Laser-based material processing systems and methods for using such systems
    1.
    发明申请
    Laser-based material processing systems and methods for using such systems 审中-公开
    基于激光的材料处理系统和使用这种系统的方法

    公开(公告)号:US20070181544A1

    公开(公告)日:2007-08-09

    申请号:US11350159

    申请日:2006-02-07

    IPC分类号: B23K26/08

    摘要: Laser-based material processing systems and methods for using such systems are disclosed herein. In one embodiment, for example, a laser-based material processing system includes a workpiece support, a positioning assembly over at least a portion of the workpiece support, and a laser. The system also includes a laser beam director carried by the positioning assembly to direct a beam generated by the laser toward the workpiece support. The system further includes a dispensing unit carried by the positioning assembly to discharge a material toward the workpiece support. The dispensing unit can be configured to discharge a number of different materials onto a workpiece carried by the workpiece support.

    摘要翻译: 本文公开了基于激光的材料处理系统和使用这种系统的方法。 在一个实施例中,例如,基于激光的材料处理系统包括工件支撑件,至少部分工件支撑件上的定位组件和激光器。 该系统还包括由定位组件承载的激光束导向件,以将由激光器产生的光束引向工件支撑件。 系统还包括由定位组件承载的分配单元,以将材料朝向工件支撑件排出。 分配单元可以被配置为将许多不同的材料排放到由工件支撑件承载的工件上。

    Laser-based material processing systems and methods for using such systems
    2.
    发明申请
    Laser-based material processing systems and methods for using such systems 有权
    基于激光的材料处理系统和使用这种系统的方法

    公开(公告)号:US20070251929A1

    公开(公告)日:2007-11-01

    申请号:US11413454

    申请日:2006-04-27

    IPC分类号: B23K26/08

    摘要: Laser-based material processing systems and methods for using such systems are disclosed herein. In one embodiment, for example, a laser-based material processing system includes a workpiece support, a positioning assembly over at least a portion of the workpiece support, and a laser. The system includes a laser beam director carried by the positioning assembly to direct a beam generated by the laser toward the workpiece support. The system also includes a dispensing unit carried by the positioning assembly to discharge a material toward the workpiece support. The system further includes a controller operably coupled to the positioning assembly, the laser beam director, and the dispensing unit. The controller can be configured to move the laser beam director and the dispensing unit relative to the workpiece support such that (a) the beam is directed toward a first portion of the workpiece support, and (b) the dispensing unit discharges material toward the first portion of the workpiece support.

    摘要翻译: 本文公开了基于激光的材料处理系统和使用这种系统的方法。 在一个实施例中,例如,基于激光的材料处理系统包括工件支撑件,至少部分工件支撑件上的定位组件和激光器。 该系统包括由定位组件承载的激光束导向件,以将由激光器产生的光束引向工件支撑。 该系统还包括由定位组件承载的分配单元,以将材料朝向工件支撑件排出。 该系统还包括可操作地耦合到定位组件,激光束导向器和分配单元的控制器。 控制器可以被配置为相对于工件支撑件移动激光束导向器和分配单元,使得(a)光束指向工件支撑件的第一部分,并且(b)分配单元将材料朝向第一 工件支撑部分。

    Method and apparatus for cooling a laser
    3.
    发明申请
    Method and apparatus for cooling a laser 有权
    用于冷却激光的方法和装置

    公开(公告)号:US20050123011A1

    公开(公告)日:2005-06-09

    申请号:US10788642

    申请日:2004-02-27

    IPC分类号: H01S3/04 H01S3/041 H01S3/097

    摘要: A laser includes a laser source and an power source arranged such that both components have substantially the same cross-section, with cooling fins arranged axially along the length of each element. The components are arranged end-to-end in a series to form an assembly with substantially the same cross-section along the entire length of the assembly. A shroud mounted along the assembly forms a single air channel directing air from a fan along the entire length of the assembly, for cooling both the power source and the laser source with the total air flow from the at least one fan. The laser source and the power source are arranged in series such that the laser source is cooled first, and the subsequent air flow, although slightly warmer from cooling the laser source, is sufficient to cool the power source.

    摘要翻译: 激光器包括激光源和电源,其布置成使得两个部件具有基本上相同的横截面,其中散热片沿着每个元件的长度轴向布置。 这些部件以串联方式端对端布置,以形成沿着组件的整个长度具有基本上相同的横截面的组件。 沿着组件安装的护罩形成单个空气通道,其沿着组件的整个长度从风扇引导空气,用于从来自至少一个风扇的总空气流冷却电源和激光源。 激光源和电源串联布置,使得激光源首先被冷却,并且随后的空气流虽然从冷却激光源稍微加热,但足以冷却电源。

    Laser material processing system
    5.
    发明申请
    Laser material processing system 有权
    激光材料加工系统

    公开(公告)号:US20050121428A1

    公开(公告)日:2005-06-09

    申请号:US11002049

    申请日:2004-12-01

    IPC分类号: B23K26/06 B23K26/10 B23K26/08

    摘要: A laser material processing system and method focus a laser beam to a smaller spot size with a high power density using a movable beam expander to provide high resolution laser beam for engraving and/or cutting. A movable beam focusing assembly containing a beam expanding optics and a beam focusing optics is a part of a motion system providing a high power density focused beam within the material processing area minimizing size and weight of the laser beam positioning optics and avoiding the problems inherent in handling and positioning a larger diameter beam.

    摘要翻译: 激光材料处理系统和方法使用可移动光束扩展器将激光束聚焦成具有高功率密度的较小光斑尺寸,以提供用于雕刻和/或切割的高分辨率激光束。 包含光束扩展光学器件和光束聚焦光学器件的可移动光束聚焦组件是在材料处理区域内提供高功率密度聚焦光束的运动系统的一部分,其最小化激光束定位光学器件的尺寸和重量,并避免固有的问题 处理和定位较大直径的梁。