摘要:
A method of manufacturing a metal silicide is disclosed below. A substrate having a first region and a second region is proviced. A silicon layer is formed on the substrate. A planarization process is performed to make the silicon layer having a planar surface. A part of the silicon layer is removed to form a plurality of first gates on the first region and to form a plurality of second gates on the second region. The height of the first gates is greater than the height of the second gates, and top surfaces of the first gates and the second gates have the same height level. A dielectric layer covering the first gates and the second gates is formed and exposes the top surfaces of the first gates and the second gates. A metal silicide is formed on the top surfaces of the first gates and the second gates.
摘要:
A method of manufacturing a metal silicide is disclosed below. A substrate having a first region and a second region is proviced. A silicon layer is formed on the substrate. A planarization process is performed to make the silicon layer having a planar surface. A part of the silicon layer is removed to form a plurality of first gates on the first region and to form a plurality of second gates on the second region. The height of the first gates is greater than the height of the second gates, and top surfaces of the first gates and the second gates have the same height level. A dielectric layer covering the first gates and the second gates is formed and exposes the top surfaces of the first gates and the second gates. A metal silicide is formed on the top surfaces of the first gates and the second gates.
摘要:
A method for chemical-mechanical polishing two adjacent structures of a semiconductor device is provided. The method for mechanical polishing comprising: (a) providing a semiconductor device comprising a recess formed in a surface thereof, a first layer formed over the surface, and a second layer filled with the recess and formed on the first layer; and (b) substantially polishing the first and second layer with a pad and a substantially inhibitor-free slurry, wherein the pad comprising a corrosion inhibitor of the second layer.
摘要:
A chemical mechanical polishing method is disclosed. The method includes forming a film on a wafer having at least one trench structure thereon; polishing the surface of the film by providing a polishing composition to provide a first polished surface; rinsing the first polished surface with a rinse composition to provide a rinsed surface; and polishing the rinsed surface by providing a second polishing composition to provide a second polished surface.
摘要:
An alignment mark is fabricated containing a mark portion and a trench structure. The trench structure surrounds the mark portion and is at a distance from the mark portion. The mark portion has a plurality of notches. Due to the erosion effect caused by the trench structure, it can prevent the residue leave in the notches of the alignment mark.
摘要:
A circuit and method for the display of a high frequency periodic signal on a display (21) having a maximum response frequency less than the periodic signal frequency includes a signal period counter (12) for counting the number of periods in the high frequency periodic signal, a sampling control counter (16) for counting at a frequency substantially greater than the frequency of the high frequency periodic signal, and a comparator (17) for comparing the counts in the signal period counter (12) and the sampling control counter (16) and indicating a match thereof. When a match count is indicated, some electrical parameter of the high frequency periodic signal is sampled and held by a sample and hold circuit (20) until the next match count is indicated, thereby accurately reproducing the high frequency periodic signal at another frequency in a range of frequencies from zero up to and including the maximum response frequencies of the display.
摘要:
A method for color feature extraction extracts a color feature vector representative of the color of each image pixel contained in an image signal. The method comprises: receiving the image signal; mapping the image signal to a color space model, where the color of each of the plural image pixels is represented by a first parameter, a second parameter, and a third parameter; obtaining an adjusted second parameter; clustering the plural image pixels into plural color regions or plural fuzzy regions of a color plane of the color space model; and designating the color feature vector to each of the plural image pixels based on the clustering result.
摘要:
A method for image/video segmentation, capable of segmenting an image signal for obtaining plural texture color feature regions, by utilizing both of the advantages carried by the texture feature and the color feature is disclosed. The method comprises the following steps: (A) receiving an image signal including plural image pixels; (B) executing a Gabor filtering process and a value operation process on each of the plural image pixels; (C) designating each of the plural image pixels a corresponding texture feature vector basing on the result of the value operation process; (D) executing a segmentation process on the image signal basing on the texture feature vector of each of the plural image pixels, for obtaining plural texture feature regions; and (E) executing a re-segmentation process on plural color feature regions basing on the distribution of the plural texture feature regions, for obtaining plural texture color feature regions.
摘要:
Closed loop control may be used to improve uniformity of within wafer uniformity using chemical mechanical planarization. For example, closed loop control may be used to determine a control profile for a chemical mechanical planarization process to more uniformly and consistently achieve the desired extent of variation of within wafer uniformity of a semiconductor wafer.
摘要:
This invention discloses a method for determining an area scaling ratio of an object in a video image sequence. In one embodiment, a centroid of the object is determined. One or more directed straight lines are selected, each passing through the centroid, extending from an end of the object's boundary to an opposite end thereof, and having a direction that is upward. A length scaling ratio for each directed straight line is determined by: determining a motion vector for each selected pixel on the line; computing a scalar component of the motion vector projected onto the line; estimating a change of the line's length according to the scalar components obtained for all pixels; and determining the length scaling ratio according to the change of the line's length. The area scaling ratio is computed based on the length scaling ratios for all directed straight lines.