Oxidative top electrode deposition process, and microelectronic device structure
    1.
    发明申请
    Oxidative top electrode deposition process, and microelectronic device structure 审中-公开
    氧化顶电极沉积工艺和微电子器件结构

    公开(公告)号:US20060108623A1

    公开(公告)日:2006-05-25

    申请号:US11324692

    申请日:2005-12-31

    IPC分类号: H01L29/94

    摘要: A method of preventing oxygen deficiency in a ferroelectric or high ε film material having a top electrode layer deposited thereon. Process conditions are employed that either enable the top electrode layer to be formed without oxygen abstraction from the ferroelectric or high ε film material in the vicinity and at the top surface thereof, or else provide the ferroelectric or high ε film material in the vicinity and at the top surface thereof with a surplus of oxygen. In the latter case, the deposition formation of the top electrode layer on the ferroelectric or high ε film material depletes the over-stoichiometric excess of the oxygen in the film material, to yield a device structure including an electrode on a film material having a proper stoichiometry, e.g., of PbZrTiO3.

    摘要翻译: 一种防止在其上沉积有顶电极层的铁电或高ε膜材料中的缺氧的方法。 采用这样的工艺条件,即使顶部电极层能够形成,而不会在附近和其顶部表面处从铁电或高ε薄膜材料中抽出氧,或者在邻近和在其顶部提供铁电或高ε薄膜材料 其顶部表面具有多余的氧气。 在后一种情况下,在铁电或高ε薄膜材料上的顶部电极层的沉积形成消耗了薄膜材料中超过化学计量的过量的氧,从而产生一种器件结构,该器件结构包括具有适当的薄膜材料的电极 化学计量,例如PbZrTiO 3 3。