公开(公告)号：US06632372B1

公开(公告)日：2003-10-14

申请号：US09717081

申请日：2000-11-22

Applicant: Man-Lin Chen ,  Hsien-Kuang Lin ,  Chuang-Shin Chiou ,  Tien-Shou Shieh ,  Pey-Ching Liou

Inventor： Man-Lin Chen ,  Hsien-Kuang Lin ,  Chuang-Shin Chiou ,  Tien-Shou Shieh ,  Pey-Ching Liou

IPC: H01B1300

CPC classification number: H05K3/0017 ,  H05K3/4602 ,  H05K2203/025 ,  H05K2203/0582

Abstract: The invention discloses a method of forming via-holes in multilayer circuit boards. The process includes forming covering substances in predetermined spots in a multilayer circuit board and thereafter applying an insulating layer upon the circuit board. The predetermined spots are then uncovered and the covering substances are removed to form via-holes.

Abstract translation: 本发明公开了一种在多层电路板中形成通孔的方法。 该方法包括在多层电路板中的预定点形成覆盖物质，然后在电路板上施加绝缘层。 然后将预定的点未被覆盖，并且去除覆盖物质以形成通孔

公开(公告)号：US6119338A

公开(公告)日：2000-09-19

申请号：US44969

申请日：1998-03-19

Applicant: Tsung-Hsiung Wang ,  Man-Lin Chen ,  Chuang-Shin Chiou ,  Ming-Shun Chan ,  Pei-Wen Ding

Inventor： Tsung-Hsiung Wang ,  Man-Lin Chen ,  Chuang-Shin Chiou ,  Ming-Shun Chan ,  Pei-Wen Ding

IPC: H05K3/00 ,  H05K3/04 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H01K3/10

CPC classification number: H05K3/421 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0554 ,  H05K2203/085 ,  H05K3/0035 ,  H05K3/0094 ,  H05K3/045 ,  H05K3/4644 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method for making high-density multilayer printed circuit boards is disclosed. It includes the steps of: (a) forming a pair of first conductive layers on top and bottom sides of a dielectric substrate; (b) forming first via holes through one of the first electrically conductive layers; (c) forming a blind hole through the dielectric substrate using a conformal laser drilling technique and filling the blind hole with an electrically conductive material; (d) forming a circuit pattern from the first electrically conductive layer; (e) forming a first electrically insulating layer on the first electrically conductive layer; (f) forming second via holes through the first electrically insulating layer using a non-conformal laser drilling technique; (g) forming a second electrically conductive layer covering the top surface of the circuit pattern, the first electrically insulating layer, and the side surface of the second via holes by electroplating; (h) forming a second electrically insulating layer on the first electrically conductive layer and filling the second via hole with the same electrically insulating material; (i) removing the second electrically insulating layer and the second electrically conductive layer above the second via hole; (j) forming a third electrically conductive layer on the first electrically insulating layer, wherein the third electrically conductive layer is in contact with the top edges of the second electrically conductive layer remaining on the cylindrical surface of the second via; (k) forming another circuit pattern on the third electrically conductive layer. Steps(e) through (k) can be repeated for more circuit patterns.

Abstract translation: 公开了一种制造高密度多层印刷电路板的方法。 它包括以下步骤：（a）在电介质基片的顶面和底面上形成一对第一导电层; （b）通过所述第一导电层之一形成第一通孔; （c）使用共形激光钻孔技术通过介电基片形成盲孔，并用导电材料填充盲孔; （d）从第一导电层形成电路图案; （e）在第一导电层上形成第一电绝缘层; （f）使用非共形激光钻孔技术通过所述第一电绝缘层形成第二通孔; （g）通过电镀形成覆盖电路图案的顶表面，第一电绝缘层和第二通孔的侧表面的第二导电层; （h）在所述第一导电层上形成第二电绝缘层并用相同的电绝缘材料填充所述第二通孔; （i）在所述第二通孔上方去除所述第二电绝缘层和所述第二导电层; （j）在所述第一电绝缘层上形成第三导电层，其中所述第三导电层与残留在所述第二通孔的圆柱形表面上的所述第二导电层的顶部边缘接触; （k）在第三导电层上形成另一个电路图案。 可以重复步骤（e）至（k）以获得更多的电路图案。