公开(公告)号：US09461219B2

公开(公告)日：2016-10-04

申请号：US14718292

申请日：2015-05-21

Applicant: NICHIA CORPORATION

Inventor： Takeshi Ikegami ,  Suguru Beppu ,  Tatsuya Kanazawa ,  Yoichi Bando

IPC: H01L33/58 ,  H01L33/56 ,  H01L33/62 ,  H01L33/48 ,  H01L33/50

CPC classification number: H01L33/58 ,  H01L27/156 ,  H01L33/486 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2924/18161 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A method of producing a light emitting device includes providing a light emitting element on a base member, the base member including an insulating member and a pair of connection terminals at least on an upper surface thereof. The connection terminals have an exposed portion exposed to outside, with the light emitting element electrically connected to the connection terminals. A covering member is disposed to cover at least a portion of the upper surface of the light emitting element, and a protective layer is disposed to cover at least a portion of the exposed portions of the connection terminals. The covering member is removed, and material from the upper surface side of the base member is supplied to dispose a light-transmissive member on the upper surface of the light emitting element. At least a portion of the light-transmissive member present on the protective layer is then removed.

Abstract translation: 一种制造发光器件的方法包括在基底构件上设置发光元件，所述基底构件至少在其上表面上包括绝缘构件和一对连接端子。 连接端子具有暴露于外部的暴露部分，其中发光元件电连接到连接端子。 覆盖构件设置成覆盖发光元件的上表面的至少一部分，并且设置保护层以覆盖连接端子的暴露部分的至少一部分。 除去覆盖部件，从基材的上表面侧供给材料，在发光元件的上表面设置透光性部件。 然后去除保护层上存在的透光部件的至少一部分。

公开(公告)号：US11152758B2

公开(公告)日：2021-10-19

申请号：US16560310

申请日：2019-09-04

Applicant: NICHIA CORPORATION

Inventor： Soichiro Miura ,  Tatsuya Kanazawa

IPC: H01S5/40 ,  H01S5/00 ,  H01S5/02208 ,  H01S5/02255 ,  H01S5/02253 ,  H01S5/02257

Abstract: A light emitting device includes a base having a bottom part, a first semiconductor laser element disposed on the bottom part of the base, and a first light reflecting member disposed on the bottom part of the base. The first light reflecting member has a light reflecting surface configured to reflect light emitted from the first semiconductor laser element. The light reflecting surface of the first light reflecting member is a curved surface configured such that, with respect to the major portion of the light emitted from the first semiconductor laser element, the beam divergence angle of the light reflected by the light reflecting surface is greater than zero and smaller than the beam divergence angle of the light irradiating the light reflecting surface.

公开(公告)号：US09735326B2

公开(公告)日：2017-08-15

申请号：US15257067

申请日：2016-09-06

Applicant: NICHIA CORPORATION

Inventor： Takeshi Ikegami ,  Suguru Beppu ,  Tatsuya Kanazawa ,  Yoichi Bando

IPC: H01L33/58 ,  H01L33/56 ,  H01L33/62 ,  H01L33/48 ,  H01L33/50 ,  H01L27/15

Abstract: A method of producing a light emitting device includes providing a light emitting element on a base member, the base member including an insulating member and a pair of connection terminals at least on an upper surface thereof. The connection terminals have an exposed portion exposed to outside, with the light emitting element electrically connected to the connection terminals. A covering member is disposed to cover at least a portion of the upper surface of the light emitting element, and a protective layer is disposed to cover at least a portion of the exposed portions of the connection terminals. The covering member is removed, and material from the upper surface side of the base member is supplied to dispose a light-transmissive member on the upper surface of the light emitting element. At least a portion of the light-transmissive member present on the protective layer is then removed.

公开(公告)号：US12166330B2

公开(公告)日：2024-12-10

申请号：US18472967

申请日：2023-09-22

Applicant: NICHIA CORPORATION

Inventor： Tatsuya Kanazawa ,  Kazuma Kozuru

IPC: H01S5/00 ,  H01S5/02234 ,  H01S5/02253 ,  H01S5/02257 ,  H01S5/0236 ,  H01S5/02255 ,  H01S5/40

Abstract: A light-emitting device includes: a light-emitting element; a package in which the light-emitting element is arranged; an optical member fixed to the package, the optical member having a lens portion having a lens surface including a first lens, and a non-lens portion that is a portion that does not overlap the lens surface in a top view; and one or more adhesives fixing the optical member to the package. The package has an emission surface through which light from the light-emitting element exits the package. The optical member has an incidence surface on which the light exiting the package enters the optical member, and the lens surface from which the light that has entered the optical member exits the optical member.

公开(公告)号：US11476637B2

公开(公告)日：2022-10-18

申请号：US17122704

申请日：2020-12-15

Applicant: NICHIA CORPORATION

Inventor： Tatsuya Kanazawa ,  Kazuma Kozuru

IPC: H01S5/00 ,  H01S5/02234 ,  H01S5/02253 ,  H01S5/02257 ,  H01S5/0236 ,  H01S5/40 ,  H01S5/02255

Abstract: A light-emitting device includes: a semiconductor laser element; a package; an optical member fixed to the package; and a first adhesive and a second adhesive fixing the optical member to the package, the second adhesive having a better resistance to light than the first adhesive. The package has an emission surface through which light from the semiconductor laser element exits the package. In the optical member, one or more first bonding regions to which the first adhesive is bonded and one or more second bonding regions to which the second adhesive is bonded are located at positions that are closer to an incidence surface of the optical member than to an emission surface of the optical member. In the optical member, the one or more first bonding regions and the one or more second bonding regions have a light transmittance of 80% or more.

公开(公告)号：US11982441B1

公开(公告)日：2024-05-14

申请号：US18547861

申请日：2021-10-20

Applicant: NICHIA CORPORATION

Inventor： Takashi Namie ,  Tatsuya Kanazawa ,  Masanobu Tanaka

IPC: F21V7/09 ,  F21V5/04 ,  F21Y113/00 ,  F21Y115/30 ,  G03B21/20

CPC classification number: F21V7/09 ,  F21V5/04 ,  G03B21/2033 ,  G03B21/2066 ,  G03B21/208 ,  F21Y2113/00 ,  F21Y2115/30

Abstract: A light-emitting module includes: first and second light-emitting devices each including semiconductor laser elements that emit laser beams with an interval in a slow axis direction of the laser beams; a first optical unit that includes one or more first reflective members provided with reflective surfaces on which laser beams are incident and that makes the interval of the laser beams smaller and emits the laser beams; a second optical unit that includes second reflective members provided with reflective surfaces on which laser beams are incident and that reflects, two times or more, laser beams emitted with an interval in a fast axis direction and emits the laser beams with a smaller interval and with a smaller width in the fast axis direction of the laser beams; and a condenser lens that gathers laser beams having traveled through the first optical unit and the second optical unit.

公开(公告)号：US11811190B2

公开(公告)日：2023-11-07

申请号：US17939275

申请日：2022-09-07

Applicant: NICHIA CORPORATION

Inventor： Tatsuya Kanazawa ,  Kazuma Kozuru

IPC: H01S5/00 ,  H01S5/02234 ,  H01S5/02253 ,  H01S5/02257 ,  H01S5/0236 ,  H01S5/40 ,  H01S5/02255

CPC classification number: H01S5/02234 ,  H01S5/0236 ,  H01S5/02253 ,  H01S5/02257 ,  H01S5/02255 ,  H01S5/4031

Abstract: A light-emitting device includes: a plurality of semiconductor laser elements; a package having a hermetically sealed space, with the plurality of semiconductor laser elements arranged in the space; an optical member fixed to the package; and a plurality of adhesives including a first adhesive and a second adhesive fixing the optical member to the package. The plurality of adhesives are bonded to the optical member between an emission surface of the package and an incidence surface or a lower surface of the optical member. In the optical member, one or more first bonding regions to which the first adhesive is bonded and one or more second bonding regions to which the second adhesive is bonded are located at positions that are closer to the incidence surface of the optical member than to an emission surface of the optical member.

公开(公告)号：US10566760B2

公开(公告)日：2020-02-18

申请号：US15939901

申请日：2018-03-29

Applicant: NICHIA CORPORATION

Inventor： Kazuma Kozuru ,  Soichiro Miura ,  Tatsuya Kanazawa

IPC: H01S5/022 ,  H01S5/30 ,  H01S5/40 ,  H01S5/00 ,  H01S5/024

Abstract: A light emitting device includes a base, a frame, one or more semiconductor laser elements, a cover member, an optical member fixed to the cover member via an adhesive member, and a pressing member. The adhesive member includes one or more first adhesive portion disposed between an upper surface of the cover member and a lower surface of the optical member, and two or more second adhesive portions respectively disposed at locations in contact with or spaced apart from the one or more first adhesive portions when viewed from above, in contact with the first inner lateral surface of the cover member and the lateral surface of the optical member.

公开(公告)号：US11837843B2

公开(公告)日：2023-12-05

申请号：US17478863

申请日：2021-09-17

Applicant: NICHIA CORPORATION

Inventor： Soichiro Miura ,  Tatsuya Kanazawa

IPC: H01S5/40 ,  H01S5/00 ,  H01S5/02208 ,  H01S5/02255 ,  H01S5/02253 ,  H01S5/02257

CPC classification number: H01S5/0071 ,  H01S5/02208 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/4037 ,  H01S5/4075 ,  H01S5/005 ,  H01S5/02257

Abstract: A light emitting device includes a base, a first semiconductor laser element, a second semiconductor laser element, a lens member, and a waveplate. The base has a bottom part. The first semiconductor laser element is disposed on the bottom part of the base. The second semiconductor laser element is disposed on the bottom part of the base. The second semiconductor laser element has a different polarization direction from a polarization direction of the first semiconductor laser element. The lens member is a member into which light beams from the first semiconductor element and the second semiconductor laser element enter. The waveplate is configured to change the polarization direction of light from the first semiconductor laser element.

公开(公告)号：US20220006255A1

公开(公告)日：2022-01-06

申请号：US17478863

申请日：2021-09-17

Applicant: NICHIA CORPORATION

Inventor： Soichiro Miura ,  Tatsuya Kanazawa

IPC: H01S5/00 ,  H01S5/02208 ,  H01S5/02255 ,  H01S5/40 ,  H01S5/02253

Abstract: A light emitting device includes a base, a first semiconductor laser element, a second semiconductor laser element, a lens member, and a waveplate. The base has a bottom part. The first semiconductor laser element is disposed on the bottom part of the base. The second semiconductor laser element is disposed on the bottom part of the base. The second semiconductor laser element has a different polarization direction from a polarization direction of the first semiconductor laser element. The lens member is a member into which light beams from the first semiconductor element and the second semiconductor laser element enter. The waveplate is configured to change the polarization direction of light from the first semiconductor laser element.