公开(公告)号：US5998859A

公开(公告)日：1999-12-07

申请号：US420844

申请日：1995-04-10

申请人： Bradley L. Griswold ,  Chung Wen Ho ,  William C. Robinette, Jr.

发明人： Bradley L. Griswold ,  Chung Wen Ho ,  William C. Robinette, Jr.

IPC分类号： H01L23/04 ,  H01L23/24 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L23/02

CPC分类号： H01L23/3121 ,  H01L23/04 ,  H01L23/24 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/5389 ,  H01L25/0652 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14

摘要： A thin MCM packaging structure and technique is provided in which a thin film decal interconnect circuit is fabricated on a thin aluminum wafer. The thin-film decal interconnect employs Au metallurgy for bonding and comprises a bond pad/ground plane layer, topside pads, and one or more routing layers. The top routing layer also acts as the pad layer along the edge of the interconnect structure. The underside of the decal interconnect structure is provided with metal pads for attachment to conventional aluminum or gold I/O pads on one surface of the integrated circuit die. A thermosonic bonding system is used to bond the die pads to the pads. The aluminum wafer is selectively removed forming one or more cavities to hold one or more die to be mounted on the MCM structure. The die are oriented with their pads in contact with contact pads on the thin-film decal interconnect to which they are bonded and the cavities are filled with a liquid encapsulant and cured. The composite structure may be lapped down to minimize overall package thickness and to expose the backsides of the integrated circuit die for thermal management.

公开(公告)号：US5619399A

公开(公告)日：1997-04-08

申请号：US389905

申请日：1995-02-16

申请人： Sammy L. Mok

发明人： Sammy L. Mok

IPC分类号： H01L23/40 ,  H05K7/10 ,  H05K7/20

CPC分类号： H01L23/4006 ,  H05K7/1061 ,  H01L2023/4068 ,  H01L2023/4087 ,  H01L2224/48091 ,  H01L2224/48227

摘要： A mounting assembly for a multiple chip module or other circuit module, which includes a board having a surface including an array of board contacts, such as a printed wiring board in a computer system. A circuit module, such as a multiple chip module, having a first surface and a second surface is included. The circuit module includes an array of circuit contacts on the first surface of the circuit module. An interposer between the board and the first surface of the circuit module, includes conductors between the circuit contacts in the array of circuit contacts on the circuit module and board contacts in the array of board contacts on the board. A thermal bridge member contacts the second surface of the circuit module. A heat spreader contacts the thermal bridge member to dissipate the heat over a large region. A fastener fastens the board, interposer, circuit module, thermal bridge member, and heat spreader together, such that thermal contact is made between the circuit module and the thermal bridge member and between the thermal bridge member and the heat spreader, and electrical contact is made between the array of circuit contacts and the conductors in the interposer, and between the conductors in the interposer and the array of board contacts. The fastener comprises a releasable mechanism which allows the circuit module to be easily inserted or removed. A circuit module may include the host processor and supporting circuitry for a computer.

摘要翻译： 一种用于多芯片模块或其它电路模块的安装组件，其包括具有包括电路板触点阵列的表面的板，例如计算机系统中的印刷线路板。 包括具有第一表面和第二表面的电路模块，例如多芯片模块。 电路模块包括在电路模块的第一表面上的电路触点阵列。 电路板和电路模块的第一表面之间的插入件包括在电路模块上的电路触点阵列中的电路触点之间的导体和板上的板触点阵列中的板触点。 热桥构件接触电路模块的第二表面。 散热器接触热桥构件以在大的区域上散热。 紧固件将板，插入件，电路模块，热桥构件和散热器紧固在一起，使得在电路模块和热桥构件之间以及热桥构件和散热器之间形成热接触，并且电接触是 在电路触点阵列和插入器中的导体之间以及插入器中的导体和电路板触点阵列之间形成。 紧固件包括可释放机构，其允许电路模块容易地插入或移除。 电路模块可以包括用于计算机的主机处理器和支持电路。

公开(公告)号：US5729433A

公开(公告)日：1998-03-17

申请号：US593897

申请日：1996-01-30

申请人： Sammy L. Mok

发明人： Sammy L. Mok

IPC分类号： H01L23/40 ,  H01L23/538 ,  H05K1/14 ,  H05K3/32 ,  H05K7/20

CPC分类号： H01L23/5385 ,  H01L23/4006 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/73 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/325

摘要： An assembly for electronic components having heat spreaders on two sides comprises a mother board on which to mount electronic components, having a top side with an array of board contacts. A multiple chip integrated circuit module carries integrated circuits. The multiple chip module consists of a first substrate, such as aluminum, with a multi-layer interconnect structure on one surface of the aluminum substrate. The integrated circuits are mounted on the interconnect structure on the first substrate. A second substrate manufactured using printed wiring board technology, surrounds the first substrate, and includes an interconnect structure and an array of circuit contacts. Conductors connect the interconnect structure on the first substrate with the interconnect structure on the second substrate. A thermally conductive baseplate is coupled with the multiple chip module on the side opposite the array of circuit contacts. An interposer providing electrical connection between the array of circuit contacts on the multiple chip module and the array of board contacts on the printed wiring board is placed between the multiple chip module and the board. A top heat sink, such as a heat spreader assembly, is placed in contact with a second surface of a thermally conductive baseplate. On the first surface of the thermally conductive baseplate, a thermally conductive member, such as an aluminum slug or the like is placed. This thermally conductive member passes through an opening in the mother board to the side opposite the array of board contacts. A bottom heat sink is placed opposite the bottom side of the board and contacts the thermally conductive member.

摘要翻译： 在两侧具有散热器的电子部件组件包括：母板，用于安装电子部件，具有顶侧和板触点阵列。 多芯片集成电路模块承载集成电路。 多芯片模块由诸如铝的第一衬底组成，在铝衬底的一个表面上具有多层互连结构。 集成电路安装在第一基板上的互连结构上。 使用印刷线路板技术制造的第二基板围绕第一基板，并且包括互连结构和电路触点阵列。 导体将第一衬底上的互连结构与第二衬底上的互连结构连接。 导热基板与多个芯片模块在与电路触点阵列相对的一侧耦合。 提供多芯片模块上的电路触点阵列与印刷电路板上的电路板触点阵列之间的电连接的插入器被放置在多芯片模块和板之间。 诸如散热器组件的顶部散热器被放置成与导热基板的第二表面接触。 在导热基板的第一表面上放置诸如铝块等的导热构件。 该导热构件穿过母板中的开口到与板触点阵列相对的一侧。 底部散热器放置在板的底侧相对并与导热构件接触。

公开(公告)号：US5703753A

公开(公告)日：1997-12-30

申请号：US677178

申请日：1996-07-09

申请人： Sammy L. Mok

发明人： Sammy L. Mok

IPC分类号： H01L25/18 ,  H01L23/40 ,  H01L25/065 ,  H01L25/07 ,  H05K7/10 ,  H05K7/20

CPC分类号： H05K7/1061 ,  H01L23/4006 ,  H01L23/552 ,  H01L2023/4068 ,  H01L2023/4087 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/73 ,  H01L2924/14 ,  H01L2924/16251 ,  H01L2924/3025

摘要： A mounting assembly for a multiple chip module or other circuit module, which includes a board having a surface including an array of board contacts, such as a printed wiring board in a computer system. A circuit module, such as a multiple chip module, having a first surface and a second surface is included. The circuit module includes an array of circuit contacts on the first surface of the circuit module. An interposer between the board and the first surface of the circuit module, includes conductors between the circuit contacts in the array of circuit contacts on the circuit module and board contacts in the array of board contacts on the board. A thermal bridge member contacts the second surface of the circuit module. A heat spreader contacts the thermal bridge member to dissipate the heat over a large region. A fastener fastens the board, interposer, circuit module, thermal bridge member, and heat spreader together, such that thermal contact is made between the circuit module and the thermal bridge member and between the thermal bridge member and the heat spreader, and electrical contact is made between the array of circuit contacts and the conductors in the interposer, and between the conductors in the interposer and the array of board contacts. The fastener comprises a releasable mechanism which allows the circuit module to be easily inserted or removed. A circuit module may include the host processor and supporting circuitry for a computer. Also, the circuit module may include more than one multiple chip substrate, or a multiple chip substrate combined with a printed wiring board substrate on which contact areas are formed.

摘要翻译： 一种用于多芯片模块或其它电路模块的安装组件，其包括具有包括电路板触点阵列的表面的板，例如计算机系统中的印刷线路板。 包括具有第一表面和第二表面的电路模块，例如多芯片模块。 电路模块包括在电路模块的第一表面上的电路触点阵列。 电路板和电路模块的第一表面之间的插入件包括在电路模块上的电路触点阵列中的电路触点之间的导体和板上的板触点阵列中的板触点。 热桥构件接触电路模块的第二表面。 散热器接触热桥构件以在大的区域上散热。 紧固件将板，插入件，电路模块，热桥构件和散热器紧固在一起，使得在电路模块和热桥构件之间以及热桥构件和散热器之间形成热接触，并且电接触是 在电路触点阵列和插入器中的导体之间以及插入器中的导体和电路板触点阵列之间形成。 紧固件包括可释放机构，其允许电路模块容易地插入或移除。 电路模块可以包括用于计算机的主机处理器和支持电路。 此外，电路模块可以包括多于一个的多芯片衬底，或者与形成有接触区域的印刷线路板衬底组合的多芯片衬底。

公开(公告)号：US5402077A

公开(公告)日：1995-03-28

申请号：US979719

申请日：1992-11-20

申请人： Fariborz Agahdel ,  Brad Griswold ,  Syed Husain ,  Robert Moti ,  William C. Robinette, Jr. ,  Chung W. Ho

发明人： Fariborz Agahdel ,  Brad Griswold ,  Syed Husain ,  Robert Moti ,  William C. Robinette, Jr. ,  Chung W. Ho

IPC分类号： G01R31/26 ,  G01R1/04 ,  G01R31/28 ,  H01L21/66

CPC分类号： G01R31/2884 ,  G01R1/0483 ,  H01L2224/49171 ,  H01L2924/01014 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14

摘要： An integrated circuit carrier comprising: a substrate defining an opening and an outer perimeter; a multiplicity of I/O pads disposed about the perimeter; an interconnect circuit which includes a composite of a multiplicity of individual electrical conductors which are formed in a polymer dielectric; wherein the interconnect circuit overlays a top surface of the substrate and extends across the opening so as to span the opening; a multiplicity of die contact pads connected to the conductors are disposed about the flexible polymer dielectric with particles deposited on the die contact pads; a polymer dielectric fence upstanding from the membrane and sized to receive an integrated circuit; a top cap that rests upon the integrated circuit when the integrated circuit is received within the fence; a bottom cap that rests against a bottom surface of the substrate; and a fastener for securing the top cap to the bottom cap with the integrated circuit disposed therebetween.

摘要翻译： 一种集成电路载体，包括：限定开口和外周边的基板; 围绕周边布置的多个I / O焊盘; 互连电路，其包括形成在聚合物电介质中的多个单独电导体的复合物; 其中所述互连电路覆盖所述衬底的顶表面并延伸穿过所述开口以跨越所述开口; 连接到导体的多个裸片接触焊盘设置在柔性聚合物电介质周围，颗粒沉积在芯片接触焊盘上; 聚合物绝缘栅栏，从膜上直立并且尺寸适于接收集成电路; 当集成电路接收在栅栏内时，顶盖位于集成电路上; 底盖靠在基底的底表面上; 以及用于将顶盖固定到底盖的紧固件，其间设置有集成电路。

公开(公告)号：US5796164A

公开(公告)日：1998-08-18

申请号：US621563

申请日：1996-03-25

申请人： Mark T. McGraw ,  Bradley L. Griswold ,  Chung W. Ho ,  Byoung-Youl Min ,  Michael I. Grove ,  William C. Robinette, Jr.

发明人： Mark T. McGraw ,  Bradley L. Griswold ,  Chung W. Ho ,  Byoung-Youl Min ,  Michael I. Grove ,  William C. Robinette, Jr.

IPC分类号： H01L23/24 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065 ,  H01L23/34 ,  H01L23/02 ,  H01L23/28

CPC分类号： H01L23/5389 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/5387 ,  H01L25/0652 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/181

摘要： A thin MCM packaging structure and technique is provided in which a thin film decal interconnect circuit is fabricated on a thin aluminum wafer. The thin-film decal interconnect employs Au metallurgy for bonding and comprises a bond pad/ground plane layer, topside pads, and one or more routing layers. The top routing layer also acts as the pad layer along the edge of the interconnect structure. The underside of the decal interconnect structure is provided with metal pads for attachment to conventional aluminum or gold I/O pads on one surface of the integrated circuit die. A thermosonic bonding system is used to bond the die pads to the pads. The aluminum wafer is selectively removed forming one or more cavities to hold one or more die to be mounted on the MCM structure. The die are oriented with their pads in contact with contact pads on the thin-film decal interconnect to which they are bonded and the cavities are filled with a liquid encapsulant and cured. A leadframe has inner bond leads electrically bonded to bonding pads of the thin film multilayer interconnect circuit disposed about a periphery thereof and a multi-layer laminate board is mechanically bonded over the thin film multilayer interconnect circuit and over the inner bond leads of the lead frame and has a first layer including conductive pads extending outward from about an inner periphery thereof, and a second layer including apertures aligned with outwardly extending portions of the conductive pads.

摘要翻译： 提供了一种薄MCM封装结构和技术，其中在薄铝晶片上制造薄膜贴片互连电路。 薄膜贴片互连采用Au冶金用于结合，并且包括接合焊盘/接地平面层，顶侧焊盘和一个或多个布线层。 顶部路由层还沿着互连结构的边缘充当焊盘层。 贴花互连结构的下侧设置有用于附接到集成电路管芯的一个表面上的常规铝或金I / O焊盘的金属焊盘。 热键结合系统用于将管芯焊盘焊接到焊盘。 选择性地去除铝晶片形成一个或多个空腔以保持要安装在MCM结构上的一个或多个管芯。 模具被定向成使它们的焊盘与薄膜贴片互连上的接触焊盘接触，并将它们粘合到其上并且空腔填充有液体密封剂并固化。 引线框架具有电连接到薄膜多层互连电路的接合焊盘的内部接合引线，该接合焊盘围绕其周边设置，并且多层层压板机械地接合在薄膜多层互连电路上并且在引线框架的内部接合引线上 并且具有包括从其内周向外延伸的导电焊盘的第一层，以及包括与导电焊盘的向外延伸部分对准的孔的第二层。

公开(公告)号：US5422514A

公开(公告)日：1995-06-06

申请号：US60406

申请日：1993-05-11

申请人： Bradley L. Griswold ,  Chung W. Ho ,  William C. Robinette, Jr.

发明人： Bradley L. Griswold ,  Chung W. Ho ,  William C. Robinette, Jr.

IPC分类号： H01L23/04 ,  H01L23/24 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H05K3/34

CPC分类号： H01L23/3121 ,  H01L23/04 ,  H01L23/24 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/5389 ,  H01L25/0652 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14

摘要： A thin MCM packaging structure and technique is provided in which a thin film decal interconnect circuit is fabricated on a thin aluminum wafer. The thin-film decal interconnect employs Au metallurgy for bonding and comprises a bond pad/ground plane layer, topside pads, and one or more routing layers. The top routing layer also acts as the pad layer along the edge of the interconnect structure. The underside of the decal interconnect structure is provided with metal pads for attachment to conventional aluminum or gold I/O pads on one surface of the integrated circuit die. A thermosonic bonding system is used to bond the die pads to the pads. The aluminum wafer is selectively removed forming one or more cavities to hold one or more die to be mounted on the MCM structure. The die are oriented with their pads in contact with contact pads on the thin-film decal interconnect to which they are bonded and the cavities are filled with a liquid encapsulant and cured. The composite structure may be lapped down to minimize overall package thickness and to expose the backsides of the integrated circuit die for thermal management.

摘要翻译： 提供了一种薄MCM封装结构和技术，其中在薄铝晶片上制造薄膜贴片互连电路。 薄膜贴片互连采用Au冶金用于结合，并且包括接合焊盘/接地平面层，顶侧焊盘和一个或多个布线层。 顶部路由层还沿着互连结构的边缘充当焊盘层。 贴花互连结构的下侧设置有用于附接到集成电路管芯的一个表面上的常规铝或金I / O焊盘的金属焊盘。 热键结合系统用于将管芯焊盘焊接到焊盘。 选择性地去除铝晶片形成一个或多个空腔以保持要安装在MCM结构上的一个或多个管芯。 模具被定向成使它们的焊盘与薄膜贴片互连上的接触焊盘接触，并将它们粘合到其上并且空腔填充有液体密封剂并固化。 复合结构可以被倒下以最小化整体封装厚度并暴露集成电路管芯的背面用于热管理。