Abstract:
A test chip comprises at least one level having an array of regions. Each region is capable of including at least one test structure. At least some of the regions include respective test structures. The level has a plurality of driver lines that provide input signals to the test structures. The level has a plurality of receiver lines that receive output signals from the test structures. The level has a plurality of devices for controlling current flow. Each test structure is connected to at least one of the driver lines with a first one of the devices in between. Each test structure is connected to at least one of the receiver lines with a second one of the devices in between, so that each of the test structures can be individually addressed for testing using the driver lines and receiver lines.
Abstract:
A test chip comprises at least one level having an array of regions. Each region is capable of including at least one test structure. At least some of the regions include respective test structures. The level has a plurality of driver lines that provide input signals to the test structures. The level has a plurality of receiver lines that receive output signals from the test structures. The level has a plurality of devices for controlling current flow. Each test structure is connected to at least one of the driver lines with a first one of the devices in between. Each test structure is connected to at least one of the receiver lines with a second one of the devices in between, so that each of the test structures can be individually addressed for testing using the driver lines and receiver lines.
Abstract:
Systems and methods are provided to monitor usage of software applications and services. According to some embodiments, it may be determined that an application event has occurred. At least a portion of a file name may be accessed and compared to one or more actual file identifiers. An actual file identifier may then be selected based on the comparison.
Abstract:
A layout for devices under test formed on a semiconductor wafer for use in wafer testing includes a first array of devices under test and a first pad set formed adjacent to the first array. The first pad set includes a gate force pad, a source pad, and a drain pad. Each of the devices under test in the first array is connected to the gate pad of the first pad set. Each of the devices under test in the first array is connected to the source pad of the first pad set. Each of the devices under test in the first array is connected to the drain pad of the first pad set.
Abstract:
A surgical instrument system and method is provided for a hand-assisted, laparoscopic procedure. The system has a laparoscopic disc and a surgical instrument. The surgical instrument has at least one end effector that is removably attachable to the distal end of the surgical instrument. The surgeon may pass his/her hand into the body cavity via the laparoscopic disc and may removably attach the end effector to the distal end of the surgical instrument while the distal end of the surgical instrument is inside of the body cavity of the patient.
Abstract:
Disclosed is an instrument, assembly, and method for use in a procedure to effect anastomosis of a patient's bladder and urethra following a prostatectomy. The instrument comprises a tube assembly having an end effector assembly operably supported thereby, where the end effector assembly includes a harness adapted to receive a balloon portion of a balloon catheter assembly.
Abstract:
Disclosed is an instrument and method for use in a procedure to effect anastomosis of a patient's bladder and urethra following a prostatectomy. The instrument comprises a tube assembly, and an end effector assembly operably supported thereby, where the end effector assembly includes a positioner assembly and an anchor driver assembly in operable mechanical communication with a handle, for use in performing anastomotic procedures.
Abstract:
Fast localization of electrically measured defects of integrated circuits includes providing information for fabricating a test chip having test structures configured for parallel electrical testing. The test structures on the test chip are electrically tested employing a parallel electrical tester. The results of the electrical testing are analyzed to localize defects on the test chip.
Abstract:
A characterization vehicle includes a substrate having at least one layer (300), and a plurality of pairs of nested serpentine lines on a single surface of a single layer of the substrate (301a . . . 301h, 302a . . . 302h), each pair of nested serpentine lines having a shared pad between them (312a . . . 312h).
Abstract:
The method disclosed may be used following a prostatectomy may comprise inserting an instrument having an end effector into the bladder lumen via the urethra; using the end effector to urge the bladder wall to the pelvic floor and drive an anchor through the bladder wall into the pelvic floor, thereby connecting a balloon harness within the bladder to the pelvic floor; withdrawing the end effector; inserting and inflating a balloon catheter within the balloon harness, thereby pressing the bladder wall surrounding the bladder opening against the pelvic floor; maintaining the balloon catheter in place and draining the bladder during the time required for the tissues to effectively knit; and then deflating and withdrawing the balloon catheter and disconnecting and withdrawing the balloon harness. The instrument may comprise one or more tubes that support an end effector comprising a positioner and an anchor driver.