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公开(公告)号：US11217732B2
公开(公告)日：2022-01-04
申请号：US16810523
申请日：2020-03-05
发明人： Senpeng Huang , Junpeng Shi , Weng-Tack Wong , Shunyi Chen , Zhenduan Lin , Chih-Wei Chao , Chen-Ke Hsu
摘要： The present invention provides a white light LED package structure and a white light source system, which includes a substrate, an LED chip, and a wavelength conversion material layer. The peak emission wavelength of the LED chip is between 400 nm and 425 nm; the peak emission wavelength of the wavelength conversion material layer is between 440 nm and 700 nm, and the wavelength conversion material layer absorbs light emitted from the LED chip and emits a white light source; and the emission spectrum of the white light source is set as P(λ), the emission spectrum of a blackbody radiation having the same color temperature as the white light source is S(λ), P(λmax) is the maximum light intensity within 380-780 nm, S(λmax) is the maximum light intensity of the blackbody radiation within 380-780 nm, D(λ) is a difference between the spectrum of the white light LED and the spectrum of the blackbody radiation, and within 510-610 nm, the white light source satisfies: D(λ)=P(λ)/P(λmax)−S(W)/S(λmax), −0.15
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公开(公告)号：US12002796B2
公开(公告)日：2024-06-04
申请号：US17804888
申请日：2022-06-01
发明人： Shunyi Chen , Junpeng Shi , Weng-Tack Wong , Chen-ke Hsu , Chih-Wei Chao
CPC分类号： H01L25/167 , H01L33/483 , H01L33/60 , H01L33/62
摘要： An LED device includes a substrate, a conductive layer, an LED chip, and a discharge element. The substrate has upper and lower surfaces and four edges interconnected to one another and surrounding the upper surface. The conductive layer is formed on the upper surface, and has first and second regions electrically separated by a trench. The trench has a first segment inclined relative to each edge of the substrate by a predetermined angle ranging between 0 and 90 degrees, and a second segment connected to the first segment. The LED chip is disposed across the first segment, and the discharge element is disposed across the second segment, both interconnecting the first and second regions.
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公开(公告)号：US11271362B2
公开(公告)日：2022-03-08
申请号：US16831512
申请日：2020-03-26
发明人： Hui Chen , Junpeng Shi , Xinglong Li , Chi-Wei Liao , Weng-Tack Wong , Chih-Wei Chao , Chen-ke Hsu
IPC分类号： H01S5/00 , H01S5/024 , H01S5/06 , H01S5/40 , H01S5/02255 , F21V7/00 , H01S5/02208
摘要： The laser device includes a substrate, a laser element disposed on the substrate for emitting a laser light ray, a light guide member disposed on the substrate, and a wavelength conversion layer. The light guide member is light-transmissible and thermally conductive, and has at least one reflection surface for reflecting the laser light ray from the laser element so as to change travelling direction of the laser light ray. The wavelength conversion layer converts wavelength of the laser light ray from the light guide member to result in a laser beam, and contacts the light guide member so that heat from the wavelength conversion layer is transferred to the substrate through the light guide member.
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公开(公告)号：US12080989B2
公开(公告)日：2024-09-03
申请号：US18232919
申请日：2023-08-11
发明人： Hui Chen , Junpeng Shi , Xinglong Li , Chi-Wei Liao , Weng-Tack Wong , Chih-Wei Chao , Chen-ke Hsu
IPC分类号： H01S5/00 , H01S5/02255 , H01S5/024 , H01S5/06 , H01S5/40 , F21V7/00 , H01S5/02208
CPC分类号： H01S5/0087 , H01S5/02255 , H01S5/02461 , H01S5/0609 , H01S5/4012 , F21V7/0008 , H01S5/02208 , H01S5/02469 , H01S5/4056
摘要： The laser device includes a substrate, a laser element disposed on the substrate for emitting a laser light ray, a light guide member disposed on the substrate, and a wavelength conversion layer. The light guide member is light-transmissible and thermally conductive, and has at least one reflection surface for reflecting the laser light ray from the laser element so as to change travelling direction of the laser light ray. The wavelength conversion layer converts wavelength of the laser light ray from the light guide member to result in a laser beam, and contacts the light guide member so that heat from the wavelength conversion layer is transferred to the substrate through the light guide member.
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公开(公告)号：US11769985B2
公开(公告)日：2023-09-26
申请号：US17586305
申请日：2022-01-27
发明人： Hui Chen , Junpeng Shi , Xinglong Li , Chi-Wei Liao , Weng-Tack Wong , Chih-Wei Chao , Chen-ke Hsu
IPC分类号： H01S5/00 , H01S5/024 , H01S5/06 , H01S5/40 , H01S5/02255 , F21V7/00 , H01S5/02208
CPC分类号： H01S5/0087 , H01S5/02255 , H01S5/02461 , H01S5/0609 , H01S5/4012 , F21V7/0008 , H01S5/02208 , H01S5/02469 , H01S5/4056
摘要： The laser device includes a substrate, a laser element disposed on the substrate for emitting a laser light ray, a light guide member disposed on the substrate, and a wavelength conversion layer. The light guide member is light-transmissible and thermally conductive, and has at least one reflection surface for reflecting the laser light ray from the laser element so as to change travelling direction of the laser light ray. The wavelength conversion layer converts wavelength of the laser light ray from the light guide member to result in a laser beam, and contacts the light guide member so that heat from the wavelength conversion layer is transferred to the substrate through the light guide member.
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公开(公告)号：US11362074B2
公开(公告)日：2022-06-14
申请号：US16878290
申请日：2020-05-19
发明人： Shunyi Chen , Junpeng Shi , Weng-Tack Wong , Chen-ke Hsu , Chih-Wei Chao
摘要： A light-emitting diode (LED) device includes a substrate, an electrically conductive layer, a first LED chip, and an anti-electrostatic discharge element. The substrate has opposite upper and lower surfaces. The electrically conductive layer is formed on the upper surface of the substrate, and has first and second regions that are electrically separated from each other by a trench structure. The trench structure has a first segment and a second segment which connects and is not collinear with the first segment. The first LED chip is disposed across the first segment, and the anti-electrostatic discharge element is disposed across the second segment, both interconnecting the first and second regions.
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