公开(公告)号：US5446247A

公开(公告)日：1995-08-29

申请号：US154576

申请日：1993-11-19

申请人： Lubomir Cergel ,  Barry C. Johnson ,  John W. Stafford

发明人： Lubomir Cergel ,  Barry C. Johnson ,  John W. Stafford

IPC分类号： H01L21/60 ,  H05K3/34 ,  H05K1/00

CPC分类号： H05K3/3484 ,  H01L24/11 ,  H05K3/3452 ,  H01L2924/14 ,  H05K2201/0989 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K2203/0568

摘要： An electrical contact and method for making an electrical contact allows a flat contact (404) to be formed early in the process of making an electronic device. The flat contact (404) is level with the remainder of the substrate (116) in which it is formed. The flat contact (404) does not interfere with any required subsequent process steps. The flat contact can be reflowed to form a ball contact (302) which protrudes above the top of the substrate (120) to which it is attached.

摘要翻译： 用于制造电接触的电触点和方法允许在制造电子装置的过程中早期形成平坦的触点（404）。 平面触点（404）与其中形成的基板（116）的其余部分平齐。 扁平触点（404）不会干扰任何所需的后续处理步骤。 平面接触件可以被回流以形成突出于其所附着的基板（120）的顶部上方的球接触件（302）。

公开(公告)号：US09709238B2

公开(公告)日：2017-07-18

申请号：US14531957

申请日：2014-11-03

申请人： Timothy Dunn ,  Timothy DiPenti ,  Jeffrey L. Church ,  Michael Marley ,  Nedim Hamzic ,  Barry C. Johnson

发明人： Timothy Dunn ,  Timothy DiPenti ,  Jeffrey L. Church ,  Michael Marley ,  Nedim Hamzic ,  Barry C. Johnson

IPC分类号： F21S8/10 ,  F21Y115/10

CPC分类号： F21S48/34 ,  F21S41/141 ,  F21S41/143 ,  F21S45/47 ,  F21S45/60 ,  F21Y2115/10

摘要： A modular headlamp assembly includes a low beam headlamp module, a high beam headlamp module, and front turn/parking lamp module. The low beam headlamp module and the high beam headlamp module are supported by a reflector carrier. Each of the high and low beam headlamp modules includes a heat sink and mounting assembly with a heat sink portion bisecting a reflector member. The headlamp includes a lens with a wire heating element embedded therein and a wire heating element circuit board affixed to the lens. A thermistor is affixed to the lens for sensing when the lens reaches a predetermined condition and a micro-controller is provided for activating or deactivating the wire heating element based on the predetermined condition sensed by the thermistor.

公开(公告)号：USD429543S

公开(公告)日：2000-08-15

申请号：US86894

申请日：1998-04-22

申请人： Colman C. Garland ,  Andrew J. Curello ,  Barry C. Johnson, III

设计人： Colman C. Garland ,  Andrew J. Curello ,  Barry C. Johnson, III

公开(公告)号：US4702941A

公开(公告)日：1987-10-27

申请号：US593949

申请日：1984-03-27

申请人： Curtis W. Mitchell ,  Barry C. Johnson

发明人： Curtis W. Mitchell ,  Barry C. Johnson

IPC分类号： B23K20/233 ,  B23K35/00 ,  C23C14/16 ,  C23C14/58 ,  C23C26/00 ,  C23C16/06

CPC分类号： C23C14/16 ,  B23K20/233 ,  B23K35/001 ,  C23C14/58 ,  C23C14/5806 ,  C23C14/5893 ,  C23C26/00 ,  H01L24/29 ,  H01L24/83 ,  B23K2035/008 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/83191 ,  H01L2224/83805 ,  H01L2924/01029 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253

摘要： A one step metallization is disclosed for applying a layer of gold or gold alloy to the back of a silicon substrate to facilitate bonding that substrate to a metallized package member. The gold is applied to the substrate, for example by evaporation, while the substrate is maintained at a temperature between about 200.degree. C. and about 360.degree. C. Following the deposition the substrate is quickly cooled to room temperature. The thickness of the gold layer and the deposition temperature are adjusted to insure that the silicon diffusion profile is contained within the gold film during deposition. This insures good adhesion of the gold to the silicon substrate and provides a pure gold surface layer necessary for optimum bonding of the semiconductor substrate to a metallized package portion.

摘要翻译： 公开了一步金属化用于将金或金合金层施加到硅衬底的背面以便于将衬底粘合到金属化封装构件。 例如通过蒸发将金施加到基底上，同时将基底保持在约200℃至约360℃之间的温度。沉积后，将基底快速冷却至室温。 调整金层的厚度和沉积温度以确保在沉积期间硅扩散轮廓包含在金膜内。 这确保了金与硅衬底的良好粘附，并且提供了将半导体衬底与金属化封装部分最佳结合所需的纯金表面层。

公开(公告)号：USD434186S

公开(公告)日：2000-11-21

申请号：US107322

申请日：1999-06-30

申请人： Colman C. Garland ,  Andrew J. Curello ,  Barry C. Johnson, III

设计人： Colman C. Garland ,  Andrew J. Curello ,  Barry C. Johnson, III

公开(公告)号：US4189084A

公开(公告)日：1980-02-19

申请号：US916326

申请日：1978-06-15

申请人： Barry C. Johnson ,  Vincent J. Pellechia

发明人： Barry C. Johnson ,  Vincent J. Pellechia

IPC分类号： H01C1/144 ,  H01C1/146 ,  H01G2/12 ,  H01B1/08

CPC分类号： H01G2/12 ,  H01C1/144 ,  H01C1/146 ,  Y10T29/49174

摘要： A brazing operation, using a silver-copper alloy preform in a temperature range of from 800.degree. C. to 1100.degree. C., is employed to attach either radial or axial conductive leads to ceramic non-linear resistors or capacitors, thereby eliminating the necessity of titanium-silver vacuum deposition or conductive cermet application prior to lead attachment. Glass encapsulation may be accomplished simultaneous with the brazing operation to further reduce cost.

摘要翻译： 使用在800℃至1100℃的温度范围内使用银 - 铜合金预成型件的钎焊操作将径向或轴向导电引线连接到陶瓷非线性电阻器或电容器，从而消除了必要性 的钛 - 银真空沉积或导电金属陶瓷应用在引线附着之前。 玻璃封装可以与钎焊操作同时完成，以进一步降低成本。

公开(公告)号：US4099991A

公开(公告)日：1978-07-11

申请号：US728975

申请日：1976-10-04

申请人： Horace Pops ,  Barry C. Johnson

发明人： Horace Pops ,  Barry C. Johnson

IPC分类号： C22F1/00 ,  C22F1/08

CPC分类号： C22F1/006 ,  Y10T29/49121

摘要： A method for making an integrated circuit package includes the steps of fabricating lead frames from a copper-zinc-silicon beta brass alloy and soldering the leads thereof to semi-conductor chips by use of the shape memory and reverse shape memory characteristic of the alloy. The composition of the lead frame material and the choice and sequence of fabrication steps may be varied.

摘要翻译： 制造集成电路封装的方法包括以下步骤：通过使用形状记忆和合金的逆向形状记忆特性，从铜 - 锌 - 硅β黄铜合金制造引线框架并将其引线焊接到半导体芯片。 引线框架材料的组成以及制造步骤的选择和顺序可以变化。

公开(公告)号：US5411400A

公开(公告)日：1995-05-02

申请号：US209353

申请日：1994-03-14

申请人： Ravichandran Subrahmanyan ,  Ravinder K. Sharma ,  William H. Lytle ,  Barry C. Johnson

发明人： Ravichandran Subrahmanyan ,  Ravinder K. Sharma ,  William H. Lytle ,  Barry C. Johnson

IPC分类号： H05K3/32 ,  H05K7/10 ,  H01R9/09

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/90 ,  H05K3/326 ,  H05K7/1053 ,  H01L2224/1147 ,  H01L2224/11902 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13147 ,  H01L2224/81136 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81899 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14

摘要： A plurality of inserts (12) formed on a first substrate (11). A plurality of sockets (14) formed on a second substrate (13). Each socket of the plurality of sockets (14) on the second substrate (13) has a corresponding insert from the plurality of inserts (12) which physically aligns for coupling. At least one of the first (11) or second (13) substrates must be a semiconductor substrate. This arrangement allows for electrically connecting a semiconductor device or structure to another device for testing, burn-in, or final assembly.

摘要翻译： 形成在第一基板（11）上的多个插入件（12）。 形成在第二基板（13）上的多个插座（14）。 第二基板（13）上的多个插座（14）中的每个插座具有与多个插入件（12）相对应的插入物，物理上对准用于联接。 第一（11）或第二（13）衬底中的至少一个衬底必须是半导体衬底。 这种布置允许将半导体器件或结构电连接到另一个用于测试，老化或最终组装的器件。

公开(公告)号：US20160215952A1

公开(公告)日：2016-07-28

申请号：US14531957

申请日：2014-11-03

申请人： Timothy Dunn ,  Timothy DiPenti ,  Jeffrey L. Church ,  Michael Marley ,  Nedim Hamzic ,  Barry C. Johnson

发明人： Timothy Dunn ,  Timothy DiPenti ,  Jeffrey L. Church ,  Michael Marley ,  Nedim Hamzic ,  Barry C. Johnson

IPC分类号： F21S8/10 ,  F21V23/00

CPC分类号： F21S48/34 ,  F21S41/141 ,  F21S41/143 ,  F21S45/47 ,  F21S45/60 ,  F21Y2115/10

摘要： A modular headlamp assembly includes a low beam headlamp module, a high beam headlamp module, and front turn/parking lamp module. The low beam headlamp module and the high beam headlamp module are supported by a reflector carrier. Each of the high and low beam headlamp modules includes a heat sink and mounting assembly with a heat sink portion bisecting a reflector member. The headlamp includes a lens with a wire heating element embedded therein and a wire heating element circuit board affixed to the lens. A thermistor is affixed to the lens for sensing when the lens reaches a predetermined condition and a micro-controller is provided for activating or deactivating the wire heating element based on the predetermined condition sensed by the thermistor.

摘要翻译： 模块化前照灯组件包括近光前照灯模块，远光前照灯模块和前转/停车灯模块。 远光前照灯模块和远光前照灯模块由反射器支架支撑。 高梁和近光前照灯模块中的每一个包括具有将反射器构件平分的散热部分的散热器和安装组件。 前照灯包括具有嵌入其中的线加热元件的透镜和固定到透镜的线加热元件电路板。 当透镜达到预定条件时，将一个热敏电阻固定到透镜上，并且提供一个微控制器，用于基于由热敏电阻感测到的预定条件启动或停用线加热元件。

公开(公告)号：US06553641B1

公开(公告)日：2003-04-29

申请号：US09488086

申请日：2000-01-20

申请人： Colman C. Garland ,  Andrew J. Curello ,  Barry C. Johnson, III

发明人： Colman C. Garland ,  Andrew J. Curello ,  Barry C. Johnson, III

IPC分类号： B23P1700

CPC分类号： B29C66/69 ,  B26B21/4068 ,  B26B21/443 ,  B29C65/645 ,  B29C66/1142 ,  B29C66/526 ,  B29C66/532 ,  B29C66/61 ,  B29C66/71 ,  B29L2031/7186 ,  Y10T29/49798 ,  Y10T29/49826 ,  B29K2025/06

摘要： The present invention provides a razor with more than one shaving aid element placed in close proximity to one another on the cover of the razor. The provision of more than one shaving aid element in such manner provides a number of advantages such as: delivery of increased volume of shaving aid at the local area; simplification of manufacturing process during razor assembly; provision of different shaving aids in different shaving aid elements. A preferred shape of the shaving aid elements is cylindrical. The cylindrical shape also enhances the function of the razor by providing smoother shaving aid motion. The shaving aid element may be extruded and stored in spools for use in the razor assembly.

摘要翻译： 本发明提供一种具有多于一个剃须辅助元件的剃须刀，剃须辅助元件彼此靠近放置在剃刀的盖上。 以这种方式提供多于一个的剃刮辅助元件提供了许多优点，例如：在局部区域递送增加的剃刮助剂量; 在剃刀组装过程中简化制造过程; 在不同的剃须辅助元件中提供不同的剃刮助剂。 剃刮助剂元件的优选形状是圆柱形的。 通过提供更平滑的剃刮助剂运动，圆柱形状还增强了剃须刀的功能。 剃刮助剂元件可以挤出并存储在卷轴中以用于剃刀组件中。