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    Apparatus for mounting semiconductors
    4.
    发明授权
    Apparatus for mounting semiconductors 有权
    半导体安装装置

    公开(公告)号：US07146718B2

    公开(公告)日：2006-12-12

    申请号：US10845050

    申请日：2004-05-12

    申请人： Silvan Thuerlemann

    发明人： Silvan Thuerlemann

    IPC分类号： H05K13/04

    CPC分类号： H01L21/67144 ,  H01L24/75 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183

    摘要： When mounting semiconductor chips, the semiconductor chips are presented on a wafer table where they are picked one after the other by a pick and place system, transported and placed onto a substrate that rests on a supporting surface of a substrate table. The wafer table is aligned diagonally to the supporting surface of the substrate table whereby part of the wafer table is located under the substrate table. The pick and place system comprises a shuttle with a swivel arm carrying a bondhead. The swivel arm is swivelled back and forth between two predetermined swivel positions whereby in the first swivel position a longitudinal axis of the swivel arm embraces the angle φ with the perpendicular to the supporting surface of the substrate table and whereby in the second swivel position the longitudinal axis of the swivel arm runs orthogonally to the supporting surface of the substrate table.

    摘要翻译： 当安装半导体芯片时，将半导体芯片呈现在晶片台上，通过拾取和放置系统一个接一个地将其拾取，并将其放置在放置在衬底台的支撑表面上的衬底上。 晶片台与基板台的支撑面对角地对准，由此晶片台的一部分位于基板台的下方。 拾取和放置系统包括具有携带键头的旋转臂的梭子。 旋转臂在两个预定的旋转位置之间来回旋转，由此在第一旋转位置中，旋转臂的纵向轴线以与基板台的支撑表面垂直的方式包围角度phi，从而在第二旋转位置中纵向 旋转臂的轴线正交于衬底台的支撑表面。

    Enhanced process and profile simulator algorithms
    5.
    发明授权
    Enhanced process and profile simulator algorithms 有权
    增强的过程和轮廓模拟器算法

    公开(公告)号：US07139632B2

    公开(公告)日：2006-11-21

    申请号：US10932926

    申请日：2004-09-01

    申请人： David Cooperberg ,  Vahid Vahedi

    发明人： David Cooperberg ,  Vahid Vahedi

    IPC分类号： G06F19/00

    CPC分类号： H01J37/32935 ,  H01J37/321 ,  H01J37/32174

    摘要： A method for enhancing a process and profile simulator algorithm predicts the surface profile that a given plasma process will create. An energetic particle is first tracked. The ion fluxes produced by the energetic particle are then recorded. A local etch rate and a local deposition rate are computed from neutral fluxes, surface chemical coverage, and surface material type that are solved simultaneously.

    摘要翻译： 用于增强过程和轮廓模拟器算法的方法预测给定等离子体过程将产生的表面轮廓。 首先跟踪一个精力充沛的粒子。 然后记录由能量粒子产生的离子通量。 局部蚀刻速率和局部沉积速率由同时求解的中性焊剂，表面化学覆盖度和表面材料类型计算。

    Load sharing between L2TP tunnels
    6.
    发明授权
    Load sharing between L2TP tunnels 有权
    L2TP隧道之间的负载共享

    公开(公告)号：US07139276B1

    公开(公告)日：2006-11-21

    申请号：US09795688

    申请日：2001-02-27

    申请人： Aravind Sitaraman ,  Purnam Anil Sheth

    发明人： Aravind Sitaraman ,  Purnam Anil Sheth

    IPC分类号： H04L12/28 ,  G06F9/46 ,  G06F15/16

    CPC分类号： H04L12/4633 ,  H04L47/10 ,  H04L47/125

    摘要： A method for load sharing between tunnels connecting communication networks includes receiving a communication from a subscriber using the first communication network, determining tunnel selection criteria for the communication, selecting one of the at least one tunnel based on the tunnel selection criteria and forwarding the communication on the selected tunnel. The tunnel selection criteria indicate the basis for selecting one of the tunnels. An apparatus for load sharing between tunnels connecting communication networks includes a receiving interface to receive a communication from a subscriber using the first communication network, a tunnel selection criteria determiner to determine tunnel selection criteria for the communication, a tunnel selector to select one of the tunnels based on the tunnel selection criteria and a session forwarder to forward the communication on the selected tunnel. In one aspect of the invention, load sharing is performed between Layer 2 Tunneling Protocol (L2TP) tunnels.

    摘要翻译： 用于连接通信网络的隧道之间的负载共享的方法包括：使用第一通信网络从订户接收通信，确定通信的隧道选择标准，基于隧道选择标准选择至少一个隧道中的一个，并将通信转发 所选隧道。 隧道选择标准表示选择其中一条隧道的依据。 用于连接通信网络的隧道之间的负载共享的装置包括：接收接口，用于使用第一通信网络从订户接收通信;隧道选择标准确定器，用于确定通信的隧道选择标准;隧道选择器，用于选择隧道之一 基于隧道选择标准和会话转发器转发所选隧道上的通信。 在本发明的一个方面，在第二层隧道协议（L2TP）隧道之间执行负载共享。

    Telephone-coupled device for internet access
    8.
    发明授权
    Telephone-coupled device for internet access 有权
    用于互联网接入的电话耦合设备

    公开(公告)号：US07130417B1

    公开(公告)日：2006-10-31

    申请号：US09333565

    申请日：1999-06-21

    申请人： Nicholas Steigelman ,  Ronald S. Lesniak

    发明人： Nicholas Steigelman ,  Ronald S. Lesniak

    IPC分类号： H04M1/00

    CPC分类号： H04M1/2535 ,  H04M1/04 ,  H04M1/738

    摘要： An apparatus is provided which can be physically connected underneath a guest telephone in a hotel. The apparatus is set up with interconnection logic and a networking card so as to allow for a notebook computer to interconnect with a local area network in the hotel. The apparatus is set up to switch between sending a voice data from the guest telephone or computer data packets from the notebook computer across the hotel room telephone wire.

    摘要翻译： 提供一种能够物理地连接在酒店客人电话下面的装置。 该装置设置有互连逻辑和网络卡，以便笔记本计算机与酒店的局域网相互连接。 该设备被设置为在从宾客电话发送语音数据或者通过酒店房间电话线从笔记本电脑发送计算机数据分组之间进行切换。

    Apparatus for mounting semiconductors
    9.
    发明授权
    Apparatus for mounting semiconductors 失效
    半导体安装装置

    公开(公告)号：US07120995B2

    公开(公告)日：2006-10-17

    申请号：US10861720

    申请日：2004-06-03

    申请人： Dieter Vischer

    发明人： Dieter Vischer

    IPC分类号： B23P19/00 ,  H02K41/02 ,  H05K3/30 ,  B65G1/12

    CPC分类号： H01L21/67144 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T74/20341 ,  Y10T74/20354

    摘要： An apparatus for mounting semiconductors contains a bonding station, whereby the bonding station comprises a wafer table for presenting the semiconductor chips, a substrate table and a pick and place system with a bondhead with a chip gripper. Part of the wafer table is located underneath the substrate table. The pick and place system has a first linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a first direction guided by first guide elements, and a second linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a second direction. The shuttle of the first linear motor has second guide elements that guide the shuttle of the second linear motor. The bondhead with the chip gripper is arranged on the shuttle of the second linear motor.

    摘要翻译： 一种用于安装半导体的装置包括一个焊接站，由此焊接站包括用于呈现半导体芯片的晶片台，衬底台和具有带芯片夹持器的接合头的拾取和放置系统。 晶片台的一部分位于基板台下方。 拾取和放置系统具有第一线性电动机，其包括刚性布置的定子和可沿着由第一引导元件引导的第一方向移动的梭子，以及包括刚性布置的定子和梭子的第二线性马达， 沿第二个方向移动 第一线性马达的梭子具有引导第二线性马达的往复运动的第二引导元件。 具有芯片夹持器的接合头布置在第二线性电动机的梭上。