公开(公告)号：US20220094138A1

公开(公告)日：2022-03-24

申请号：US17479496

申请日：2021-09-20

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Eun Kyu KANG ,  Jong Jin LEE ,  Dae Seon KIM ,  Eun Kyoung JEON ,  Sang Jin KWON ,  Won Bae KWON ,  Kwon Seob LIM ,  Soo Yong JUNG

IPC: H01S5/024 ,  G02B27/28 ,  H01S5/02257 ,  H01S5/02253 ,  H01S5/02255 ,  H04J14/02 ,  H04B10/40

Abstract: A structure and a manufacturing method of an optical transmission module, in which output light of each of a first optical transmission unit and a second optical transmission unit is combined into one and transmitted through an optical fiber. In order to manufacture the optical transmission module, the first optical transmission unit and the second optical transmission unit are separately manufactured using a wafer-level packaging process and then are stacked. As a result, emission of generated heat is divided into a first heat sink installed in the first optical transmission unit and a second heat sink installed in the second optical transmission unit so that better heat dissipation efficiency is achieved than a conventional optical transmission module. In addition, a mounting area may also be reduced to ½ of the conventional module.

公开(公告)号：US11271362B2

公开(公告)日：2022-03-08

申请号：US16831512

申请日：2020-03-26

Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Hui Chen ,  Junpeng Shi ,  Xinglong Li ,  Chi-Wei Liao ,  Weng-Tack Wong ,  Chih-Wei Chao ,  Chen-ke Hsu

IPC: H01S5/00 ,  H01S5/024 ,  H01S5/06 ,  H01S5/40 ,  H01S5/02255 ,  F21V7/00 ,  H01S5/02208

Abstract: The laser device includes a substrate, a laser element disposed on the substrate for emitting a laser light ray, a light guide member disposed on the substrate, and a wavelength conversion layer. The light guide member is light-transmissible and thermally conductive, and has at least one reflection surface for reflecting the laser light ray from the laser element so as to change travelling direction of the laser light ray. The wavelength conversion layer converts wavelength of the laser light ray from the light guide member to result in a laser beam, and contacts the light guide member so that heat from the wavelength conversion layer is transferred to the substrate through the light guide member.

公开(公告)号：US11237467B2

公开(公告)日：2022-02-01

申请号：US16655652

申请日：2019-10-17

Applicant: NICHIA CORPORATION

Inventor： Soichiro Miura

IPC: G03B21/20 ,  H01S5/40 ,  G02B5/30 ,  G02B27/28 ,  H01S5/02208 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/022 ,  G03B21/00

Abstract: A light synthesizing device includes first and second light emitting devices, first and second polarization control members, and a synthesis member. Each of the first and second light emitting devices has at least one first semiconductor laser element and at least one second semiconductor laser element, and configured such that a polarization direction of exit light from the first semiconductor laser element is different from a polarization direction of exit light from the second semiconductor laser element. The first and second polarization control members are respectively configured to change the polarization directions of the exit lights from the first semiconductor laser element of the first light emitting device and the second semiconductor laser element of the second light emitting device. The synthesis member is configured to combine light exited from the first light emitting device and light exited from the second light emitting device.

公开(公告)号：US20220013979A1

公开(公告)日：2022-01-13

申请号：US17295297

申请日：2019-11-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Peter Jander

IPC: H01S5/02216 ,  H01S5/02255 ,  H01S5/40 ,  H01S5/00 ,  H01S5/02257

Abstract: In one embodiment, the semiconductor laser comprises a housing in which multiple laser diode chips are encapsulated. The housing comprises a cover panel and/or a lateral wall which is permeable to the generated laser radiation. The cover panel and/or the lateral wall has a light outlet surface with adjacent outlet regions. Each of the outlet regions is paired with precisely one of the laser diode chips. The light outlet surface is arranged downstream of a light outlet plane. The cover panel and/or the lateral wall has a different average thickness in the outlet regions such that the optical wavelength for the laser radiation of all of the laser diode chips is the same up to the light outlet plane with a tolerance of maximally 1.5 μm.

公开(公告)号：US11199398B2

公开(公告)日：2021-12-14

申请号：US16296425

申请日：2019-03-08

Applicant: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.

Inventor： Qiqun Zhou

IPC: G02B27/42 ,  G02B27/30 ,  H04N13/254 ,  H04N13/296 ,  H04N5/225 ,  G01B11/25 ,  G01S7/497 ,  G01S7/481 ,  G01S17/89 ,  H04M1/02 ,  H01S5/0683 ,  H01S5/02253 ,  H04N5/222 ,  H01S5/024 ,  H01S5/0236 ,  H01S5/02255

Abstract: A laser projection module, a depth camera and an electronic device are provided. The laser projection module includes a laser emitter configured to emit laser; a reflection element arranged in a laser emission direction of the laser emitter and configured to reflect the laser emitted from the laser emitter; a diffractive optical element arranged in a light exiting direction of the reflection element and configured to diffract the laser reflected by the reflection element; and an optical detector arranged between the laser emitter and the reflection element, and configured to receive the laser and detect an intensity of a non-zero order beam of the laser.

公开(公告)号：US11189987B2

公开(公告)日：2021-11-30

申请号：US16103905

申请日：2018-08-14

Applicant: Nichia Corporation

Inventor： Soichiro Miura

IPC: H01S5/00 ,  H01S5/02255 ,  H01S5/024 ,  H01S5/028 ,  H01S5/40 ,  F21S41/176 ,  F21S43/16 ,  F21S41/16 ,  H01S5/0222 ,  H01S5/323 ,  H01S5/02216 ,  H01S5/02257

Abstract: A light emitting device includes: one or more semiconductor laser elements; one or more light-reflecting parts, each having a light-reflecting surface configured to reflect laser light emitted from a corresponding one of the one or more semiconductor laser elements; and a fluorescent part having a light-receiving surface configured to be irradiated with the laser light reflected at the light-reflecting surface of each of the one or more light-reflecting parts. An irradiated region is formed on the light-reflecting surface when the light-reflecting surface is irradiated with the laser light, the irradiated region including a first end and a second end opposite the first end.

公开(公告)号：US11152758B2

公开(公告)日：2021-10-19

申请号：US16560310

申请日：2019-09-04

Applicant: NICHIA CORPORATION

Inventor： Soichiro Miura ,  Tatsuya Kanazawa

IPC: H01S5/40 ,  H01S5/00 ,  H01S5/02208 ,  H01S5/02255 ,  H01S5/02253 ,  H01S5/02257

Abstract: A light emitting device includes a base having a bottom part, a first semiconductor laser element disposed on the bottom part of the base, and a first light reflecting member disposed on the bottom part of the base. The first light reflecting member has a light reflecting surface configured to reflect light emitted from the first semiconductor laser element. The light reflecting surface of the first light reflecting member is a curved surface configured such that, with respect to the major portion of the light emitted from the first semiconductor laser element, the beam divergence angle of the light reflected by the light reflecting surface is greater than zero and smaller than the beam divergence angle of the light irradiating the light reflecting surface.

公开(公告)号：US20210313759A1

公开(公告)日：2021-10-07

申请号：US17264662

申请日：2019-08-01

Applicant: OSRAM OLED GmbH

Inventor： Jörg Erich Sorg ,  David Racz

IPC: H01S5/00 ,  H01S5/40 ,  H01S5/02255 ,  H01S5/02257

Abstract: In an embodiment a radiation-emitting component includes a first semiconductor chip configured to generate first primary electromagnetic radiation, a second semiconductor chip configured to generate second primary electromagnetic radiation, a first conversion element configured to partially convert the first and/or the second primary electromagnetic radiation into a first secondary radiation, wherein the first semiconductor chip is a first semiconductor laser diode, wherein the first primary electromagnetic radiation is blue primary radiation and wherein the first secondary radiation is green secondary radiation and a first optical element arranged between radiation emitting surfaces of the first semiconductor chip and the second semiconductor chip, wherein the first optical element is reflective for the first primary radiation and the second primary radiation.

公开(公告)号：US11043790B2

公开(公告)日：2021-06-22

申请号：US16304108

申请日：2017-02-27

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Katsuhiko Tokuda

IPC: H01S5/02255 ,  H01S5/02257 ,  H01S5/028

Abstract: A light emitting device includes a substrate; a semiconductor light emitting element provided on the substrate; a mirror that is formed on the substrate and reflects light emitted by the semiconductor light emitting element; a first resin disposed apart from the semiconductor light emitting element on an optical path and containing a light diffusing material; and a second resin disposed on the optical path between the semiconductor light emitting element and the low light diffusion portion and covering a light emitting surface of the semiconductor light emitting element at least in a region in which a density of the light is highest. A concentration of a light diffusing material in the second resin is lower than a concentration of the light diffusing material in the first resin.

公开(公告)号：US20210167573A1

公开(公告)日：2021-06-03

申请号：US16613568

申请日：2019-03-05

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Yohei ENYA ,  Shinya ITO ,  Hiromi NAKANISHI ,  Takashi KYONO

IPC: H01S5/02255 ,  G02B26/08 ,  G02B26/10 ,  H01S5/40 ,  H01S5/02253

Abstract: An optical module includes a light-forming unit configured to form light, and a protective member surrounding and sealing the light-forming unit. The light-forming unit includes a base member including an electronic temperature control module, a plurality of laser diodes arranged on the base member, a filter arranged on the base member and configured to multiplex light from the plurality of laser diodes, a beam shaping portion arranged on the base member and configured to convert a beam shape of the light multiplexed by the filter, and a MEMS arranged on the base member and including a scanning mirror configured to scan the light shaped in the beam shaping portion. The protective member includes a base body, and a lid welded to the base body.