公开(公告)号：US07273804B2

公开(公告)日：2007-09-25

申请号：US11030496

申请日：2005-01-06

申请人： David Angell ,  Frederic Beaulieu ,  Takashi Hisada ,  Adreanne Kelly ,  Samuel Roy McKnight ,  Hiromitsu Miyai ,  Kevin Shawn Petrarca ,  Wolfgang Sauter ,  Richard Paul Volant ,  Caitlin W. Weinstein

发明人： David Angell ,  Frederic Beaulieu ,  Takashi Hisada ,  Adreanne Kelly ,  Samuel Roy McKnight ,  Hiromitsu Miyai ,  Kevin Shawn Petrarca ,  Wolfgang Sauter ,  Richard Paul Volant ,  Caitlin W. Weinstein

IPC分类号： H01L21/44 ,  H01L21/4763 ,  H01L31/00 ,  H01L23/48

CPC分类号： H01L24/05 ,  H01L24/03 ,  H01L2224/05073 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05187 ,  H01L2224/05556 ,  H01L2224/05558 ,  H01L2224/05624 ,  H01L2224/45144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/04941 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.

摘要翻译： 公开了一种具有非平面电介质结构和在非平面电介质结构上共形形成的金属接合层的增强接合焊盘结构。 非平面电介质结构基本上在金属接合层中再现，从而形成非平面金属结构。 围绕非平面金属结构的每一个是介电材料环，其在接合焊盘探测期间提供硬停止，以限制在探测期间可以去除的接合焊盘的量。

公开(公告)号：US07025891B2

公开(公告)日：2006-04-11

申请号：US10604991

申请日：2003-08-29

申请人： Steven R. Codding ,  Timothy C. Krywanczyk ,  Joseph D. Danaher ,  John C. Malinowski ,  James R. Palmer ,  Melvin T. Kelly ,  Caitlin W. Weinstein ,  Wolfgang Sauter

发明人： Steven R. Codding ,  Timothy C. Krywanczyk ,  Joseph D. Danaher ,  John C. Malinowski ,  James R. Palmer ,  Melvin T. Kelly ,  Caitlin W. Weinstein ,  Wolfgang Sauter

IPC分类号： B44C1/22 ,  C25F3/00

CPC分类号： H01L21/3212 ,  C23F3/06

摘要： A method of treating a molybdenum (moly) mask used in a C4 process to pattern C4 contacts. The moly mask has a wafer side which contacts a wafer during the C4 process and has a rough surface that includes spikes/projections of moly. The moly mask also has a non wafer side and a plurality of holes extending through the mask to pattern C4 contacts in the C4 process. An adhesive layer, such as an adhesive tape, is applied to the non wafer side of the moly mask, to enable a polishing tool to pull a vacuum on the non wafer side of the moly mask in spite of the presence of the holes to secure the moly mask during a subsequent polishing step. The tape also functions as a cushion so that defects on the non wafer side of the moly mask do not replicate through the moly mask to the polished wafer side of the moly mask. The wafer side of the moly mask is then subjected to mechanical or chemical/mechanical polishing to substantially remove the spikes of moly without significantly altering the dimensions of the moly mask or the holes.

摘要翻译： 一种处理C4工艺中使用的钼（钼）掩模的图案化C4接触的方法。 钼掩模具有在C4工艺期间接触晶片的晶片侧，并且具有包括钼的尖峰/突起的粗糙表面。 钼掩模还具​​有非晶片侧和在C4工艺中延伸穿过掩模以形成图案C4触点的多个孔。 粘合剂层例如胶带被施加到钼掩模的非晶片侧，以使抛光工具能够在钼掩模的非晶片侧上拉真空，尽管存在孔以确保 在随后的抛光步骤期间的钼掩模。 胶带还起垫片的作用，使得钼掩模的非晶片侧的缺陷不会通过钼掩模复制到钼掩模的抛光晶片侧。 然后对钼掩模的晶片侧进行机械或化学/机械抛光，以基本上除去钼的尖峰而不显着改变钼掩模或孔的尺寸。

公开(公告)号：US06864578B2

公开(公告)日：2005-03-08

申请号：US10249381

申请日：2003-04-03

申请人： David Angell ,  Frederic Beaulieu ,  Takashi Hisada ,  Adreanne Kelly ,  Samuel Roy McKnight ,  Hiromitsu Miyai ,  Kevin Shawn Petrarca ,  Wolfgang Sauter ,  Richard Paul Volant ,  Caitlin W. Weinstein

发明人： David Angell ,  Frederic Beaulieu ,  Takashi Hisada ,  Adreanne Kelly ,  Samuel Roy McKnight ,  Hiromitsu Miyai ,  Kevin Shawn Petrarca ,  Wolfgang Sauter ,  Richard Paul Volant ,  Caitlin W. Weinstein

IPC分类号： H01L23/485 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/05 ,  H01L24/03 ,  H01L2224/05073 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05187 ,  H01L2224/05556 ,  H01L2224/05558 ,  H01L2224/05624 ,  H01L2224/45144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/04941 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.