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公开(公告)号：US20200082984A1
公开(公告)日：2020-03-12
申请号：US16197734
申请日：2018-11-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byung Gyun KIM , Ji Hong JO , Jong Ho LEE , Myung Jun PARK
Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode and an external electrode disposed on an exterior of the body. The external electrode includes an electrode layer connected to the internal electrode and a plating portion including a nickel (Ni) plating layer, a nickel-tin (Ni—Sn) intermetallic compound layer, and a tin (Sn) plating layer, sequentially disposed on the electrode layer. The Ni-Sn intermetallic compound layer has a thickness of 0.1 μm or more.
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公开(公告)号：US20190244885A1
公开(公告)日：2019-08-08
申请号：US16105289
申请日：2018-08-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Eun Jin KIM , Han KIM
IPC: H01L23/498 , H01L23/31 , H01L23/043
Abstract: A semiconductor package includes a connection member having a first surface and a second surface disposed to oppose each other and including an insulating member having a plurality of insulating layers and a plurality of redistribution layers disposed on the plurality of insulating layers, respectively; a semiconductor chip disposed on the first surface of the connection member and having connection pads electrically connected to the plurality of redistribution layers; and an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip, wherein at least one of the plurality of redistribution layers includes a dummy electrode pattern in which a plurality of holes are arranged, and each of the plurality of holes has a shape including a plurality of protruding regions that protrude externally from different positions.
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公开(公告)号：US20240212934A1
公开(公告)日：2024-06-27
申请号：US18387659
申请日：2023-11-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sung Yong Kang
IPC: H01G4/12 , C04B35/468 , H01G4/248 , H01G4/30
CPC classification number: H01G4/1227 , C04B35/4682 , H01G4/248 , H01G4/30 , C04B2235/3236 , C04B2235/3293 , C04B2235/781 , C04B2235/786 , C04B2235/87
Abstract: A multilayer electronic component includes a body including a capacitance forming portion including a dielectric layer and internal electrodes, and first to sixth surfaces; external electrodes disposed on the third and fourth surfaces of the body, respectively; and side margin portions disposed on the fifth and sixth surfaces of the body, respectively, wherein a Ba/Ti molar ratio of the side margin portion satisfies greater than 1.025 and less than 1.035, and is higher than a Ba/Ti molar ratio of the capacitance forming portion, wherein the number of moles of Mg based on 100 moles of Ti included in the side margin portion is greater than 1.0 mole and less than 2.0 moles, and wherein the number of moles of Sn based on 100 moles of Ti included in the side margin portion is 0.01 moles or more and less than 5.0 moles.
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公开(公告)号：US20200118763A1
公开(公告)日：2020-04-16
申请号：US16201607
申请日：2018-11-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ki Young KIM , Beom Joon CHO , Sang Soo PARK , Woo Chul SHIN
Abstract: A multilayer ceramic electronic component array includes: a plurality of multilayer ceramic electronic components; a first terminal structure electrically connected to first external electrodes of each of the plurality of multilayer ceramic electronic components; a second terminal structure electrically connected to second external electrodes of each of the plurality of multilayer ceramic electronic components; a first conductive bonding member bonding the first external electrodes of each of the plurality of multilayer ceramic electronic components and the first terminal structure; a second conductive bonding member bonding the second external electrodes of each of the plurality of multilayer ceramic electronic components and the second terminal structure; and a ceramic bonding member contacting first surfaces of each of the ceramic bodies of each of the plurality of multilayer ceramic electronic components and disposed to extend to second surfaces of each of the ceramic bodies.
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公开(公告)号：US20190074137A1
公开(公告)日：2019-03-07
申请号：US16004830
申请日：2018-06-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jong Pil LEE , Hyo Youn LEE , Sung Kwon AN , Seung Woo SONG , Taek Jung LEE , Jin Kyung JOO
Abstract: A multilayer capacitor and a board having the same provide high capacitance and low equivalent series inductance (ESL). The multilayer capacitor includes a capacitor body including an active region, including first and second internal electrodes, and first and second cover regions. Third and fourth internal electrodes are alternately disposed in the cover region adjacent to amounting surface. First and second external electrodes respectively contact the first and second internal electrodes to provide capacitance. First and second via electrodes are disposed in the cover region, where the first via electrode connects the third internal electrode and a first band portion of the first external electrode to each other, and where the second via electrode connects the fourth internal electrode and a second band portion of the second external electrode to each other.
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Patent Agency Ranking
公开(公告)号：US12230445B2
公开(公告)日：2025-02-18
申请号：US18136418
申请日：2023-04-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Bon Hyeong Koo , Seok Hyun Yoon , In Ho Jeon , Byung Kil Yun , Se Yong Kim , Min Jung Jang , Geon Hoi Kim
IPC: H01G4/12 , C04B35/626 , H01G4/008 , H01G4/012 , H01G4/30
Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body, wherein the dielectric layer includes dielectric grains, wherein at least one of the dielectric grains includes a twin boundary, and wherein the dielectric layer includes a region in which a sum of lengths of the twin boundaries included in a 2 μm×2 μm region is 1.49 μm or more.
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公开(公告)号：US20250056713A1
公开(公告)日：2025-02-13
申请号：US18667629
申请日：2024-05-17
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Ho-Jae LEE , Bongbu JUNG , Yeook JEON
Abstract: A circuit board is provided. The circuit board includes a substrate portion including at least one circuit wire, an adhesive layer disposed on a first side of the substrate portion, and a metal reinforcing layer disposed opposite to the substrate portion with respect to the adhesive layer, wherein the metal reinforcing layer includes a first surface which has a convex portion, and a second surface disposed opposite to the first surface.
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公开(公告)号：US20250054693A1
公开(公告)日：2025-02-13
申请号：US18776807
申请日：2024-07-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dongseuk KIM
Abstract: A multilayer electronic component includes: a body including a dielectric layer, a first internal electrode layer, and a second internal electrode layer alternately disposed in a first direction with the dielectric layer interposed therebetween; a first external electrode disposed on the body, perpendicular to the first direction; and a second external electrode disposed on the body, wherein the first internal electrode layer includes a first internal electrode connected to the first external electrode, and the second internal electrode layer includes a second internal electrode connected to the second external electrode, wherein, when the shortest distance between the first internal electrode and a second internal electrode, most adjacent to the first internal electrode is defined as a, and the maximum size of the first internal electrode in the first direction is defined as te, 0.01≤(a/te)≤1.37 is satisfied.
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公开(公告)号：US12225307B2
公开(公告)日：2025-02-11
申请号：US17987914
申请日：2022-11-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Viatcheslav Smirnov
Abstract: A reflective module assembly is provided. The reflective module assembly includes a fixed body, a moving body configured to rotate with respect to the fixed body, a reflective member disposed in the moving body, the reflective member configured to change a direction of a path of light incident in a first optical axis direction to a second optical axis direction, three ball members spaced apart from a rotational axis of the moving body, the three ball members configured to rotatably support the moving body, and a groove arrangement disposed on at least one of the moving body and the fixed body, and configured to contact with the three ball members. The three ball members and the groove arrangement form six contact points.
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公开(公告)号：US12224127B2
公开(公告)日：2025-02-11
申请号：US17973132
申请日：2022-10-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chung Yeol Lee , Yoo Jeong Lee , Hyung Jong Choi , Kwang Yeun Won , So Jung An , Woo Kyung Sung , Kang Ha Lee , Myung Jun Park , Jong Ho Lee , Jun Hyeong Kim
Abstract: An electronic component includes a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a first connection portion on the third surface and a first band portion on the first surface; a second external electrode including a second connection portion on the fourth surface and a second band portion on the first surface; an insulating layer on the second surface and the first and second connection portions; and a plating layer on the first and second band portions. The plating layer extends onto the first and second connection portions and is in contact with the insulating layer. A thickness of an end of the insulating layer decreases toward the plating layer. An end of the plating layer includes a first region between the insulating layer and the first or second connection portion and a second region covering the insulating layer.
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