测压力。 压力感测半导体器件包括：压力检测部，其检测作为电容变化的压力;以及接收压力检测部的封装。 压力检测部分包括第一电极和与第一电极相对设置的第二电极，其间具有确定的距离。 在第一电极和第二电极之间形成电容，并且根据通过按压部件传递到第一电极的压力引起的所述距离的变化而变化。 该包装还包括压力传递部件，其将压力检测部件的第一电极传递到由按压部件施加的压力。

公开(公告)号：US20120199921A1

公开(公告)日：2012-08-09

申请号：US13502083

申请日：2010-10-13

Applicant: Shuji Tanaka ,  Masayoshi Esashi ,  Masanori Muroyama ,  Sakae Matsuzaki ,  Mitsutoshi Makihata ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Takahiro Nakayama ,  Ui Yamaguchi ,  Hitoshi Yamada

Inventor： Shuji Tanaka ,  Masayoshi Esashi ,  Masanori Muroyama ,  Sakae Matsuzaki ,  Mitsutoshi Makihata ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Takahiro Nakayama ,  Ui Yamaguchi ,  Hitoshi Yamada

IPC: H01L29/84 ,  H01L21/50

CPC classification number: B81C1/00238 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C2201/019 ,  B81C2203/032 ,  B81C2203/0792 ,  G01L1/146 ,  G01L1/148 ,  G01L5/228 ,  H01L23/10 ,  H01L24/04 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/94 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/00

Abstract: Provided is a technique for packaging a sensor structure having a contact sensing surface and a signal processing LSI that processes a sensor signal. The sensor structure has the contact sensing surface and sensor electrodes. The signal processing integrated circuit is embedded in a semiconductor substrate. The sensor structure and the semiconductor substrate are bonded by a bonding layer, forming a sensor device as a single chip. The sensor electrodes and the integrated circuit are sealed inside the sensor device, and the sensor electrodes and external terminals of the integrated circuit are led out to the back surface of the semiconductor substrate through a side surface of the semiconductor substrate.

Abstract translation: 提供了一种用于封装具有接触感测表面的传感器结构和处理传感器信号的信号处理LSI的技术。 传感器结构具有接触感应表面和传感器电极。 信号处理集成电路嵌入在半导体衬底中。 传感器结构和半导体衬底通过接合层粘接，形成传感器装置作为单个芯片。 传感器电极和集成电路密封在传感器装置的内部，并且集成电路的传感器电极和外部端子通过半导体衬底的侧表面被引出到半导体衬底的背面。

公开(公告)号：US20120018821A1

公开(公告)日：2012-01-26

申请号：US13262295

申请日：2010-01-04

Applicant: Felix Beyeler

Inventor： Felix Beyeler

IPC: H01L29/84

CPC classification number: G01L1/148

Abstract: A force sensor package includes the following main parts: a MEMS force sensor, an interface circuit converting a change of capacitance into an analog or digital sensor output signal, and a substrate on which the MEMS force sensor and the IC are attached. The interface circuit is a die in order to minimize the size of the force sensor. The MEMS force sensor and the interface circuit are attached to the substrate by an adhesive, e.g. glue. Electrical contacts are then realized by wire-bonding. Alternatively, the two parts may also be attached to the substrate by a flip-chip process using solder. A protective cover may be placed over the assembly.

Abstract translation: 力传感器封装包括以下主要部分：MEMS力传感器，将电容变化转换为模拟或数字传感器输出信号的接口电路，以及附接有MEMS力传感器和IC的基板。 接口电路是模具，以便最小化力传感器的尺寸。 MEMS力传感器和界面电路通过粘合剂例如粘合剂附着到基底上。 胶。 然后通过引线接合实现电接触。 或者，两个部分也可以通过使用焊料的倒装工艺附着到基板上。 保护盖可以放置在组件上。

公开(公告)号：US20110290037A1

公开(公告)日：2011-12-01

申请号：US13147935

申请日：2010-02-11

Applicant: Gilles Delapierre ,  Patrice Rey

Inventor： Gilles Delapierre ,  Patrice Rey

IPC: G01L1/22 ,  B05D5/10 ,  H01L21/02 ,  G01L1/14

CPC classification number: G01L5/162 ,  G01L1/148 ,  G01L1/18 ,  G01L1/2293 ,  G01L5/165 ,  G01L5/167

Abstract: A triaxial force sensor including: a deformable membrane; a detector detecting a deformation of the membrane configured to carry out a triaxial detection of the force to be detected; and an adhesion mechanism disposed at least at one of the principal faces of the deformable membrane, configured to secure the one of the principal faces of the deformable membrane to at least one elastomer material to be acted upon by the force to be detected, and distributed uniformly at a whole of the surface of the one of the principal faces of the deformable membrane, the deformable membrane being disposed between a cavity and the elastomer material.

Abstract translation: 一种三轴力传感器，包括：可变形膜; 检测器，检测被配置为执行待检测的力的三轴检测的膜的变形; 以及粘附机构，其至少设置在所述可变形膜的至少一个所述主面上，所述粘合机构构造成将所述可变形膜的所述主面中的所述一个面固定到待被检测的力作用的至少一种弹性体材料上，并且分布 在可变形膜的一个主面的整个表面上均匀地形成可变形膜，该可变形膜设置在空腔和弹性体材料之间。

公开(公告)号：US20110023632A1

公开(公告)日：2011-02-03

申请号：US12937638

申请日：2008-06-19

Applicant: Navakanta Bhat ,  Rudra Pratap ,  Malhi Charanjeet Kaur

Inventor： Navakanta Bhat ,  Rudra Pratap ,  Malhi Charanjeet Kaur

IPC: G01L1/14 ,  H01L29/84

CPC classification number: G01L9/0098 ,  B81B3/0072 ,  G01L1/005 ,  G01L1/148 ,  G01L9/0073

Abstract: The present invention relates to high sensitivity elastic deflection sensors, more particularly related to capacitively coupled FET based elastic deflection sensors. A sub-threshold elastic deflection FET sensor for sensing pressure/force comprises an elastic member forming a moving gate of the sensor, fixed dielectric on substrate of the FET, and a fluid dielectric between the elastic member and the fixed dielectric, wherein alteration in the height of the fluid dielectric (TSENS) due to pressure/force on the elastic member varies the sensor gate capacitance.

Abstract translation: 本发明涉及高灵敏度弹性偏转传感器，更具体地涉及基于电容耦合FET的弹性偏转传感器。 用于感测压力/力的亚阈值弹性偏转FET传感器包括形成传感器的移动栅极的弹性构件，FET的衬底上的固定电介质，以及弹性构件和固定电介质之间的流体电介质，其中， 由于弹性构件上的压力/力引起的流体介质（TSENS）的高度改变传感器栅极电容。

公开(公告)号：US07726198B2

公开(公告)日：2010-06-01

申请号：US11852608

申请日：2007-09-10

Applicant: John D. Baniecki ,  Takeshi Shioga ,  Kazuaki Kurihara

Inventor： John D. Baniecki ,  Takeshi Shioga ,  Kazuaki Kurihara

IPC: G01L1/00

CPC classification number: G01B7/22 ,  G01L1/148

Abstract: A strain sensor comprises a capacitor formed on a substrate, the capacitor having a layered structure in which a lower electrode, a metal oxide film of perovskite structure and an upper electrode are laminated consecutively on the substrate, the capacitor being adapted to be mounted upon a specimen, and a measuring circuit that measures a leakage current flowing through the capacitor between the upper electrode and the lower electrode.

Abstract translation: 应变传感器包括形成在基板上的电容器，所述电容器具有层状结构，其中下电极，钙钛矿结构的金属氧化物膜和上电极在基板上连续层压，电容器适于安装在基板上 试样和测量在上电极和下电极之间流过电容器的漏电流的测量电路。

公开(公告)号：US20090188325A1

公开(公告)日：2009-07-30

申请号：US12393294

申请日：2009-02-26

Applicant: Julia W. Aebersold ,  Kevin Walsh ,  Mark Crain ,  Michael Voor

Inventor： Julia W. Aebersold ,  Kevin Walsh ,  Mark Crain ,  Michael Voor

IPC: G01L1/14

CPC classification number: G01L1/148

Abstract: A three-dimensional micro-electro-mechanical-systems (MEMS) capacitive bending and axial strain sensor capacitor is described. Two independent comb structures, incorporating suspended polysilicon interdigitated fingers, are fabricated simultaneously on a substrate that can displace independently of each other while attached to a substrate undergoing bending or axial deformation. A change in spacing between the interdigitated fingers will output a change in capacitance of the sensor and is the primary mode of operation of the device. On the bottom and to the end of each comb structure, a glass pad is attached to the comb structure to allow for ample surface area for affixing the sensor to a substrate. During fabrication, tethers are used to connect each comb structure to maintain equal spacing between the fingers before attachment to the substrate. After attachment, the tethers are broken to allow independent movement of each comb structure.

Abstract translation: 描述了三维微电子机械系统（MEMS）电容弯曲和轴向应变传感器电容器。 两个独立的梳形结构，并入悬浮的多晶硅叉指，同时被制造在基板上，该基板可以在连接到经历弯曲或轴向变形的基板上时彼此独立地移位。 交叉指状物之间的间距变化将输出传感器的电容变化，并且是器件的主要操作模式。 在每个梳结构的底部和末端，玻璃垫连接到梳状结构以允许足够的表面积将传感器固定到基底上。 在制造过程中，系绳用于连接每个梳状结构，以在连接到基底之前在指状物之间保持相等的间隔。 连接后，系绳被破坏以允许每个梳结构的独立移动。

公开(公告)号：US07380461B2

公开(公告)日：2008-06-03

申请号：US11684592

申请日：2007-03-09

Applicant: Suryakala Majeti

Inventor： Suryakala Majeti

IPC: G01L1/14

CPC classification number: G01B7/22 ,  G01L1/148 ,  Y10T29/49103 ,  Y10T29/49147

Abstract: A micro-electromechanical capacitive strain sensor. The micro-electromechanical capacitive strain sensor comprises a first bent beam, a second bent beam, and a straight center beam. The first bent beam, second bent beam, and straight center beam are aligned in the X-axis with the straight center beam located between the first and second bent beams. The first bent beam, second bent beam, and straight center beam are disposed between two anchors. The two anchors are aligned in the Y-axis. The first bent beam is bent away from the center beam and the second bent beam is bent towards the center beam to provide a set of differential capacitors with respect to the center beam, wherein the center beam serves as a common reference with respect to the first and second bent beams.

Abstract translation: 微机电容应变传感器。 微机电容应变传感器包括第一弯曲梁，第二弯曲梁和直线中心梁。 第一弯曲梁，第二弯曲梁和直线中心梁在X轴上对齐，直线中心梁位于第一和第二弯曲梁之间。 第一弯梁，第二弯梁和直中心梁设置在两个锚之间。 两个锚点在Y轴上对齐。 第一弯曲光束从中心光束弯曲并且第二弯曲光束朝向中心光束弯曲，以相对于中心光束提供一组差分电容器，其中中心光束用作相对于第一光束的共同参考 和第二弯梁。