公开(公告)号：US20240266328A1

公开(公告)日：2024-08-08

申请号：US18436046

申请日：2024-02-08

Applicant: HUBEI SAN'AN OPTOELECTRONICS CO., LTD.

Inventor： Zhiyang ZENG ,  Zhen-duan LIN ,  Weihong CHEN ,  Junpeng SHI ,  Jieling WANG ,  Yaxin QIU ,  Qinghe CHEN ,  Chongde HONG

IPC: H01L25/075 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/62 ,  H01L2933/0066

Abstract: A light-emitting module and a display device are provided, the light-emitting module includes light-emitting elements, a filling layer, a wiring layer and conductive solder pads, the light-emitting elements are arranged at intervals, and a thickness of each light-emitting element is smaller than or equal to 15 μm; the filling layer is filled between adjacent light-emitting elements; the wiring layer is disposed on the light-emitting elements, and is configured to electrically connect to the light-emitting elements; the conductive solder pads are disposed on a side of the wiring layer facing away from the light-emitting elements, and are electrically connected to the wiring layer; specifically, the filling layer contains a black filling component, a particle size of the black filling component is smaller than or equal to 1/10 of the thickness of the light-emitting element, or the particle size of the black filling component is smaller than or equal to 1 μm.

公开(公告)号：US12057530B2

公开(公告)日：2024-08-06

申请号：US17883505

申请日：2022-08-08

Applicant: Seoul Semiconductor Co., Ltd.

Inventor： Hyuck Jun Kim ,  Chung Hoon Lee ,  Y O Cho

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/38 ,  H01L33/62

CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L33/382 ,  H01L33/504 ,  H01L33/62

Abstract: A light emitting device including at least one main light emitting unit including a light emitting diode chip and a wavelength converter, and configured to emit white light, in which the light emitting diode chip includes at least one of an ultraviolet chip, a violet chip, and a blue chip, and the light emitting device is configured to be adjustable to emit light corresponding to a spectral power distribution of morning sunlight, light corresponding to a spectral power distribution of afternoon sunlight, and light corresponding to a spectral power distribution of evening sunlight.

公开(公告)号：US12057527B2

公开(公告)日：2024-08-06

申请号：US17504534

申请日：2021-10-19

Applicant: Au Optronics Corporation

Inventor： Chia-Hui Pai ,  Wen-Hsien Tseng

IPC: H01L33/44 ,  H01L23/00 ,  H01L33/38 ,  H01L33/62 ,  H01L25/075

CPC classification number: H01L33/44 ,  H01L24/95 ,  H01L24/98 ,  H01L33/38 ,  H01L33/62 ,  H01L24/29 ,  H01L24/83 ,  H01L25/0753 ,  H01L2224/2957 ,  H01L2224/83005 ,  H01L2224/95001 ,  H01L2224/98

Abstract: A light emitting diode includes a first semiconductor layer, a second semiconductor layer, a first pad, a second pad, and a protection bump. The first semiconductor layer and the second semiconductor layer are overlapping with each other. An area of a first surface of the first semiconductor layer is larger than an area of a second surface of the second semiconductor layer. The first surface faces the second surface. The first pad is electrically connected to the first semiconductor layer. The second pad is electrically connected to the second semiconductor layer. The protection bump is located between the first pad and the second pad.

公开(公告)号：US20240258486A1

公开(公告)日：2024-08-01

申请号：US18424335

申请日：2024-01-26

Applicant: LG Display Co., Ltd.

Inventor： Dukkeun YOO ,  Kwangsu LIM ,  Yongmin HA

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L27/12 ,  H01L33/42

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/124 ,  H01L33/42 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: Disclosed is a display device including a wiring substrate including a first area having a plurality of link lines and a second area having a common line electrode. The display device includes a plurality of display parts on the wiring substrate and spaced apart from each other. The plurality of display parts includes a first area having a plurality of light-emitting elements and a plurality of signal lines and a second area having a partitioning-wall pattern. The display device includes a transmissive solution layer disposed between the wiring substrate and each of the display parts in the second area. The transmissive solution layer includes a plurality of electrophoretic particles. The second area of the display part includes a lower electrode under the partitioning-wall pattern.

公开(公告)号：US20240258455A1

公开(公告)日：2024-08-01

申请号：US18636292

申请日：2024-04-16

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Chang-Lin LEE

IPC: H01L33/00 ,  H01L25/075

CPC classification number: H01L33/0095 ,  H01L25/0753

Abstract: A method of processing light-emitting elements includes: placing a plurality of LED dies from original wafers or trays on each trays of a next-stage carrier, based on a predetermined pattern. The predetermined pattern arranges two adjacent LED groups in a first direction on the original wafer or trays to be placed on two non-adjacent positions in the first direction on the tray of the next-stage carrier. The LED dies on the original wafer or trays have a first horizontal pitch and a first vertical pitch. The LED dies on each tray of the next-stage carrier have a second horizontal pitch and a second vertical pitch. The second horizontal pitch is greater than the first horizontal pitch, or the second vertical pitch is greater than the first vertical pitch. Besides, a light-emitting element device using the aforementioned method is also provided.

公开(公告)号：US20240258285A1

公开(公告)日：2024-08-01

申请号：US18628347

申请日：2024-04-05

Applicant: Seoul Semiconductor Co., Ltd.

Inventor： Motonobu TAKEYA ,  Sung Su SON ,  Jong lk LEE ,  Seung Sik HONG

IPC: H01L25/075 ,  H01L33/00 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/62 ,  H01L2933/0066

Abstract: A display device including light emitting modules having signal lines and common lines arranged thereon, each including light emitting diodes mounted on an upper surface thereof and electrically connected to the signal lines and the common lines, respectively, a motherboard coupled to the light emitting modules, and a bonding layer having electrical conductivity and coupling the light emitting modules to the motherboard, in which each of the light emitting modules includes signal line terminals and common line terminals disposed on a lower surface thereof and electrically connected to the signal lines and the multiple common lines, respectively, and the motherboard includes board signal line terminals and board common line terminals disposed on an upper surface thereof at locations corresponding to the signal line terminals and the common line terminals of the light emitting modules.

公开(公告)号：US20240258270A1

公开(公告)日：2024-08-01

申请号：US18419746

申请日：2024-01-23

Applicant: LG Display Co., Ltd.

Inventor： Sunghwan YOON ,  Yuseop SHIN ,  Dongseok LEE ,  Jusang RHIM ,  Minjae KANG ,  Rokhee LEE

IPC: H01L23/00 ,  H01L25/075

CPC classification number: H01L24/95 ,  H01L24/75 ,  H01L24/83 ,  H01L25/0753 ,  H01L2224/75655 ,  H01L2224/83143 ,  H01L2224/838 ,  H01L2224/95101

Abstract: A self-assembly donor and a method for manufacturing a display device using self-assembly donor are discussed. The self-assembly donor in one example includes a self-assembly substrate, a first assembly electrode disposed on the self-assembly substrate, a second assembly electrode disposed on the self-assembly substrate and spaced apart from the first assembly electrode, an insulating layer covering the first assembly electrode and the second assembly electrode, a planarization layer disposed on the insulating layer and having a plurality of assembly pockets defined therein, and a plurality of via holes extending thorough the self-assembly substrate, the insulating layer, and the planarization layer.

公开(公告)号：US20240258226A1

公开(公告)日：2024-08-01

申请号：US18466278

申请日：2023-09-13

Applicant: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Fu LI

IPC: H01L23/498

CPC classification number: H01L23/49838 ,  H01L23/49811 ,  H01L23/4985 ,  H01L25/0753

Abstract: A chip-on-film includes a flexible substrate, a plurality of negative polarity pins, and a positive polarity pin. The plurality of negative polarity pins are arranged in a row in a first direction on the flexible substrate, and two adjacent negative polarity pins of the plurality of negative polarity pins are arranged in an interval. The positive polarity pin is disposed on the flexible substrate. The positive polarity pin is at least partially located between two adjacent negative polarity pins of the plurality of negative polarity pins. The positive polarity pin includes a first extension portion and a second extension portion. The first extension portion intersects the second extension portion.

公开(公告)号：US20240255791A1

公开(公告)日：2024-08-01

申请号：US18128297

申请日：2023-03-30

Applicant: Guangzhou China Star Optoelectronics Semiconductor Display Technology Co., Ltd.

Inventor： Bo SUN

IPC: G02F1/1333 ,  G02F1/1335 ,  H01L25/075

CPC classification number: G02F1/13336 ,  G02F1/133528 ,  H01L25/0753 ,  G02F2201/44

Abstract: A display module includes a main display panel having a light-emitting side and including a display part and a non-display part, a secondary display panel disposed on the light-emitting side of the main display panel and corresponding to the non-display part, and a privacy protection function layer disposed on a side of the secondary display panel away from the main display panel. An orthographic projection of the privacy protection function layer on the main display panel overlaps the display part and the secondary display panel.

公开(公告)号：US12051359B2

公开(公告)日：2024-07-30

申请号：US17683318

申请日：2022-02-28

Applicant: VueReal Inc.

Inventor： Gholamreza Chaji

IPC: G09G3/32 ,  G09G3/20 ,  H01L21/66 ,  H01L25/075 ,  H01L33/50

CPC classification number: G09G3/32 ,  G09G3/2014 ,  H01L22/24 ,  H01L33/502 ,  G09G3/2003 ,  G09G2300/0452 ,  G09G2310/0264 ,  H01L25/0753 ,  H01L2933/0041

Abstract: What disclosed are structures and methods for repairing emissive display systems. Various repairing techniques embodiments in accordance with the structures and methods are provided to conquer and mitigate the defected pixels and to increase the yield and reduce the cost of emissive displays systems.