公开(公告)号：US06838753B2

公开(公告)日：2005-01-04

申请号：US10328235

申请日：2002-12-23

申请人： Sang-kyun Lee ,  Bong-hui Lee ,  Dong-hoon Lee

发明人： Sang-kyun Lee ,  Bong-hui Lee ,  Dong-hoon Lee

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/02 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50

CPC分类号： H01L24/86 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided are a lead frame strip and a method of fabricating a semiconductor package using the same. The lead frame strip includes at least one lead frame panel in which a plurality of unit lead frames are arranged to be connected with one another in matrix forms, wherein each unit lead frame includes: a die pad to which a semiconductor chip is to be mounted; a tie bar, an end of which being connected to the die pad and processed to be downset; a plurality of leads positioned at the same level as another end of the tie bar and extended with a predetermined distance from the tie pad; a dam bar formed across the leads and united with the leads to support the leads, wherein a slot is formed along edges of the lead frame panel and functions as a buffer, and a connection bar is formed widthwise across the slot to support the lead frame panel.

摘要翻译： 提供一种引线框带和使用其制造半导体封装的方法。 引线框架条包括至少一个引线框架板，其中多个单元引线框架被布置为以矩阵形式彼此连接，其中每个单元引线框架包括：待安装半导体芯片的管芯焊盘 ; 连接杆，其端部连接到管芯焊盘并被处理成不利的; 多个引线定位在与连接杆的另一端处于同一水平面并且从连接垫延伸预定距离; 形成在引线上并与导线结合以支撑引线的阻挡杆，其中，沿着引线框架板的边缘形成有槽，并且用作缓冲器，并且连接杆横跨所述槽形成以支撑引线框架 面板。

公开(公告)号：US07119285B2

公开(公告)日：2006-10-10

申请号：US10790310

申请日：2004-03-01

申请人： Deok-heung Kim ,  Bong-hui Lee

发明人： Deok-heung Kim ,  Bong-hui Lee

IPC分类号： H05K1/00 ,  H05K1/03

CPC分类号： H05K1/028 ,  H05K3/28 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09627 ,  H05K2201/0979 ,  H05K2201/10666

摘要： A flexible printed circuit board (FPCB) which prevents a short circuit due to a crack in a bending portion is provided. The FPCB includes an end portion, a bending portion extended from the end portion, and a circuit portion extended from the bending portion. The improved FPCB includes a base film which is flexible and comprises a first via-hole formed adjacent to the end portion and the bending portion and a second via-hole formed adjacent to the bending portion and the circuit portion, a first conductive layer formed on an outer surface of at least the end portion and the bending portion, a cover layer formed on the first conductive layer, a second conductive layer which is formed on an inner surface of the end portion and is electrically connected to the first conductive layer through the first via-hole, and a third conductive layer which is formed on an inner surface of the extension circuit portion and is electrically connected to the first conductive layer through the second via-hole.

摘要翻译： 提供一种柔性印刷电路板（FPCB），其防止由于弯曲部分的裂纹引起的短路。 FPCB包括端部，从端部延伸的弯曲部和从弯曲部延伸的电路部。 改进的FPCB包括柔性的基膜，包括邻近端部和弯曲部分形成的第一通孔和邻近弯曲部分和电路部分形成的第二通孔，形成在第一导电层上的第一导电层 至少所述端部和所述弯曲部的外表面，形成在所述第一导电层上的覆盖层，形成在所述端部的内表面上并通过所述第一导电层电连接到所述第一导电层的第二导电层 第一导电孔和第三导电层，其形成在延伸电路部分的内表面上，并通过第二通孔与第一导电层电连接。

公开(公告)号：US20050122700A1

公开(公告)日：2005-06-09

申请号：US10790310

申请日：2004-03-01

申请人： Deok-heung Kim ,  Bong-hui Lee

发明人： Deok-heung Kim ,  Bong-hui Lee

IPC分类号： H05K1/02 ,  H05K1/00 ,  H05K3/28 ,  H05K3/32 ,  H05K3/36 ,  H01R11/09 ,  H05K1/11 ,  H05K1/14

CPC分类号： H05K1/028 ,  H05K3/28 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09627 ,  H05K2201/0979 ,  H05K2201/10666

摘要： A flexible printed circuit board (FPCB) which prevents a short circuit due to a crack in a bending portion is provided. The FPCB includes an end portion, a bending portion extended from the end portion, and a circuit portion extended from the bending portion. The improved FPCB includes a base film which is flexible and comprises a first via-hole formed adjacent to the end portion and the bending portion and a second via-hole formed adjacent to the bending portion and the circuit portion, a first conductive layer formed on an outer surface of at least the end portion and the bending portion, a cover layer formed on the first conductive layer, a second conductive layer which is formed on an inner surface of the end portion and is electrically connected to the first conductive layer through the first via-hole, and a third conductive layer which is formed on an inner surface of the extension circuit portion and is electrically connected to the first conductive layer through the second via-hole.

摘要翻译： 提供一种柔性印刷电路板（FPCB），其防止由于弯曲部分的裂纹引起的短路。 FPCB包括端部，从端部延伸的弯曲部和从弯曲部延伸的电路部。 改进的FPCB包括柔性的基膜，包括邻近端部和弯曲部分形成的第一通孔和邻近弯曲部分和电路部分形成的第二通孔，形成在第一导电层上的第一导电层 至少所述端部和所述弯曲部的外表面，形成在所述第一导电层上的覆盖层，形成在所述端部的内表面上并通过所述第一导电层电连接到所述第一导电层的第二导电层 第一导电孔和第三导电层，其形成在延伸电路部分的内表面上，并通过第二通孔与第一导电层电连接。

公开(公告)号：US20070200214A1

公开(公告)日：2007-08-30

申请号：US11709016

申请日：2007-02-20

申请人： Bong-hui Lee

发明人： Bong-hui Lee

IPC分类号： H01L23/02

CPC分类号： H01L21/481 ,  H01L23/145 ,  H01L23/49827 ,  H01L24/97 ,  H01L2924/14 ,  H05K3/0094 ,  H05K3/28 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2203/082 ,  H01L2924/00

摘要： Provided is a board strip that includes a base substrate that has at least one hole and a plurality of functional portions in which at least one semiconductor chip is packaged; a circuit layer having a circuit pattern formed on the functional portions and dummy patterns formed on non-functional portions which are formed on a surface of the base substrate respectively; a protective layer formed on the circuit layer; and at least one vacuuming hole seating unit that is formed in a portion of the non-functional portions, is disposed on a portion that contacts a vacuuming hole, and is flat without a step difference.

摘要翻译： 提供一种板条，其包括具有至少一个孔的基底基板和至少一个半导体芯片被封装的多个功能部分; 电路层，其具有形成在所述功能部分上的电路图案和分别形成在所述基板的表面上的非功能部分上形成的虚设图案; 形成在电路层上的保护层; 并且形成在非功能部分的一部分中的至少一个吸尘孔座单元设置在与吸尘孔接触的部分上，并且没有台阶差是平坦的。