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    System for wet application of a dry film to a panel
    1.
    发明授权
    System for wet application of a dry film to a panel 失效
    将干膜湿涂到面板上的系统

    公开(公告)号：US5372670A

    公开(公告)日：1994-12-13

    申请号：US190422

    申请日：1994-02-02

    申请人： Michael J. Cummings ,  John M. Griffin ,  Curtis L. Miller

    发明人： Michael J. Cummings ,  John M. Griffin ,  Curtis L. Miller

    IPC分类号： C23F1/00 ,  B32B37/22 ,  H05K3/00 ,  H05K3/06 ,  B32B31/10

    CPC分类号： B32B37/226 ,  B32B37/0038 ,  B32B38/1858 ,  B32B2457/08 ,  H05K3/0079 ,  Y10T156/15 ,  Y10T156/1729 ,  Y10T156/1741 ,  Y10T156/1798

    摘要： A system for wet application of a dry film, such as a photoresist, to a generally planar panel having upper and lower surfaces, such as a printed circuit board, is provided. The apparatus comprises rotatable upper and lower wetting rollers each having an absorbent material such as neoprene on the surface thereof, and a mechanism for holding the upper wetting roller in forcible contact with the lower wetting roller so that rotation of the lower wetting roller is translated into rotation of the upper wetting roller. The lower wetting roller is positioned at least partially within a container providing a supply of wetting agent, such as water, such that the wetting agent is in contact with the absorbent material on the surface of the lower wetting roller. Wetting agent absorbed by the absorbent material on the lower wetting roller is transferred to the absorbent material on the upper wetting roller when the upper and lower wetting rollers are rotated, and wetting agent absorbed by the absorbent material on the upper and lower rollers, respectively, is transferred to the upper and lower surfaces of the panel to wet the surfaces when the panel is drawn through the rollers. A pair of upper and lower film supply rolls are provided for applying layers of film, respectively, on the upper and lower wetted surfaces of the panel, and a pair of upper and lower cure rollers are provided for curing the upper and lower surfaces of the panel having film applied thereon.

    摘要翻译： 提供了一种用于将诸如光致抗蚀剂的干膜湿式施加到具有上表面和下表面的大体平面的面板例如印刷电路板的系统。 该装置包括可旋转的上下湿润辊，每个辊在其表面上具有诸如氯丁橡胶的吸收材料，以及用于将上润湿辊保持与下润湿辊强制接触的机构，使得下润湿辊的旋转被转换成 上部润湿辊的旋转。 下部润湿辊至少部分地位于容器内，提供润湿剂（例如水），使得润湿剂与下部润湿辊的表面上的吸收材料接触。 润湿辊上的吸湿材料吸收的润湿剂分别转移到上润湿辊上的上吸湿辊上的吸收材料上，并且分别在上辊和下辊上被吸收材料吸收的润湿剂， 被转移到面板的上表面和下表面，以便当面板通过辊子拉出时使表面变湿。 提供一对上下胶片供给辊，用于分别在面板的上下湿表面上涂覆薄膜层，并且设置一对上下固化辊，用于固化胶片的上表面和下表面 面板上涂有薄膜。

    Automatic management of associations between users
    4.
    发明申请
    Automatic management of associations between users 审中-公开
    自动管理用户之间的关联

    公开(公告)号：US20090112982A1

    公开(公告)日：2009-04-30

    申请号：US11923498

    申请日：2007-10-24

    申请人： John H. Kuhlmann ,  Alan C. Lindsay ,  Larry A. Setlow ,  Curtis L. Miller

    发明人： John H. Kuhlmann ,  Alan C. Lindsay ,  Larry A. Setlow ,  Curtis L. Miller

    IPC分类号： G06F15/16

    CPC分类号： H04L12/66

    摘要： Automatically associating users of a communication system, without using an invitation or affirmative permission. In one embodiment, a first user submits contact information about a second user to a relationship system, which stores the information in the first user's contact list. Similarly, a second user submits contact information about the first user to the relationship system, which stores the information in the second user's contact list. The relationship system detects the cross reference in the two contact lists, and stores a first degree relationship between the two users. One of the users submits a request to the relationship system to enable an operation with any other user that was associated with the submitting user. Associations can also be selectively higher degrees with other users. The submitting user need not know which other users will participate in the operation, and the other users need not know the submitting user's identity.

    摘要翻译： 自动关联通信系统的用户，而不使用邀请或肯定权限。 在一个实施例中，第一用户将关于第二用户的联系人信息提交给将该信息存储在第一用户的联系人列表中的关系系统。 类似地，第二用户将关于第一用户的联系人信息提交给将该信息存储在第二用户的联系人列表中的关系系统。 关系系统检测两个联系人列表中的交叉引用，并存储两个用户之间的第一度关系。 其中一个用户向关系系统提交请求，以便与与提交用户相关联的任何其他用户启用操作。 其他用户也可以选择性地进行关联。 提交用户不需要知道哪些其他用户将参与该操作，而其他用户不需要知道提交用户的身份。

    Fine pitch circuitization with unfilled plated through holes
    5.
    发明授权
    Fine pitch circuitization with unfilled plated through holes 失效
    精细间距电路与未填充电镀通孔

    公开(公告)号：US06467160B1

    公开(公告)日：2002-10-22

    申请号：US09537960

    申请日：2000-03-28

    申请人： Michael J. Cummings ,  Michael V. Longo ,  Curtis L. Miller ,  Thomas R. Miller ,  Michael Wozniak

    发明人： Michael J. Cummings ,  Michael V. Longo ,  Curtis L. Miller ,  Thomas R. Miller ,  Michael Wozniak

    IPC分类号： H01K310

    CPC分类号： H05K3/427 ,  H05K3/0094 ,  H05K3/064 ,  H05K2201/0959 ,  H05K2203/1394 ,  Y10T29/49128 ,  Y10T29/49165

    摘要： A method of making a circuitized substrate having plated through holes free of filler material is provided. The method includes the steps of providing a dielectric substrate having first and second opposite faces. At least one via hole is formed from one face to the other. A first electrically conductive layer is applied onto the top and bottom faces of the dielectric member and onto the side wall of the via. First layers of photoresist are applied to each layer of conductive material and entering at least partially into the via hole. The first layers of photoresist are selectively exposed and developed to remove all of the photoresist, except that photoresist which is disposed in the via holes. Thereafter, a portion of the faces of the metal coatings on the surfaces of dielectric material and any photoresist remaining in the holes extending above the layers of electrically conductive material are removed to form a planar surface thinner than the thickness of the metal in the through hole. Thereafter, a second layer of photoresist material is applied to both the surfaces of the metal on both faces of the dielectric material and exposed to a desired circuit pattern. Thereafter, the second layers of the photoresist material are developed to reveal the underlying metal which is then etched to form a circuit pattern in the metal layer on both faces. Thereafter, the second layers of the remaining photoresist are stripped and also the photoresist remaining in the hole is stripped, thereby to provide a circuitized substrate with plated through holes having an opening extending from the upper face of the substrate to the lower face of the substrate.

    摘要翻译： 提供了一种制造电路化基板的方法，该基板具有不含填料的电镀通孔。 该方法包括提供具有第一和第二相对面的电介质基板的步骤。 至少一个通孔从一个面到另一个形成。 将第一导电层施加到电介质构件的顶表面和底表面上并通过通孔的侧壁。 将第一层光致抗蚀剂施加到每个导电材料层并且至少部分地进入通孔。 除了设置在通孔中的光致抗蚀剂之外，第一层光致抗蚀剂被选择性地曝光和显影以除去所有光致抗蚀剂。 此后，介电材料表面上的金属涂层表面的一部分和残留在延伸到导电材料层之上的孔中的任何光致抗蚀剂被去除以形成比通孔中的金属厚度更薄的平面 。 此后，将第二层光致抗蚀剂材料施加到电介质材料的两个表面上的金属的两个表面上并暴露于期望的电路图案。 此后，第二层光致抗蚀剂材料被显影以露出下面的金属，然后将其蚀刻以在两面上的金属层中形成电路图案。 此后，残留的光致抗蚀剂的第二层被剥离，并且剥离残留在孔中的光致抗蚀剂，从而为电路化基板提供具有从基板的上表面延伸到基板的下表面的开口的电镀通孔 。