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    WHITE LIGHT EMITTING DEVICE AND WHITE LIGHT SOURCE MODULE USING THE SAME
    2.
    发明申请
    WHITE LIGHT EMITTING DEVICE AND WHITE LIGHT SOURCE MODULE USING THE SAME 有权
    白光发光装置和白光源模块使用相同

    公开(公告)号：US20110242437A1

    公开(公告)日：2011-10-06

    申请号：US13097419

    申请日：2011-04-29

    Applicant: Chul Hee YOO ,  Young June JEONG ,  Young Sam PARK ,  Seong Yeon HAN ,  Ho Yeon KIM ,  Hun Joo HAHM ,  Hyung Suk KIM

    Inventor： Chul Hee YOO ,  Young June JEONG ,  Young Sam PARK ,  Seong Yeon HAN ,  Ho Yeon KIM ,  Hun Joo HAHM ,  Hyung Suk KIM

    IPC: H01J1/62 ,  G02F1/13357 ,  G02F1/1335 ,  G09G5/10 ,  G09G3/36 ,  H04N3/14

    CPC classification number: H05B33/12 ,  C09K11/0883 ,  C09K11/7731 ,  C09K11/7734 ,  F21K9/00 ,  G02F1/133603 ,  G02F1/133609 ,  H01L33/504 ,  Y02B20/181

    Abstract: A white light emitting device including: a blue light emitting diode chip having a dominant wavelength of 443 to 455 nm; a red phosphor disposed around the blue light emitting diode chip, the red phosphor excited by the blue light emitting diode chip to emit red light; and a green phosphor disposed around the blue light emitting diode chip, the green phosphor excited by the blue light emitting diode chip to emit green light, wherein the red light emitted from the red phosphor has a color coordinate falling within a space defined by four coordinate points (0.5448, 0.4544), (0.7079, 0.2920), (0.6427, 0.2905) and (0.4794, 0.4633) based on the CIE 1931 chromaticity diagram, and the green light emitted from the green phosphor has a color coordinate falling within a space defined by four coordinate points (0.1270, 0.8037), (0.4117, 0.5861), (0.4197, 0.5316) and (0.2555, 0.5030) based on the CIE 1931 color chromaticity diagram.

    Abstract translation: 一种白光发射装置，包括：主波长为443〜455nm的蓝色发光二极管芯片; 配置在蓝色发光二极管芯片周围的红色荧光体，由蓝色发光二极管芯片激发的红色荧光体发射红色光; 以及蓝色发光二极管芯片周围的绿色荧光体，由蓝色发光二极管芯片激发的绿色荧光体发出绿色光，其中，从红色荧光体发出的红色光线具有落在由四个坐标 基于CIE1931色度图的点（0.5448,0.4544），（0.7079,0.2905），（0.6427,0.2905）和（0.4794,0.44633），并且从绿色荧光体发射的绿光具有落在限定的空间内的色坐标 基于CIE 1931色度色彩图，分别为四点坐标（0.1270,0.8037），（0.4117,0.5861），（0.4197,0.5316）和（0.2555,0.5030）。

    LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF
    4.
    发明申请
    LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF 有权
    发光二极管封装及其制造方法

    公开(公告)号：US20110031526A1

    公开(公告)日：2011-02-10

    申请号：US12907348

    申请日：2010-10-19

    Applicant: Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

    Inventor： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

    IPC: H01L33/62

    CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    Abstract: An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

    Abstract translation: 一种LED封装及其制造方法。 LED封装包括由热和电导体制成的第一引线框架和第二引线框架，每个引线框架包括平面基座和从基座向相反方向和向上方向延伸的延伸部分。 封装还包括由树脂制成的封装主体，并且被配置为围绕第一引线框架和第二引线框架的延伸部分以固定第一和第二引线框架同时暴露第一引线框架和第二引线框架的下侧表面。 LED封装还包括设置在第一引线框架的基座的上表面上并电连接到第一引线框架和第二引线框架的基座的发光二极管芯片，以及用于封装发光二极管芯片的透明密封剂。

    Chip coated light emitting diode package and manufacturing method thereof
    6.
    发明授权
    Chip coated light emitting diode package and manufacturing method thereof 有权
    芯片涂层发光二极管封装及其制造方法

    公开(公告)号：US07795052B2

    公开(公告)日：2010-09-14

    申请号：US12684578

    申请日：2010-01-08

    Applicant: Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

    Inventor： Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

    IPC: H01L21/00

    CPC classification number: H01L33/62 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.

    Abstract translation: 一种芯片涂覆的LED封装及其制造方法。 芯片涂覆的LED封装包括由安装在基座上的芯片芯片组成的发光芯片和均匀地覆盖芯片裸片的外表面的树脂层。 芯片涂覆的LED封装还包括通过金属线电连接的电极部分，其中至少一个凸块球通过树脂层的上表面暴露。 芯片涂覆的LED封装还包括具有安装在其上的电极部分和发光芯片的封装体。 本发明通过根据照射角度防止色温差异提高光效，提高成品率，使封装体小型化，适应批量生产。

    High power LED package and fabrication method thereof
    7.
    发明授权
    High power LED package and fabrication method thereof 有权
    大功率LED封装及其制造方法

    公开(公告)号：US07626250B2

    公开(公告)日：2009-12-01

    申请号：US11445227

    申请日：2006-06-02

    Applicant: Seon Goo Lee ,  Hun Joo Hahm ,  Jung Kyu Park ,  Kyung Taeg Han ,  Seong Yeon Han ,  Dae Yeon Kim ,  Young Sam Park

    Inventor： Seon Goo Lee ,  Hun Joo Hahm ,  Jung Kyu Park ,  Kyung Taeg Han ,  Seong Yeon Han ,  Dae Yeon Kim ,  Young Sam Park

    IPC: H01L23/495

    CPC classification number: H01L33/642 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.

    Abstract translation: LED二极管封装包括用于在其上表面上安装发光部分的热连接部分，同时保持热连接部分电连接到发光部分的框架和将热连接部分和框架固定在一起的模制部件。 发光部分响应于施加到其上的电流产生光，并且热连接部分的上表面超过模制部件的上表面突出到预定高度。 这可以优化光源的唯一光束角度，从而使照明效率最大化，并且防止在透镜的组装过程中封装材料的溢出，否则可能会污染相邻的部件。

    Light emitting diode package with metal reflective layer and method of manufacturing the same
    10.
    发明申请
    Light emitting diode package with metal reflective layer and method of manufacturing the same 有权
    具有金属反射层的发光二极管封装及其制造方法

    公开(公告)号：US20080233666A1

    公开(公告)日：2008-09-25

    申请号：US12153719

    申请日：2008-05-23

    Applicant: Jung Kyu Park ,  Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

    Inventor： Jung Kyu Park ,  Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

    IPC: H01L33/00

    CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: The invention relates to an LED package having a metal reflective layer for focusing and emitting light through a side of the package, and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, a light emitting diode chip disposed on the substrate, and an encapsulant covering the LED chip and the substrate to protect the LED chip. The LED package also includes a metal reflective layer surrounding side surfaces of the encapsulant to form a light transmitting surface on a top surface of the encapsulant. The invention minimizes light loss, improves luminance, can be mass-produced as a PCB type, and adopts EMC transfer molding to minimize irregular color distribution, thereby improving optical quality.

    Abstract translation: 本发明涉及一种具有用于聚焦并通过封装侧发光的金属反射层的LED封装及其制造方法。 LED封装包括其上形成有电极的基板，设置在基板上的发光二极管芯片以及覆盖LED芯片和基板的密封剂以保护LED芯片。 LED封装还包括围绕密封剂的侧表面的金属反射层，以在密封剂的顶表面上形成透光表面。 本发明使光损失最小化，亮度提高，可以作为PCB类型批量生产，并采用EMC传递模塑，以减少不规则的颜色分布，从而提高光学质量。

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