公开(公告)号：US20250065430A1

公开(公告)日：2025-02-27

申请号：US18724846

申请日：2022-11-16

Applicant: BS TECHNICS Co., Ltd.

Inventor： Jun Sik KIM ,  Young Do KIM ,  Jung Sik CHOI ,  Tae Kyoung JUNG ,  Seung Ho KIM ,  In Ho PARK

IPC: B23K1/002 ,  B23K3/047 ,  B23K3/08 ,  B23K101/36

Abstract: The present invention relates to induction-heated soldering automation equipment and, particularly, to equipment comprising: a jig unit for fixing a substrate on which an electronic element is mounted; a first conveyor for transferring the jig unit; an induction heating unit which is provided above the jig unit so as to be movable in the X-axis, Y-axis, and Z-axis directions, and which includes a magnetic induction coil for soldering the electronic element by induction-heating the substrate fixed to the jig unit; and a controller for controlling the first conveyor and the induction heating unit, wherein continuously supplied molded interconnected devices (MIDs), PCBs, or FPCBs are locally heated through contactless induction heating so that electronic elements can be automatically soldered in a state in which thermal damage is minimized.

公开(公告)号：US20230356652A1

公开(公告)日：2023-11-09

申请号：US18140447

申请日：2023-04-27

Applicant: HYUNDAI MOTOR COMPANY ,  KIA CORPORATION ,  BS TECHNICS CO., LTD. ,  NIFCO KOREA INC. ,  HYUNDAI MOBIS CO., LTD. ,  ALPS ELECTRIC KOREA CO., LTD.

Inventor： Jun Sik Kim ,  Jung Sik Choi ,  Young Do Kim ,  Tae Kyoung Jung ,  Seung-Sik Han ,  Hong-Sik Chang ,  Kwang-Pyo Cho ,  Young-Ju Lee ,  Jong-Hyun Park ,  Jin-Won Lee ,  Jun-Geun Oh ,  Cheon-Ho Kim ,  Young-Jai Im ,  Sun-Mi Oh ,  Kang-Sun Lee ,  Sae-Ah Kim ,  Jong-Eun Park ,  Kwan-Woo Lee ,  Jong-Chae Lee ,  Jun-Hyun Park ,  Won-Il Lee ,  Dae-Woo Park

IPC: B60Q1/26 ,  H02J50/10 ,  F21V19/00 ,  F21V29/70

CPC classification number: B60Q1/2696 ,  H02J50/10 ,  F21V19/002 ,  F21V29/70 ,  F21Y2115/10

Abstract: A light-emitting diode (LED) lamp for a vehicle and a method of manufacturing the same use MID and magnetic induction technologies. The LED lamp includes a LED module, a housing accommodating the LED module, and a molded interconnect device (MID) electrode formed on a surface of the housing. The LED module may be mounted on the MID electrode by soldering using magnetic induction heating, the housing may be an injection molded product, and the MID electrode may be formed on the housing using a MID process.

公开(公告)号：US20250066925A1

公开(公告)日：2025-02-27

申请号：US18541664

申请日：2023-12-15

Applicant: HYUNDAI MOTOR COMPANY ,  KIA CORPORATION ,  BS TECHNICS CO.,LTD. ,  ALPS ELECTRIC KOREA CO.,LTD.

Inventor： Young Ju Lee ,  Kwang Pyo Cho ,  Hong Sik Chang ,  Seung Sik Han ,  Young Jai Im ,  Jun Sik Kim ,  Young Do Kim ,  Jung Sik Choi ,  Tae Kyoung Jung ,  In Ho Park ,  Seon Dong Kim ,  Dae Woo Park

IPC: C23F17/00 ,  C23C18/16 ,  C25D5/02 ,  C25D5/56

Abstract: A method of manufacturing interior parts for a vehicle includes: forming a first plating layer on a surface of an injection molded product through electroless plating; printing a symbol part on the first plating layer; partially removing the first plating layer to a size corresponding to the symbol part from a rear surface of the injection molded product; forming a second plating layer on the first plating layer; and removing the symbol part and the first plating layer from the surface of the injection molded product on which the second plating layer is formed.

公开(公告)号：US20250014786A1

公开(公告)日：2025-01-09

申请号：US18232920

申请日：2023-08-11

Applicant: BS TECHNICS Co., Ltd. ,  KOREA ELECTRIC TERMINAL CO., LTD

Inventor： Jun Sik KIM ,  Jung Sik CHOI ,  Young Do KIM ,  Tae Yeon JO

IPC: H01B19/04 ,  H01B17/16 ,  H01B17/56

Abstract: Disclosed is a method of manufacturing an insulating sheet, comprising: forming at least a groove on a flat sheet; a first cutting step for cutting a side surface of the groove by irradiating a laser beam to a side surface of the sheet; a second cutting step for cutting the insulating sheet to completely separate the groove from the insulating sheet by irradiating a laser beam from above the groove having the side surface cut; a tape attaching step for attaching a tape to an outer surface of the insulating sheet; and a bending step for bending one end portion of the surface of the insulating sheet having the tape attached toward a place where the tape is attached. It is possible to mass-produce the insulating sheets having a three-dimensional shape, regarded as being difficult to manufacture with a mold.

公开(公告)号：US12065073B2

公开(公告)日：2024-08-20

申请号：US18140447

申请日：2023-04-27

Applicant: HYUNDAI MOTOR COMPANY ,  KIA CORPORATION ,  BS TECHNICS CO., LTD. ,  NIFCO KOREA INC. ,  HYUNDAI MOBIS CO., LTD. ,  ALPS ELECTRIC KOREA CO., LTD.

Inventor： Jun Sik Kim ,  Jung Sik Choi ,  Young Do Kim ,  Tae Kyoung Jung ,  Seung-Sik Han ,  Hong-Sik Chang ,  Kwang-Pyo Cho ,  Young-Ju Lee ,  Jong-Hyun Park ,  Jin-Won Lee ,  Jun-Geun Oh ,  Cheon-Ho Kim ,  Young-Jai Im ,  Sun-Mi Oh ,  Kang-Sun Lee ,  Sae-Ah Kim ,  Jong-Eun Park ,  Kwan-Woo Lee ,  Jong-Chae Lee ,  Jun-Hyun Park ,  Won-Il Lee ,  Dae-Woo Park

IPC: H02J50/10 ,  B60Q1/26 ,  F21V19/00 ,  F21V29/70 ,  F21Y115/10

CPC classification number: B60Q1/2696 ,  F21V19/002 ,  F21V29/70 ,  H02J50/10 ,  F21Y2115/10

Abstract: A light-emitting diode (LED) lamp for a vehicle and a method of manufacturing the same use MID and magnetic induction technologies. The LED lamp includes a LED module, a housing accommodating the LED module, and a molded interconnect device (MID) electrode formed on a surface of the housing. The LED module may be mounted on the MID electrode by soldering using magnetic induction heating, the housing may be an injection molded product, and the MID electrode may be formed on the housing using a MID process.

公开(公告)号：US20240179850A1

公开(公告)日：2024-05-30

申请号：US18432807

申请日：2024-02-05

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  BS TECHNICS CO., LTD. ,  INTOPS CO., LTD.

Inventor： Chunghyo JUNG ,  Chiyoung YOON ,  Jungsik CHOI

IPC: H05K3/34 ,  B23K1/002 ,  B23K101/42 ,  H05K3/10 ,  H05K3/42

CPC classification number: H05K3/3485 ,  B23K1/002 ,  H05K3/101 ,  H05K3/3494 ,  H05K3/429 ,  B23K2101/42 ,  H05K2203/0126 ,  H05K2203/101

Abstract: An electronic device includes an injection mold including a mounting part and a wiring groove, a plated wiring plated on the wiring groove, and an electronic element mounted on the mounting part and electrically connected to the plated wiring, wherein the plated wiring is plated on an outer region of the injection mold, and the electronic element mounted on the injection mold dispensed on the plated wiring.

公开(公告)号：US12283398B2

公开(公告)日：2025-04-22

申请号：US18232920

申请日：2023-08-11

Applicant: BS TECHNICS Co., Ltd. ,  KOREA ELECTRIC TERMINAL CO., LTD

Inventor： Jun Sik Kim ,  Jung Sik Choi ,  Young Do Kim ,  Tae Yeon Jo

IPC: B23K26/38 ,  B23K26/351 ,  H01B17/16 ,  H01B17/56 ,  H01B19/04 ,  H01B3/30

Abstract: Disclosed is a method of manufacturing an insulating sheet, comprising: forming at least a groove on a flat sheet; a first cutting step for cutting a side surface of the groove by irradiating a laser beam to a side surface of the sheet; a second cutting step for cutting the insulating sheet to completely separate the groove from the insulating sheet by irradiating a laser beam from above the groove having the side surface cut; a tape attaching step for attaching a tape to an outer surface of the insulating sheet; and a bending step for bending one end portion of the surface of the insulating sheet having the tape attached toward a place where the tape is attached. It is possible to mass-produce the insulating sheets having a three-dimensional shape, regarded as being difficult to manufacture with a mold.