公开(公告)号：US20090008801A1

公开(公告)日：2009-01-08

申请号：US12217365

申请日：2008-07-02

Applicant: Jeng-Yuan Lai ,  Chien-Ping Huang ,  Chun-Chi Ke ,  Yu-Po Wang ,  Chiao-Hung Yen

Inventor： Jeng-Yuan Lai ,  Chien-Ping Huang ,  Chun-Chi Ke ,  Yu-Po Wang ,  Chiao-Hung Yen

IPC: H01L23/52 ,  H01L21/00

CPC classification number: H05K1/0206 ,  H01L21/50 ,  H01L21/563 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/4985 ,  H01L24/17 ,  H01L24/32 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H05K1/0209 ,  H05K1/189 ,  H05K2201/09781 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00014

Abstract: This invention discloses a semiconductor device and a method for fabricating the same. The method includes providing a flexible carrier board having a first surface and a second surface opposite thereto; forming a metal lead layer and a first heat dissipating metal layer on the first surface of the flexible carrier board, and forming a second heat dissipating metal layer on the second surface of the flexible carrier board; providing a chip having an active surface and an opposed non-active surface, wherein a plurality of solder pads are formed on the active surface of the chip, each of the solder pads has a metal bump formed thereon and corresponding in position to the metal lead layer, and heat dissipating bumps are formed between the metal bumps corresponding in position to the first heat dissipating metal layer.

Abstract translation: 本发明公开了一种半导体器件及其制造方法。 该方法包括提供具有第一表面和与其相对的第二表面的柔性载体板; 在柔性载体板的第一表面上形成金属引线层和第一散热金属层，并在柔性载体板的第二表面上形成第二散热金属层; 提供具有活性表面和相对的非活性表面的芯片，其中在芯片的有源表面上形成多个焊盘，每个焊盘在其上形成金属凸块，并且在金属引线的对应位置 在与第一散热金属层的位置对应的金属凸块之间形成有散热凸块。