摘要:
Disclosed are hot melt adhesives comprising at least one first homogeneous linear etylene polymer having a particular density and melt viscosity at 350.degree.F. (177.degree.C.), and an optional wax and tackifier. In particular, disclosed is a hot melt adhesive characterized by: a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least ibe C.sub.2 --C.sub.20 .alpha.-olefin interpolymer having a density from 0.850 g/cm.sup.3 to 0.895 g/cm.sup.3 ; and b) optionally at least one tackifying resin; and c) optionally at least one wax wherein the hot melt adhesive has a viscosity of less than about 5000 cPs (50 grams/cm.second) at 150.degree.C. Preferred hot melt adhesives for use in adhering cardboard or paperboard are disclosed, as well as the resultant adhered products. Also disclosed is a dual reactor process for the preparation of the inventive hot melt adhesives.
摘要:
Disclosed are packages, cartons, cases, and trays comprising a hot melt adhesive, in turn comprising at least one first homogenous linear or substantially linear ethylene polymer having a particular density and melt viscosity at 350° F. (177° C.), up to 60 weight percent wax and up to 40 weight percent tackifier. In particular, disclosed are packages, cartons, cases, and trays comprising a hot melt adhesive characterized by: a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least one C3-C20 &agr;-olefin interpolymer having a density from 0.850 g/cm3 to 0.895 g/cm3; and b) up to 60 weight percent of at least one tackifying resin; and c) up to 40 weight percent of at least one wax, wherein the hot melt adhesive has a viscosity of less than about 5000 cPs (50 grams/(cm.second)) at 150° C.
摘要翻译:公开了包括热熔粘合剂的包装,纸箱,壳体和托盘,其又包含至少一种在350°F(177℃)下具有特定密度和熔体粘度的第一均匀线性或基本线性乙烯聚合物, 至60重量%的蜡和至多40重量%的增粘剂。 特别地,公开了包含热熔粘合剂的包装,纸箱,壳和托盘,其特征在于:a)至少一种乙烯与至少一种具有0.850密度的C 3 -C 20α-烯烃互聚物的均匀线性或基本上线性的互聚物 g / cm 3至0.895g / cm 3; 和b)至多60重量%的至少一种增粘树脂; andc)至多一种蜡的至多40重量%,其中该热熔粘合剂在150℃下具有小于约5000cPs(50克/(cm·sec))的粘度)
摘要:
Disclosed are adhesives and processes for preparing the same, comprising at least one first homogeneous ethylene/α-olefin interpolymer, and optionally at least one tackifier, and optionally at least one plasticizer. The claimed adhesives are useful as adhesives such as are employed in various applications, such as in masking tape, clear office tape, labels, decals, bandages, decorative and protective sheets (such as shelf and drawer liners), floor tiles, sanitary napkin/incontinence device placement strips, sun control films, the joining of gaskets to automobile windows, packaging, bookbinding, construction of nonwoven articles, and insulation bonding.
摘要:
The invention provides an adhesive formulation comprising an olefin block copolymer comprising hard blocks and soft blocks wherein the hard blocks comprise 4-8 mol % comonomer; and are present in an amount of 20 wt %-45 wt %. This formulation is particularly advantageous for use in hot melt adhesives but may be used in other applications as well.
摘要:
An adhesive composition comprises: (i) at least one ethylene/α-olefin interpolymer, (ii) at least one tackifÊer; and (iii) optionally at least one additive, such as a plasticizer, wax and antioxidant. Preferably, the ethylene/α-olefin interpolymer has a Mw/Mn from about 1.7 to about 3.5, at least one melting point, Tm, in degrees Celsius, and a density, d, in grams/cubic centimeter, wherein the numerical values of Tm and d correspond to the relationship: Tm≧858.91−1825.3(d)+1112.8(d)2. The composition has relatively higher SAFT temperature and can be used in hot melt adhesives pressure-sensitive adhesives, and thermoplastic marking paints.
摘要:
The invention provides compositions containing at least one functionalized polyolefin, and in particular, to compositions containing at least one functionalized ethylene interpolymer, which has a melt viscosity less than 50,000 cP at 350° F. (177° C.) and a molecular weight distribution (Mw/Mn) from about 1 to 5. The invention also provides adhesive formulations containing the same. The invention also relates to the preparation of the functionalized interpolymers, by reacting, for example, such an ethylene interpolymer with the following: a) at least one unsaturated compound, containing at least one heteroatom, and b) at least one initiator.
摘要:
The invention provides a comprising one or more ethylene interpolymers, and wherein the interpolymers, or the composition, has a melt viscosity from 1 to 30,000 cP at 177° C., and wherein at least one ethylene interpolymer has an Rv from 0.3 to 0.99. The invention further provides a composition comprising at least one low molecular weight (LMW) ethylene interpolymer, and at least one high molecular weight (HMW) ethylene interpolymer, and wherein the composition has a melt viscosity from 1 to 30,000 cP at 177° C., and wherein the sum of the Rv from the low molecular weight interpolymer and the high molecular weight interpolymer is from 0.3 to 2. The invention further provides for processes of making such compositions, processes for functionalizing the interpolymer(s) of such compositions, and articles comprising at least one component prepared from an inventive composition.
摘要:
The invention relates to functionalized interpolymers derived from base olefin interpolymers, which are prepared by polymerizing one or more monomers or mixtures of monomers, such as ethylene and one or more comonomers, to form an interpolymer products having unique physical properties. The functionalized olefin interpolymers contain two or more differing regions or segments (blocks), resulting in unique processing and physical properties.
摘要:
An adhesive composition comprises: (i) at least one ethylene/α-olefin interpolymer, (ii) at least one tackifier; and (iii) optionally at least one additive, such as a plasticizer, wax and antioxidant. Preferably, the ethylene/α-olefin interpolymer has a Mw/Mn from about 1.7 to about 3.5, at least one melting point, Tm, in degrees Celsius, and a density, d, in grams/cubic centimeter, wherein the numerical values of Tm and d correspond to the relationship: Tm≧858.91−1825.3(d)+1112.8(d)2. The composition has relatively higher SAFT temperature and can be used in hot melt adhesives pressure-sensitive adhesives, and thermoplastic marking paints.
摘要:
The invention relates to functionalized interpolymers derived from base olefin interpolymers, which are prepared by polymerizing one or more monomers or mixtures of monomers, such as ethylene and one or more comonomers, to form an interpolymer products having unique physical properties. The functionalized olefin interpolymers contain two or more differing regions or segments (blocks), resulting in unique processing and physical properties.