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公开(公告)号:US20240186159A1
公开(公告)日:2024-06-06
申请号:US18525785
申请日:2023-11-30
申请人: TES CO., LTD
发明人: Jong-Seok LEE , Seung-Min OH , In-Il JUNG
IPC分类号: H01L21/67 , H01L21/687
CPC分类号: H01L21/67207 , H01L21/6704 , H01L21/67248 , H01L21/68742 , H01L21/68785
摘要: Provided is a substrate processing apparatus including a chamber providing a processing space in which a process is performed on a substrate coated with an organic solvent using a fluid in a supercritical state, a tray unit supporting the substrate and provided to be inserted into the chamber and withdraw from the chamber through an opening of the chamber, and a detector configured to measure a resistance of the substrate.
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公开(公告)号:US20240175135A1
公开(公告)日:2024-05-30
申请号:US18283810
申请日:2022-03-27
申请人: TES CO., LTD
发明人: Sung-Chul CHOI , Kwang-Il CHO
IPC分类号: C23C16/458 , C23C16/18 , C23C16/46
CPC分类号: C23C16/4586 , C23C16/18 , C23C16/463
摘要: The present disclosure relates to a metal organic chemical vapor deposition apparatus, and more particularly to a metal organic chemical vapor deposition apparatus in which a coil connector through which a coil extension of a heating coil passes is provided in a chamber to improve assemblability and ease of maintenance by disposing, outside the chamber, a connector connecting a feedthrough and the heating coil for heating a substrate.
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公开(公告)号:US20240167159A1
公开(公告)日:2024-05-23
申请号:US18283811
申请日:2022-03-27
申请人: TES CO., LTD
发明人: Sung-Chul CHOI , Kwang-Il CHO
IPC分类号: C23C16/455 , C23C16/44 , C23C16/458
CPC分类号: C23C16/45591 , C23C16/4408 , C23C16/4583
摘要: The present disclosure relates to a metal organic chemical vapor deposition apparatus, and more particularly to a metal organic chemical vapor deposition apparatus including a gas supply, which uniformly supplies a process gas and is easily installed and maintained.
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公开(公告)号:US20240042462A1
公开(公告)日:2024-02-08
申请号:US18227277
申请日:2023-07-27
申请人: TES CO., LTD
发明人: Kyung-Ho JANG , Byeong-Ho YUN , Min-Wook KANG
IPC分类号: B05B1/00 , B05C5/02 , C23C16/455
CPC分类号: B05B1/005 , B05C5/0275 , B05C5/0225 , C23C16/45565 , C23C16/4557
摘要: The present disclosure relates to a showerhead assembly and a substrate processing apparatus, and more particularly to a showerhead assembly and a substrate processing apparatus including a ceramic heater that heats a substrate and by which hole processing is freely performed in a relatively high temperature process.
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公开(公告)号:US20220208720A1
公开(公告)日:2022-06-30
申请号:US17556906
申请日:2021-12-20
申请人: TES CO., LTD
发明人: Joo-Il HA , Yeong-Been KIM , Jae-Hwan KIM , Dong-Min NOH , Woo-Pil SHIM
IPC分类号: H01L23/00 , H01L23/544 , H01L21/66
摘要: The present invention relates to a substrate bonding apparatus including: a chamber; a first chuck disposed inside the chamber to adhere a first substrate; a second chuck disposed facingly inside the chamber toward the first chuck to adhere a second substrate; and a camera located above or under the first chuck and the second chuck to recognize first alignment key disposed on the first substrate and second alignment key disposed on the second substrate.
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公开(公告)号:US11118266B2
公开(公告)日:2021-09-14
申请号:US16189660
申请日:2018-11-13
申请人: TES CO., LTD
发明人: Hong-Jae Lee , Jong-Hwan Kim , Woo-Pil Shim , Woo-Jin Lee , Sung-Yean Yoon , Don-Hee Lee
IPC分类号: C23C16/44 , C23C16/455 , H01L51/56 , C23C16/505 , H01L33/44 , H01L33/00 , H01L33/02 , H01L51/52 , C23C16/34 , C23C16/40
摘要: The present invention relates to a method for depositing a protection film of a light-emitting element, the method comprising the steps of: depositing a first protection layer on a light-emitting element of a substrate by means of the atomic layer deposition method; and depositing at least one additional protection layer on the first protection layer by means of the plasma-enhanced chemical vapor deposition method.
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公开(公告)号:US20090250443A1
公开(公告)日:2009-10-08
申请号:US12143465
申请日:2008-06-20
申请人: Sung Ryul KIM
发明人: Sung Ryul KIM
IPC分类号: B23K9/00
CPC分类号: H01L21/67069 , H01L21/67265
摘要: Provided is a plasma processing apparatus including a chamber, a lower electrode, an upper electrode, and a substrate sensor. The chamber is configured to provide a reaction space. The lower electrode is disposed at a lower region in the chamber to mount a substrate thereon. The upper electrode is disposed at an upper region in the chamber to be opposite to the lower electrode. The substrate sensor is provided on the chamber to sense the substrate. Herein, the upper electrode includes an electrode plate and an insulating plate attached on the bottom of the electrode plate, and at least one guide hole is formed in the upper electrode to guide light output from the substrate sensor toward the substrate.
摘要翻译: 提供了一种包括室,下电极,上电极和基板传感器的等离子体处理装置。 腔室被配置成提供反应空间。 下电极设置在腔室中的下部区域以在其上安装衬底。 上部电极设置在室中的与下部电极相对的上部区域。 衬底传感器设置在腔室上以感测衬底。 这里,上电极包括安装在电极板的底部的电极板和绝缘板,并且在上电极中形成至少一个引导孔,以将从基板传感器输出的光引向基板。
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公开(公告)号:US20240309504A1
公开(公告)日:2024-09-19
申请号:US18600750
申请日:2024-03-10
申请人: TES CO., LTD
发明人: Yeong-Been KIM , Hyun-Shik AHN
IPC分类号: C23C16/448 , C23C16/455 , C23C16/52
CPC分类号: C23C16/448 , C23C16/45561 , C23C16/52
摘要: Provided is a gas supply method of a substrate processing apparatus, more particularly, a gas supply method for controlling a supplied amount of gas more precisely when a gas such as a raw material is supplied to a substrate.
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公开(公告)号:US20240178023A1
公开(公告)日:2024-05-30
申请号:US18519091
申请日:2023-11-27
申请人: TES CO., LTD
发明人: Jong-Seok LEE , Seung-Min OH , In-Il JUNG
CPC分类号: H01L21/67253 , H01L21/6704 , H01L22/26
摘要: Provided is a substrate processing apparatus, more particularly, a substrate processing apparatus for detecting a progress and end point of a process for a substrate when a process such as a drying process is performed for a substrate using a supercritical fluid.
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公开(公告)号:US20230392262A1
公开(公告)日:2023-12-07
申请号:US18204349
申请日:2023-05-31
申请人: TES CO., LTD
发明人: Tae-Kwang KIM
IPC分类号: C23C16/54 , C23C16/52 , C23C16/26 , C23C16/455 , C23C16/46
CPC分类号: C23C16/54 , C23C16/52 , C23C16/26 , C23C16/45519 , C23C16/463
摘要: The present invention relates to a substrate processing apparatus and a substrate processing method, and more particularly to, a substrate processing apparatus and a substrate processing method capable of performing deposition on both upper and lower surfaces of a substrate in a single apparatus or a single facility when performing deposition on the lower surface of the substrate to alleviate or eliminate a bowing phenomenon of the substrate.
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