Electronic component comprising predominantly organic functional materials and a method for the production thereof
    6.
    发明授权
    Electronic component comprising predominantly organic functional materials and a method for the production thereof 失效
    主要包含有机功能材料的电子部件及其生产方法

    公开(公告)号:US08044517B2

    公开(公告)日:2011-10-25

    申请号:US10523216

    申请日:2003-07-09

    IPC分类号: H01L29/41 H01L21/44

    摘要: An electronic component comprises a plurality of layers at least two of which comprise predominantly organic functional materials with improved through-plating through certain of the layers. The through-plating is formed in one embodiment by a disruption element on a first lower layer which results in a void in the subsequently applied layers, which void is filled with a material which may be conductive to form the through plating. In a second embodiment, the through plating is formed on the first lower layer prior to the subsequent application of the other layers, in the form of a free-standing truncated frusto-conical raised portion, and forms a disruption or non-welting element for the subsequently applied other layers, formed on the first lower layer and which are engaged with and surround the through plating after their application.

    摘要翻译: 电子部件包括多个层,其中至少两个主要包含具有通过某些层改进的穿透电镀的有机功能材料。 在一个实施方案中,通过在第一下层上的破坏元件形成贯通镀层,导致随后施加的层中的空隙,该空隙填充有可导电以形成贯通镀层的材料。 在第二实施例中,在随后施加其它层的自由截头圆锥形凸起部分的形式之前,在第一下层上形成贯通镀层,并且形成破碎或非焊接元件 随后施加其它层,其形成在第一下层上并且在施加之后与穿过电镀层接合并围绕贯穿电镀。