公开(公告)号：US07273804B2

公开(公告)日：2007-09-25

申请号：US11030496

申请日：2005-01-06

申请人： David Angell ,  Frederic Beaulieu ,  Takashi Hisada ,  Adreanne Kelly ,  Samuel Roy McKnight ,  Hiromitsu Miyai ,  Kevin Shawn Petrarca ,  Wolfgang Sauter ,  Richard Paul Volant ,  Caitlin W. Weinstein

发明人： David Angell ,  Frederic Beaulieu ,  Takashi Hisada ,  Adreanne Kelly ,  Samuel Roy McKnight ,  Hiromitsu Miyai ,  Kevin Shawn Petrarca ,  Wolfgang Sauter ,  Richard Paul Volant ,  Caitlin W. Weinstein

IPC分类号： H01L21/44 ,  H01L21/4763 ,  H01L31/00 ,  H01L23/48

CPC分类号： H01L24/05 ,  H01L24/03 ,  H01L2224/05073 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05187 ,  H01L2224/05556 ,  H01L2224/05558 ,  H01L2224/05624 ,  H01L2224/45144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/04941 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.

摘要翻译： 公开了一种具有非平面电介质结构和在非平面电介质结构上共形形成的金属接合层的增强接合焊盘结构。 非平面电介质结构基本上在金属接合层中再现，从而形成非平面金属结构。 围绕非平面金属结构的每一个是介电材料环，其在接合焊盘探测期间提供硬停止，以限制在探测期间可以去除的接合焊盘的量。

公开(公告)号：US06864578B2

公开(公告)日：2005-03-08

申请号：US10249381

申请日：2003-04-03

申请人： David Angell ,  Frederic Beaulieu ,  Takashi Hisada ,  Adreanne Kelly ,  Samuel Roy McKnight ,  Hiromitsu Miyai ,  Kevin Shawn Petrarca ,  Wolfgang Sauter ,  Richard Paul Volant ,  Caitlin W. Weinstein

发明人： David Angell ,  Frederic Beaulieu ,  Takashi Hisada ,  Adreanne Kelly ,  Samuel Roy McKnight ,  Hiromitsu Miyai ,  Kevin Shawn Petrarca ,  Wolfgang Sauter ,  Richard Paul Volant ,  Caitlin W. Weinstein

IPC分类号： H01L23/485 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/05 ,  H01L24/03 ,  H01L2224/05073 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05187 ,  H01L2224/05556 ,  H01L2224/05558 ,  H01L2224/05624 ,  H01L2224/45144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/04941 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.

公开(公告)号：US06747472B2

公开(公告)日：2004-06-08

申请号：US10052619

申请日：2002-01-18

申请人： John Harold Magerlein ,  Samuel Roy McKnight ,  Kevin Shawn Petrarca ,  Sampath Purushothaman ,  Carlos Juan Sambucetti ,  Joseph J. Van Horn ,  Richard Paul Volant ,  George Frederick Walker

发明人： John Harold Magerlein ,  Samuel Roy McKnight ,  Kevin Shawn Petrarca ,  Sampath Purushothaman ,  Carlos Juan Sambucetti ,  Joseph J. Van Horn ,  Richard Paul Volant ,  George Frederick Walker

IPC分类号： G01R3126

CPC分类号： H01L24/11 ,  G01R1/0416 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K3/244 ,  H05K3/325 ,  H01L2924/00 ,  H01L2224/05541 ,  H01L2224/05005

摘要： A system for testing a collection of device chips by temporarily attaching them to a carrier having a plurality of receptacles with microdendritic features; the receptacles matching with and pushed in contact with a matching set of contact pads on the device chips; said carrier additionally having test pads connected to the receptacles through interconnect wiring. The system allows connecting the chips together and testing the collection as a whole by probing the test pads on the carrier. Burn-in of the collection of chips can also be performed on the temporary carrier, which is reusable.

摘要翻译： 一种用于通过将装置芯片临时附接到具有多个具有微树突状特征的容器的载体来测试装置芯片集合的系统; 所述插座与所述器件芯片上的匹配的接触焊盘组匹配并且与所述插座接触; 所述载体另外具有通过互连布线连接到插座的测试垫。 该系统允许将芯片连接在一起，并通过探测载体上的测试垫来整体测试集合。 芯片集合的老化也可以在临时载体上执行，这是可重复使用的。

公开(公告)号：US20090004840A1

公开(公告)日：2009-01-01

申请号：US11769389

申请日：2007-06-27

申请人： Matthew J. Farinelli ,  Steven Cordes ,  Donna S. Nielsen ,  Samuel Roy McKnight ,  Jay S. Chey ,  Peter A. Gruber ,  Joanna Rosner

发明人： Matthew J. Farinelli ,  Steven Cordes ,  Donna S. Nielsen ,  Samuel Roy McKnight ,  Jay S. Chey ,  Peter A. Gruber ,  Joanna Rosner

IPC分类号： H01L21/441 ,  H01B13/00

CPC分类号： H05K3/3457 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1308 ,  H01L2224/13147 ,  H01L2224/13171 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H05K2203/0113 ,  H05K2203/0338 ,  H01L2924/00

摘要： A method for fabricating a solder transfer mold includes masking a substrate with a masking agent. A pattern is transferred to the substrate mask. The masked substrate is etched until cavities of a first volume are formed. The cavities of the first volume are selectively coated. The masked substrate is etched until cavities of a second volume are formed.

摘要翻译： 一种制造焊料转移模具的方法包括用掩蔽剂掩蔽衬底。 将图案转移到基板掩模。 蚀刻掩蔽的基板直到形成第一体积的空腔。 选择性地涂覆第一体积的空腔。 蚀刻掩蔽的基板直到形成第二体积的空腔。

公开(公告)号：US20090001248A1

公开(公告)日：2009-01-01

申请号：US11844070

申请日：2007-08-23

申请人： Matthew J. Farinelli ,  Steven Cordes ,  Donna S. Nielsen ,  Samuel Roy McKnight ,  Jay S. Chey ,  Peter A. Gruber ,  Joanna Rosner

发明人： Matthew J. Farinelli ,  Steven Cordes ,  Donna S. Nielsen ,  Samuel Roy McKnight ,  Jay S. Chey ,  Peter A. Gruber ,  Joanna Rosner

IPC分类号： B22C9/00

CPC分类号： H05K3/3457 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1308 ,  H01L2224/13147 ,  H01L2224/13171 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H05K2203/0113 ,  H05K2203/0338 ,  H01L2924/00

摘要： A solder mold includes a substrate and a plurality of cavities for holding solder to be transferred to an integrated circuit. The plurality of cavities comprises cavities of at least two different volumes.

摘要翻译： 焊模包括基板和多个用于保持待传送到集成电路的焊料的空腔。 多个空腔包括至少两个不同体积的空腔。