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11980 条记录 (耗时 0.056 秒)

    Light emitting device
    81.
    发明授权
    Light emitting device 有权

    公开(公告)号：US11276802B2

    公开(公告)日：2022-03-15

    申请号：US16922827

    申请日：2020-07-07

    申请人： NICHIA CORPORATION

    发明人： Motokazu Yamada

    IPC分类号： H01L33/44 ,  H01L33/62 ,  H01L25/075 ,  H05K1/18 ,  H05K3/00 ,  F21V21/08 ,  F21S4/24 ,  H01L33/08 ,  H01L33/56 ,  F21Y103/10 ,  F21Y115/10 ,  H01L33/54 ,  F21Y101/00

    摘要： A light emitting device includes a flexible substrate, at least one light emitting element, a cover member, a reflective member and a light transmissive member. The flexible substrate has a first surface and a second surface opposite to the first surface, and includes a flexible base member and a plurality of wiring portions disposed on a first surface side. The light emitting element is arranged on the first surface of the flexible substrate and electrically connected to the wiring portions. The cover member is arranged on the second surface of the flexible substrate and defines a through hole at a position overlapping the light emitting element in a plan view. The reflective member covers at least a part of a lower surface and at least a part of a side surface of the light emitting element. The light transmissive member covers a top surface of the light emitting element.

    Electronic printed circuit board assembly for high-power components
    83.
    发明授权
    Electronic printed circuit board assembly for high-power components 有权

    公开(公告)号：US11272617B2

    公开(公告)日：2022-03-08

    申请号：US16971949

    申请日：2019-01-16

    申请人： ZKW Group GmbH

    发明人： Dietmar Kieslinger ,  Erik Edlinger ,  Markus Lahner ,  Wolfgang Manhart

    IPC分类号： H05K1/14 ,  F21S45/47 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00

    摘要： The invention relates to an electronic module (40) comprising at least one printed circuit board of a first type (referred to as “printed circuit board A”), which is equipped in an overlapping manner with at least one printed circuit board of a second type (referred to as “printed circuit hoard B”), printed circuit board B being equipped with at least one electronic component with specific requirements (19), and the interconnected printed circuit boards A and B forming a stepped composite printed circuit board (100, 200, 300, 400, 500). The composite printed circuit board (100, 200, 300, 400, 500) is delimited at least in some regions by end regions (16) which are formed by sections of the at least one printed circuit board A, and the composite printed circuit board (100, 200, 300, 400, 500) is placed on a heat sink (20). A fastening side (15) of the at least one printed circuit board B rests flat on a contact face (21) of the heat sink (20), the contact face (21) of the heat sink (20) being dimensioned and positioned such that at least part of it extends laterally beyond the fastening side (15) of the at least one printed circuit board B in each case towards the end regions (16) formed. Supporting elements (23, 24, 25, 26) are formed on the contact face (21) of the heat sink for the mechanical support of the end regions (16). The invention also relates to a method for producing such an electronic module.

    Roll-to-roll surface treatment device, and film deposition method and film deposition device using same
    86.
    发明授权
    Roll-to-roll surface treatment device, and film deposition method and film deposition device using same 有权

    公开(公告)号：US11261520B2

    公开(公告)日：2022-03-01

    申请号：US16327264

    申请日：2017-08-23

    申请人： SUMITOMO METAL MINING CO., LTD.

    发明人： Hideharu Okami

    IPC分类号： C23C14/56 ,  H05K3/16 ,  H05K3/00 ,  C23C16/54 ,  C23C14/34

    摘要： Disclosed herein is a roll-to-roll long base material surface processing device capable of performing surface processing on a long base material with little occurrence of wrinkling in the long base material at low costs. The surface processing device includes: two can rolls that cool a long resin film transferred in a roll-to-roll manner in a vacuum chamber with a cooling medium circulated therein by wrapping the long resin film around outer circumferences thereof; and surface processing units typified by magnetron sputtering cathodes provided so as to face the outer circumferences of the two can rolls, wherein a second can roll of the two can rolls other than a most upstream first can roll has a gas release mechanism that releases a gas from the outer circumference.

    Computer readable storage medium and method of forming electronic circuit diagram
    88.
    发明授权
    Computer readable storage medium and method of forming electronic circuit diagram 有权

    公开(公告)号：US11256843B2

    公开(公告)日：2022-02-22

    申请号：US16523602

    申请日：2019-07-26

    申请人： CASIO COMPUTER CO., LTD.

    发明人： Kenji Iwamoto ,  Masato Mochizuki ,  Junichi Ono ,  Katsunori Suzuki ,  Yuji Horiuchi

    IPC分类号： G06F30/39 ,  H05K3/12 ,  H05K3/00

    摘要： There is provided a computer readable storage medium storing a program executable by a computer, and the program causes the computer to execute functions including: forming a first image in accordance with an electronic circuit diagram, in which a resistance value of a wiring portion is defined, to form the wiring portion by printing with a conductive ink; and correcting the first image in accordance with a second image, which is formed with a photothermal conversion material, when the first image is formed at least partially overlapping the second image, wherein the second image is an image for expanding a thermally expandable layer that thermally expands with heat and, when the image is irradiated with light, expanding the thermally expandable layer by converting the light into heat with the photothermal conversion material.

    Laminate structures with hole plugs and methods of forming laminate structures with hole plugs
    89.
    发明授权
    Laminate structures with hole plugs and methods of forming laminate structures with hole plugs 有权

    公开(公告)号：US11246226B2

    公开(公告)日：2022-02-08

    申请号：US16298896

    申请日：2019-03-11

    申请人： Sanmina Corporation

    发明人： Shinichi Iketani ,  Dale Kersten

    IPC分类号： H01K3/10 ,  H05K3/42 ,  H05K1/11 ,  H05K3/00

    摘要： Laminate structures including hole plugs, and methods for forming a hole plug in a laminate structure are provided. A laminate structure may be formed with at least a dielectric layer and a first conductive foil on a first side of the dielectric layer. A blind hole may be formed in the laminate structure extending toward the first conductive foil from a second side of the dielectric layer and at least partially through the dielectric layer, the blind hole including a hole depth to hole diameter aspect ratio of less than ten (10) to one (1). Via fill ink may be disposed in the blind hole, and the via fill ink may be dried and/or cured to form a hole plug.