公开(公告)号：US20080001241A1

公开(公告)日：2008-01-03

申请号：US11713804

申请日：2007-03-01

申请人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom ,  Charles Goudge ,  Anita Woll

发明人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom ,  Charles Goudge ,  Anita Woll

IPC分类号： H01L31/0203 ,  H01L21/50 ,  H01L23/02

CPC分类号： B81C1/00301 ,  B81B2207/095 ,  B81C2203/0118 ,  C04B2237/366 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11334 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： Methods are provided for fabricating packaged chips having protective layers, e.g., lids or other overlying layers having transparent, partially transparent, or opaque characteristics or a combination of such characteristics. Methods are provided for fabricating the packaged chips. Lidded chip structures and assemblies including lidded chips are also provided.

摘要翻译： 提供了用于制造具有保护层的封装芯片的方法，例如具有透明，部分透明或不透明特性的盖或其它上覆层或这些特性的组合。 提供了制造封装芯片的方法。 还提供了带芯芯片的芯片结构和组件。

公开(公告)号：US20070034777A1

公开(公告)日：2007-02-15

申请号：US11317207

申请日：2005-12-23

申请人： David Tuckerman ,  Kenneth Honer ,  Bruce McWilliams ,  Nicholas Colella ,  Charles Goudge

发明人： David Tuckerman ,  Kenneth Honer ,  Bruce McWilliams ,  Nicholas Colella ,  Charles Goudge

IPC分类号： H01L27/00 ,  H01L31/00

CPC分类号： H04N5/2257 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14632 ,  H01L2924/0002 ,  H04N5/3415 ,  H04N9/045 ,  H04N9/09 ,  H01L2924/00

摘要： Image sensors are provided having a plurality of photodetectors in a detector layer Optionally, an optically transparent substrate is provided for a rear-illuminated sensor architecture. The photodetectors may be arranged in three or more arrays. Typically, each array is contiguous and is associated with light of a different color and/or wavelength. In addition, the arrays may be coplanar, or, in the alternative, located at increasing distances from a light-receiving surface in an at least partially nonoverlapping manner. Also provided are image sensor packages.

摘要翻译： 提供了在检测器层中具有多个光电检测器的图像传感器。可选地，为背照式传感器架构提供光学透明基板。 光电检测器可以被布置成三个或更多个阵列。 通常，每个阵列是连续的并且与不同颜色和/或波长的光相关联。 此外，阵列可以是共面的，或者在替代方案中，以至少部分不重叠的方式位于与光接收表面增加的距离处。 还提供了图像传感器封装。